公开(公告)号：US20070117453A1

公开(公告)日：2007-05-24

申请号：US11624409

申请日：2007-01-18

Applicant: Slobadan Pavlovic

Inventor： Slobadan Pavlovic

IPC: H01R13/66

CPC classification number: H01R43/0256 ,  H01R4/023 ,  H01R13/41 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface mount electrical connector includes a terminal body having a first elongate member that cooperates with a housing to secure the terminal body to the connector housing. A second elongate member of the terminal body includes a curved portion having an aperture therethrough. The curved portion includes a convex surface that facilitates automated assembly operations, and the aperture helps to overcome surface tension in liquid solder, thereby promoting a secure electrical connection.

Abstract translation: 表面安装电连接器包括终端主体，其具有与壳体配合的第一细长构件，以将终端主体固定到连接器壳体。 终端主体的第二细长构件包括具有穿过其中的孔的弯曲部分。 弯曲部分包括有助于自动组装操作的凸面，并且该孔有助于克服液体焊料中的表面张力，由此促进安全的电连接。

公开(公告)号：US20050012187A1

公开(公告)日：2005-01-20

申请号：US10892483

申请日：2004-07-16

Applicant: Koujiro Kameyama ,  Kiyoshi Mita

Inventor： Koujiro Kameyama ,  Kiyoshi Mita

IPC: H01L23/12 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H05K3/34 ,  H01L21/48 ,  H01L31/11

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.

Abstract translation: 半导体器件包括半导体元件和电连接到半导体元件的电极，半导体元件和电极被具有绝缘性能的密封剂密封，电极暴露在通过接合剂连接到安装表面上 外部安装电路板，其中电极被成形为使得当安装表面经由接合剂连接到安装电路板时，接合剂可以从围绕安装表面的侧表面可视地识别。

公开(公告)号：US20030098339A1

公开(公告)日：2003-05-29

申请号：US10340798

申请日：2003-01-13

Inventor： Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

IPC: B23K001/00 ,  B23K031/00 ,  B23K031/02

CPC classification number: H05K3/363 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10772 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/065

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract translation: 形成在柔性印刷电路板上的焊盘通过焊料与刚性印刷电路板上形成的焊盘电连接。 此时，在刚性印刷电路板上的相邻的两个焊盘之间形成阻焊剂，并且端接有刚性印刷电路板和柔性印刷电路板之间的端部。 因此，即使剩余焊料被挤出到刚性印刷电路板上，阻焊剂也可以防止在焊盘之间形成焊料桥。

公开(公告)号：US6159045A

公开(公告)日：2000-12-12

申请号：US173377

申请日：1998-10-15

Applicant: Brian R. Vicich

Inventor： Brian R. Vicich

IPC: H01R12/55 ,  H01R13/73 ,  H05K3/34 ,  H02B1/01

CPC classification number: H05K3/3447 ,  H01R12/707 ,  H05K2201/09045 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598 ,  H05K2201/10772

Abstract: A method and apparatus for engaging electrical components to a circuit board. The body of the component has at least one fastener integrally formed therewith. The at least one fastener includes a neck portion engaged to the body of the component and extending to a hook portion. The fastener is configured to reside substantially within a through-hole formed in a circuit board. The through-hole in the circuit board has a solder lining, and the fastener is placed into the through-hole. The solder is reflowed via known soldering techniques so that the hook portion of the fastener is engaged by the reflowed solder, thus engaging the component to the circuit board.

Abstract translation: 一种用于将电气部件接合到电路板的方法和装置。 该部件的主体具有与其一体形成的至少一个紧固件。 所述至少一个紧固件包括接合到所述部件的主体并延伸到钩部的颈部。 紧固件构造成基本上位于形成在电路板中的通孔内。 电路板中的通孔具有焊接衬垫，并且紧固件被放置在通孔中。 焊料通过已知的焊接技术回流，使得紧固件的钩部分被回流的焊料接合，从而将部件接合到电路板。

公开(公告)号：US5688150A

公开(公告)日：1997-11-18

申请号：US512508

申请日：1995-08-08

Applicant: Jack Seidler ,  Leonard J. Pollock

Inventor： Jack Seidler ,  Leonard J. Pollock

IPC: H01R4/02 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01R12/57 ,  H01R43/0256 ,  H05K3/3405 ,  H05K3/3426 ,  H01R4/02 ,  H05K2201/10386 ,  H05K2201/10772 ,  H05K2201/10984 ,  H05K3/3478 ,  Y02P70/613

Abstract: A solder-bearing metallic lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a substrate or other conductive pad.

Abstract translation: 一种含焊料的金属引线及其制造和使用方法，其中引线形成有焊料保持部分，该焊料保持部分具有可以为V形或扁平的底切的截面轮廓，其中焊料围绕所述 焊料保持部分和底切部分，并且从引线向外延伸，同时留下未被焊料覆盖的引线的一部分，以允许引线金属与衬底或其它导电焊盘形成直接接触。

公开(公告)号：US5351393A

公开(公告)日：1994-10-04

申请号：US913880

申请日：1992-07-15

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01L23/495 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H05K1/141 ,  H01L2924/0002 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49135 ,  Y10T29/4914

Abstract: A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.

Abstract translation: 具有布置的引脚格栅阵列的表面贴装集成电路转换器板组件能够安装常规的表面安装引线装置以便随后附接到印刷电路板。 转换器板组件包括排列成行和列的用于安装的间隔开的销的阵列，以及与之连接的多个间隔开的销垫。 引脚垫足够间隔开以避免干扰。 一组表面安装引线焊盘是转换器板的一部分，并通过多个引线与引脚阵列互连。 制造具有表面贴装集成电路器件的转换器板的方法包括将器件的引线形成或重整以与表面安装焊盘对准。

公开(公告)号：US4340901A

公开(公告)日：1982-07-20

申请号：US105964

申请日：1979-12-21

Applicant: Shinzo Anazawa ,  Hideaki Kozu

Inventor： Shinzo Anazawa ,  Hideaki Kozu

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/057 ,  H01L23/498 ,  H01L23/66 ,  H05K3/34 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/057 ,  H01L23/66 ,  H05K3/3405 ,  H01L2924/0002 ,  H05K2201/1034 ,  H05K2201/10772 ,  H05K3/3421

Abstract: An improved brazing structure is disclosed in which at least a tip end portion to be brazed of a lead is bent and this tip end portion is bonded to a metallized layer by a brazing material substantially in perpendicular to the plane of the metallized layer.

Abstract translation: 公开了一种改进的钎焊结构，其中待钎焊的引线的至少末端部分被弯曲，并且该顶端部分通过基本上垂直于金属化层的平面的钎焊材料结合到金属化层。

公开(公告)号：EP1758208B1

公开(公告)日：2008-03-12

申请号：EP06017087.5

申请日：2006-08-16

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Nakano, Hiroshi

IPC: H01R12/18

CPC classification number: H05K3/341 ,  H01R12/707 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613

公开(公告)号：EP1670299A3

公开(公告)日：2006-08-09

申请号：EP05025697.3

申请日：2005-11-24

Applicant: DENSO CORPORATION

Inventor： Oonishi, Jun

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface-mounted electronic component (10) has an outer lead (12) extending from a package (11) for connection to a circuit pattern (21) on a printed circuit board (20) by using a connecting member (30). The outer lead (12) has a hole (12b) having an opening at least on a connecting member (30) facing side in a portion (12a) of the outer lead (12) for connecting the outer lead (12) to the circuit pattern (21).

Abstract translation: 表面安装型电子元件（10）具有通过使用连接构件（30）从用于连接到印刷电路板（20）上的电路图案（21）的封装（11）延伸的外引线（12）。 外引线（12）具有至少在外引线（12）的一部分（12a）中的面对侧的连接构件（30）上具有开口的孔（12b），用于将外引线（12）连接到电路 模式（21）。

公开(公告)号：EP1670299A2

公开(公告)日：2006-06-14

申请号：EP05025697.3

申请日：2005-11-24

Applicant: DENSO CORPORATION

Inventor： Oonishi, Jun

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface-mounted electronic component (10) has an outer lead (12) extending from a package (11) for connection to a circuit pattern (21) on a printed circuit board (20) by using a connecting member (30). The outer lead (12) has a hole (12b) having an opening at least on a connecting member (30) facing side in a portion (12a) of the outer lead (12) for connecting the outer lead (12) to the circuit pattern (21).

Abstract translation: 表面安装的电子部件（10）具有从用于连接到印刷电路板（20）上的电路图案（21）的封装（11）延伸的外引线（12），通过使用连接部件（30）。 外引线（12）具有至少在外引线（12）的部分（12a）中的连接构件（30）面向侧上具有开口的孔（12b），用于将外引线（12）连接到电路 图案（21）。