公开(公告)号：US11924960B2

公开(公告)日：2024-03-05

申请号：US16767951

申请日：2018-11-08

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Akira Haraguchi

IPC: H05K1/02 ,  H01L23/367 ,  H05K1/18 ,  H05K3/00 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01L23/367 ,  H05K1/18 ,  H05K3/007 ,  H05K7/2039 ,  H05K2201/10166 ,  H05K2201/10916

Abstract: Provided is a circuit board on which a circuit component is mounted on one side, and a recess is formed at a position corresponding to the circuit component on the other side, and the circuit board includes a first heat conductive member that is provided inside the recess and conducts heat generated by the circuit component.

公开(公告)号：US20190245307A1

公开(公告)日：2019-08-08

申请号：US16255829

申请日：2019-01-24

Applicant: YUEQING HONGCHANG RADIO CO., LTD.

Inventor： Xiao-Ming Zheng

IPC: H01R13/648 ,  H05K1/02 ,  H05K1/18 ,  H01R13/50 ,  H01R24/76

CPC classification number: H01R13/648 ,  H01R12/58 ,  H01R12/707 ,  H01R13/50 ,  H01R24/76 ,  H01R2103/00 ,  H05K1/0215 ,  H05K1/184 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10325 ,  H05K2201/10916

Abstract: A grounding structure for power socket includes a grounding main body, which consists of a basic section, a first connecting section, a second connecting section, a grounding section and a contact section. The first and the second connecting section are separately downward extended from two opposite ends of the basic section, such that the basic section and the first and second connecting sections together define a receiving space in between them. The contact section is downward extended from a side edge of the basic section into the receiving space; and the first connecting section is outward bent at its lower end to form the grounding section. And, the grounding section is provided at an outer end with a grounding opening.

公开(公告)号：US20130168722A1

公开(公告)日：2013-07-04

申请号：US13525368

申请日：2012-06-18

Applicant: CHIH-CHEN LAI

Inventor： CHIH-CHEN LAI

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L33/486 ,  H01L24/48 ,  H01L33/62 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10916 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00012

Abstract: An SMT LED device includes an LED and a circuit board carrying the LED. The circuit board has two copper pads thereon, each being provided with a solder on an inner later side thereof which faces the other copper pad. The LED includes two pins and each pin includes a horizontal protrusion and a vertical portion. The LED is mounted on the circuit board between the two copper pads. The solders securely and electrically connect the two pins of the LED with the circuit board.

Abstract translation: SMT LED器件包括LED和携带LED的电路板。 电路板上有两个铜焊盘，每个在其后面的侧面上设置有面对另一个铜焊盘的焊料。 LED包括两个引脚，每个引脚包括水平突起和垂直部分。 LED安装在两个铜焊盘之间的电路板上。 焊料将LED的两个引脚与电路板牢固地电连接。

公开(公告)号：US20090016039A1

公开(公告)日：2009-01-15

申请号：US11813525

申请日：2006-01-13

Applicant: Takashi Imamura

Inventor： Takashi Imamura

IPC: H05K9/00 ,  H05K3/34

CPC classification number: H05K9/0028 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/10371 ,  H05K2201/10916 ,  Y10T29/49142

Abstract: A structure for attachment of a shield case to a circuit board. Electronic components are mounted at one face of the circuit board. The shield case is for covering the electronic components and blocking electromagnetic waves. The attachment structure includes toe portions, formed to protrude from the shield case, and holes formed in the circuit board, at which the toe portions can be inserted. The toe portions are fixed to the circuit board by being inserted into the holes and soldered to soldering lands at the other face of the circuit board. Thus, it is possible to prevent solder balls and solder flux entering the shield case, it is further possible to reserve space for soldering lands, with sizes that are required for fixing of the shield case, at a rear face of the circuit board, and it is possible to attach the shield case to the circuit board strongly.

Abstract translation: 用于将屏蔽壳附接到电路板的结构。 电子部件安装在电路板的一个面上。 屏蔽盒用于覆盖电子元件并阻塞电磁波。 安装结构包括形成为从屏蔽壳突出的趾部和形成在电路板中的孔，趾部可插入该趾部。 脚趾部分通过插入孔中固定到电路板上，并焊接到电路板另一面的焊接区域。 因此，可以防止焊球和焊剂进入屏蔽壳体，进一步可能在电路板的背面保留用于固定屏蔽壳体所需的尺寸的焊盘的空间，以及 可以将屏蔽盒牢固地连接到电路板。

公开(公告)号：US07419084B2

公开(公告)日：2008-09-02

申请号：US10997587

申请日：2004-11-24

Applicant: Hendrikus A. A. Verheijen

Inventor： Hendrikus A. A. Verheijen

IPC: B23K31/02

CPC classification number: H05K3/341 ,  B23K1/085 ,  B23K2101/42 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10916 ,  H05K2201/10962 ,  H05K2203/1476 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method for surface mount solder of a comparatively large component is provided wherein a first intermediate component is soldered to a printed wring board and a larger second component is positioned and soldered to the printed wiring board using the intermediate component. An electrical contact made this way is covered as well as its use in an electrostatographic printer.

Abstract translation: 提供了一种较大部件的表面贴装焊料的方法，其中将第一中间部件焊接到印刷绞合板上，并且使用中间部件将较大的第二部件定位并焊接到印刷线路板。 以这种方式制造的电接触器以及其在静电打印机中的使用被覆盖。

公开(公告)号：US07355832B2

公开(公告)日：2008-04-08

申请号：US10888472

申请日：2004-07-09

Applicant: Senthil Kumar Sundaram ,  Rohini Krishnamoorthy ,  Cariappa Achappa Baduvamanda

Inventor： Senthil Kumar Sundaram ,  Rohini Krishnamoorthy ,  Cariappa Achappa Baduvamanda

IPC: H02H3/22

CPC classification number: H05K1/0257 ,  H05K3/3447 ,  H05K2201/10916 ,  H05K2201/10977

Abstract: Methods and arrangements for reducing partial discharges on a printed circuit board are provided. A method of reducing partial discharge in a printed circuit board includes providing a conducting surface coupled to a component under at least one of electrical and thermal stress, wherein the conducting surface is a metallic plate.

Abstract translation: 提供了用于减少印刷电路板上的局部放电的方法和装置。 一种减少印刷电路板中的局部放电的方法包括在电应力和热应力中的至少一种下提供耦合到部件的导电表面，其中导电表面是金属板。

公开(公告)号：US4984130A

公开(公告)日：1991-01-08

申请号：US512631

申请日：1990-04-12

Applicant: Helmut L. Dull ,  Horst W. Flunkert

Inventor： Helmut L. Dull ,  Horst W. Flunkert

IPC: H01G4/248 ,  H01C1/148 ,  H01C17/00 ,  H01F27/29 ,  H01G2/06 ,  H05K3/34

CPC classification number: H01G2/065 ,  H01C1/148 ,  H01C17/006 ,  H01F27/292 ,  H05K3/3442 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

Abstract: A passive electric component suitable for SMD-technique and having a cylindrical supporting member or a supporting member in the form of a rectangular parallelepiped and having electric connection elements at its ends which surround the supporting member in the form of a tube and do not cover the end faces of the supporting member.

Abstract translation: 一种适用于SMD技术的无源电气元件，具有圆柱形支撑构件或呈长方体形式的支撑构件，其端部具有围绕支撑构件的管状电连接元件，并且不覆盖 支撑构件的端面。

公开(公告)号：US3745513A

公开(公告)日：1973-07-10

申请号：US3745513D

申请日：1971-12-13

Applicant: SINGER CO

Inventor： GROSS R

IPC: H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H01R9/06

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/1059 ,  H05K2201/10916 ,  H05K2201/10962 ,  Y02P70/611

Abstract: This invention describes a form of electrical connector to be used on printed circuit board assemblies which provides mechanical isolation from the effects of dynamic loading due to the different thermal expansions of the printed circuit board and the component leads and/or vibration. This is done by soldering a first loop of the connector to the printed circuit board and soldering the second loop of the connector to the component lead, and two loops being interconnected by a flexible member which minimizes force applied to the solder joint under dynamic loading conditions.

Abstract translation: 本发明描述了一种在印刷电路板组件上使用的电连接器的形式，其提供了由于印刷电路板和部件引线和/或振动的不同热膨胀而引起的动态负载的影响的机械隔离。 这通过将连接器的第一环焊接到印刷电路板并将连接器的第二环焊接到部件引线上来实现，并且两个环通过柔性构件互连，其在动态负载条件下最小化施加到焊点的力 。

公开(公告)号：US3535769A

公开(公告)日：1970-10-27

申请号：US3535769D

申请日：1969-05-23

Applicant: BURROUGHS CORP

Inventor： GOLDSCHMIED SANDOR

IPC: B23K1/00 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K1/001 ,  H05K3/3447 ,  H05K2201/0215 ,  H05K2201/1031 ,  H05K2201/10916 ,  H05K2203/0415 ,  Y02P70/611 ,  Y10T29/49149

公开(公告)号：US3528173A

公开(公告)日：1970-09-15

申请号：US3528173D

申请日：1966-08-15

Applicant: ANDREW S GALL

Inventor： GALL ANDREW S

IPC: H01R12/71 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R43/00 ,  H05K3/00

CPC classification number: H05K3/4046 ,  H01R12/58 ,  H05K1/118 ,  H05K3/306 ,  H05K3/326 ,  H05K3/34 ,  H05K3/3447 ,  H05K3/4092 ,  H05K2201/091 ,  H05K2201/10295 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10916 ,  Y10T29/49142 ,  Y10T29/49167