中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

495 records (took 0.018 seconds)

    电气接线箱
    42.
    发明公开
    电气接线箱 失效

    公开(公告)号：CN1985421A

    公开(公告)日：2007-06-20

    申请号：CN200580023393.7

    申请日：2005-05-24

    Applicant: 住友电装株式会社

    Inventor： 早川达也 ,  冈达也

    IPC: H02G3/16

    CPC classification number: H05K7/026 ,  H01R9/2425 ,  H01R9/2466 ,  H05K1/144 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10659

    Abstract: 三个电路板容纳在壳体中，并且用于连接该三个印刷电路板的中继连接器(10)安装在第二印刷电路板(50)的中间位置上。中继连接器(10)设置有在竖直方向上较长的第一端子容纳部(14)以及第二端子容纳部(15)。中继连接器经由容纳在第一端子容纳部(14)中的较长第一中继端子(20)将在上部位置的第一印刷电路板(40)的端子销(41)与在下部位置的第三印刷电路板(60)的端子销(61)连接，同时经由容纳在第二端子容纳部(15)中的较短第二中继端子(21)将第一印刷电路板的端子销(42)和/或第三印刷电路板的端子销与第二印刷电路板的导体(53)连接。

    INTEGRATED SEMICONDUCTOR OUTLINE PACKAGE
    46.
    发明申请
    INTEGRATED SEMICONDUCTOR OUTLINE PACKAGE 审中-公开
    集成半导体外形封装

    公开(公告)号：WO2008069755A1

    公开(公告)日：2008-06-12

    申请号：PCT/SG2006/000379

    申请日：2006-12-05

    Applicant: INFINEON TECHNOLOGIES AG ,  JOB DORAISAMY, Stanley ,  YONG, Wae Chet

    Inventor： JOB DORAISAMY, Stanley ,  YONG, Wae Chet

    IPC: H01L23/495

    CPC classification number: H05K1/18 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10659 ,  H01L2924/00

    Abstract: A transistor outline (TO) package (12) is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board (PCB) and a bus bar of such a module. The package comprises a package housing (14), having a first end (14b) suitable for mounting to a PCB and which has a width (w). The package is also formed with a leadframe which comprises a heat sink and ground plane blade (116) suitable for connection a bus bar, a plurality of connector leads (18) suitable for connection to a PCB and at least one source tab lead (206) suitable for connection to a module connector (10) of such a control module. The plurality of connection leads (18) and the source tab lead (206) extend from the first end (14b) of. the package housing side by side in the direction (D) along and within the width (w) of the first end of the package housing.

    Abstract translation: 为适用于汽车的控制模块的半导体集成器件提供晶体管轮廓（TO）封装（12），用于连接印刷电路板（PCB）和这种模块的母线。 该封装包括一个封装外壳（14），该封装外壳具有一个第一端（14b），该第一端（14b）适于安装到一个PCB上并具有宽度（w）。 封装还形成有引线框架，该引线框架包括散热器和接地平面叶片（116），该散热器和接地平面叶片适于连接汇流条，适于连接到PCB的多个连接器引线（18）和至少一个源极引线（206 ）适于连接到这种控制模块的模块连接器（10）。 多个连接引线（18）和源极引线（206）从第一端（14b）延伸。 所述包装容器沿着所述包装壳体的第一端的宽度（w）并沿所述方向（D）并排。

    SURFACE MOUNTABLE INTEGRATED CIRCUIT PACKAGE
    48.
    发明申请
    SURFACE MOUNTABLE INTEGRATED CIRCUIT PACKAGE 审中-公开
    表面安装集成电路封装

    公开(公告)号：WO1993019488A1

    公开(公告)日：1993-09-30

    申请号：PCT/US1993002042

    申请日：1993-03-05

    Applicant: NATIONAL SEMICONDUCTOR CORPORATION

    Inventor： NATIONAL SEMICONDUCTOR CORPORATION ,  LEVIT, Boris

    IPC: H01L23/50

    CPC classification number: H01L23/49555 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/09709 ,  H05K2201/10659 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A surface-mountable integrated circuit package having leads arranged in a manner enabling the package to be manufactured with high yield but with reduced pitch between adjacent leads. The circuit package of the invention includes a body (60), and alternating first and second sets (62 and 68) of leads connected along an edge of the body. Each lead (68) in the first set is formed so that its tip extends a first distance from the body. Each lead (66) in the second set is formed so that its tip extends a second distance (substantially different than the first distance) from the body. Even if the leads are mounted with very small pitch, the separation of the tips of adjacent leads will be substantially greater than the pitch. For this reason, the package can be manufactured with high yield and reduced pitch, and shipped with formed leads with only a low risk that the leads will be accidentally bent into electrical contact with each other and without the need to enclose individual packages in individual protective cases for shipment. In a preferred embodiment, the invention includes a first set of leads having a gull-wing configuration alternating with a second set of leads having a J-bend configuration (91). In another preferred embodiment, leads having a gull-wing configuration alternate with leads having an L-bend configuration (101).

    Abstract translation: 一种可表面安装的集成电路封装，其具有以能够以高产量制造封装的方式布置的引线，但是相邻引线之间的间距减小。 本发明的电路封装包括主体（60）和交替的沿主体边缘连接的引线的第一和第二组（62和68）。 第一组中的每个引线（68）形成为使得其尖端从主体延伸第一距离。 第二组中的每个引线（66）形成为使得其尖端与主体延伸第二距离（与第一距离基本不同）。 即使引线以非常小的间距安装，相邻引线的尖端的分离将显着大于间距。 因此，可以以高产量和减小的间距制造包装，并且以成形导线运输，只有低风险，引线将被意外地弯曲成彼此电接触，而不需要将单个包装封装在单独的保护 出货情况。 在优选实施例中，本发明包括具有与具有J形弯曲构型（91）的第二组引线交替的鸥翼构型的第一组引线。 在另一优选实施例中，具有鸥翼构型的引线与具有L形弯曲构型（101）的引线交替。

Patent Agency Ranking