Abstract:
Disclosed is a nanostructured light emitting device. The disclosed light emitting device includes a first-type semiconductor layer; multiple nanostructures which are formed on the first-type semiconductor layer and have a nanocore, an active layer which surrounds the surface of the nanocore, and a second-type semiconductor layer; an electrode layer which surrounds the nanostructures; and multiple resistance layers which are formed on the electrode layer and include the nanostructures respectively.
Abstract:
A nano-structured light-emitting device is disclosed. The disclosed nano-structured light-emitting device includes a first semiconductor layer; a nano-structure which is mounted on the first semiconductor layer, includes a nano-core, an active layer on the surface of the nano-core, and a second semiconductor layer, and has a flat upper portion; a conductive layer which covers the side surface of the nano-structure; a first electrode which is electrically connected to the first semiconductor layer; and a second electrode which is electrically connected to the conductive layer.
Abstract:
발광소자 및 그 제조방법에 관해 개시되어 있다. 개시된 발광소자는 복수의 수직형 발광구조체와 상기 발광구조체 각각의 적어도 일부를 감싸는 보호층 및 상기 발광구조체들 사이의 공간을 메우는 절연층을 포함할 수 있다. 상기 보호층은 플라즈마의 침투를 방지(억제)하는 물질을 포함할 수 있다. 일례로, 상기 보호층은 알루미늄 산화물을 포함할 수 있다. 상기 절연층(즉, 충전 절연층)은 건식 공정으로 증착된 층일 수 있다. 상기 발광소자의 제조방법은 복수의 수직형 발광구조체를 형성하는 단계, 상기 복수의 수직형 발광구조체를 감싸는 것으로 플라즈마의 침투를 방지하는 보호층을 형성하는 단계, 상기 보호층 상에 상기 발광구조체들 사이의 공간을 메우는 절연층을 형성하는 단계, 상기 절연층의 상층부를 플라즈마를 이용하는 건식 식각 방법으로 제거하여 상기 보호층의 일부를 노출시키는 단계 및 상기 노출된 보호층 부분을 제거하는 단계를 포함할 수 있다.
Abstract:
Disclosed is a light emitting device including a dielectric reflector. The disclosed light emitting device includes a first conductive semiconductor layer which is formed on a substrate, a mask layer which includes a plurality of holes and is formed on the first conductive semiconductor layer, a plurality of vertical light emitting structures which are vertically grown on the first conductive semiconductor layer through the holes, a current diffusion layer which surrounds the vertical light emitting structures on the first conductive semiconductor layer, and the dielectric reflector which is formed on the current diffusion layer and fills a space between the current diffusion layers. The dielectric reflector includes pairs of dielectric layers with different refractive indexes.
Abstract:
According to an embodiment of the present invention, the present invention provides a light emitting device which minimizes the number of times that light emitted sideward from a vertical light emitting device passes through a light absorption member and improves light emitting efficiency by comprising; a lower layer; multiple vertical light emitting structures placed on the lower layer; a conductive member surrounding at least a part of the multiple vertical light emitting structures; and multiple reflection members which are arranged between the multiple vertical light emitting structures and reflect the light emitted sideward from the multiple vertical light emitting structures.
Abstract:
PURPOSE: A light emitting device and a method for manufacturing the same are provided to effectively prevent a leakage current by forming a protection layer made of an insulating material such as aluminum oxide. CONSTITUTION: A vertical type light emitting structure (N10) is formed on a lower layer. A protection layer (600) surrounds the lower end of the light emitting structure. The protection layer includes a material for preventing the penetration of plasma. The protection layer includes aluminum oxide. An insulating layer (650) is in contact with the protection layer and filled between the light emitting structures. [Reference numerals] (AA) Dry etching
Abstract:
PURPOSE: A nanorod light emitting device and a manufacturing method thereof are provided to reduce power consumption by decreasing a leakage current using an electrode of a grid pattern. CONSTITUTION: A nanorod cluster(30) covers light emitting nanorods(26) with conductors. A filling layer(33) is laminated on the nanorod clusters. An electrode(40) is formed on the filling layer and includes a grid pattern. A connection part connects the conductors to a first electrode.