公开(公告)号：KR1020030047341A

公开(公告)日：2003-06-18

申请号：KR1020010077810

申请日：2001-12-10

Applicant: 삼성전자주식회사

Inventor： 이태원 ,  홍형식 ,  하도선 ,  윤명식 ,  금경수

IPC: H01L21/265

CPC classification number: H01L21/6831

Abstract: PURPOSE: An electrostatic chuck of an ion implanter is provided to be capable of semipermanently connecting between a platen and a base and easily replacing with each other by using a mechanical connecting part. CONSTITUTION: A wafer is fixed by an electrostatic chuck(200) in an ion implanter under an ion implanting process. The electrostatic chuck(200) is provided with a base(210), a platen(230) installed on the base(210) for fixedly loading the wafer, and a mechanical connecting part(220) for mechanically fixing the platen(230) on the base(210). The mechanical connecting part further includes a fixing part(222) located at the edge portion of the platen(230) and a connecting bolt(224) for fixing between the fixing part(222) and the base(210). Preferably, a plurality of platens(230) are used.

Abstract translation: 目的：提供离子注入机的静电卡盘，以便能够在压板和基座之间进行半永久性连接，并且可以通过使用机械连接部件彼此容易地更换。 构成：在离子注入过程中，通过静电卡盘（200）在离子注入机中固定晶片。 静电卡盘（200）设置有基座（210），安装在基座（210）上用于固定地装载晶片的压板（230）和用于将压板（230）机械地固定在其上的机械连接部件 基座（210）。 机械连接部还包括位于压板（230）的边缘部分的固定部分（222）和用于固定在固定部分（222）和基部（210）之间的连接螺栓（224）。 优选地，使用多个压板（230）。

公开(公告)号：KR1020020085980A

公开(公告)日：2002-11-18

申请号：KR1020010025554

申请日：2001-05-10

Applicant: 삼성전자주식회사

Inventor： 금경수 ,  양윤식 ,  홍형식 ,  안금찬 ,  윤해근 ,  정병식 ,  최기철

IPC: G01B5/004

CPC classification number: H01L21/68 ,  H01J2237/20292 ,  H01J2237/31701

Abstract: PURPOSE: A reference angle supply apparatus is provided to minimize process error caused due to the movement of the apparatus, by accurately setting an object for measurement on the basis of a reference angle. CONSTITUTION: A reference angle supply apparatus(30) comprises a main body(300); pin gauges(310) protruded from the surface of an end of the main body, at portions set by X-axis coordinates and Y-axis coordinates, respectively. Each of pin gauges contacts surface of an object for measurement, and supplies a preset reference angle, to thereby correct the object by the preset reference angle. The apparatus further comprises a main body support(320) for supporting the main body, and which has a horizontal guide(320a) for moving the main body in a horizontal direction when pin gauges contact the object for measurement. The main body support has a surface which is processed to have a uniformity of 1 micron meter or smaller, such that the pin gauge is substantially parallel to a bottom of a chamber.

Abstract translation: 目的：提供一种参考角度供给装置，用于通过基于参考角准确地设定用于测量的物体来最小化由于装置的移动而引起的处理误差。 构成：参考角供给装置（30）包括主体（300）; 分别从X轴坐标和Y轴坐标设定的部分从主体的端部的表面突出的销量规（310）。 每个针规与物体的表面接触测量，并提供预设的参考角度，从而通过预设的参考角度校正物体。 该装置还包括用于支撑主体的主体支撑件（320），并且当销量与接触物体接触以进行测量时，该主体支撑件（320）具有用于沿水平方向移动主体的水平导向件（320a）。 主体支撑具有被加工成具有1微米或更小的均匀度的表面，使得销规与基座平行。

公开(公告)号：KR1020020071404A

公开(公告)日：2002-09-12

申请号：KR1020010011540

申请日：2001-03-06

Applicant: 삼성전자주식회사

Inventor： 홍형식 ,  신동화 ,  민병호 ,  최재흥

IPC: H01L21/027

CPC classification number: G03F7/2026

Abstract: PURPOSE: A method for exposing a peripheral part of wafer and apparatus for performing the same are provided to perform an accurate exposing process for the peripheral part of the wafer on which photoresist is coated. CONSTITUTION: A wafer(W) is loaded on a wafer chuck(30). A photoresist layer(32) is formed on an upper portion of the wafer(W). A photoresist pattern is formed by exposing the photoresist layer(32). The photoresist layer(32) of a circumference part of the wafer(W) is partially removed by injecting a cleaning solution including acetone to the peripheral part when the photoresist layer(32) is formed on the upper portion of the wafer(W). The first drive portion(34) is connected with the wafer chuck(30) in order to drive the wafer chuck(30). The first drive portion(34) has a rotary shaft(34a) for rotating the wafer chuck(30). A rail(34b) is installed at a lower portion of the rotary shaft(34a). A moving portion(34c) is used for driving the rotary shaft(34a). A light source(36) is used for providing the light. A test portion(38) is used for testing a state of exposure. The second drive portion(40) is connected with the test portion(38) and the light source(36) in order to drive the light source(38).

Abstract translation: 目的：提供一种用于曝光晶片的周边部分的方法及其执行装置，以对其上涂覆有光致抗蚀剂的晶片的周边部分进行精确的曝光处理。 构成：将晶片（W）装载在晶片卡盘（30）上。 在晶片（W）的上部形成有光致抗蚀剂层（32）。 通过曝光光致抗蚀剂层（32）形成光致抗蚀剂图案。 当在晶片（W）的上部形成光致抗蚀剂层（32）时，通过向外围部分注入包括丙酮的清洁溶液，来部分去除晶片（W）的圆周部分的光致抗蚀剂层（32）。 第一驱动部分（34）与晶片卡盘（30）连接以驱动晶片卡盘（30）。 第一驱动部分（34）具有用于旋转晶片卡盘（30）的旋转轴（34a）。 轨道（34b）安装在旋转轴（34a）的下部。 移动部（34c）用于驱动旋转轴（34a）。 光源（36）用于提供光。 测试部分（38）用于测试曝光状态。 第二驱动部分（40）与测试部分（38）和光源（36）连接以驱动光源（38）。

公开(公告)号：KR1020020037557A

公开(公告)日：2002-05-22

申请号：KR1020000067520

申请日：2000-11-14

Applicant: 삼성전자주식회사

Inventor： 신동화 ,  홍형식 ,  최재흥 ,  차훈

IPC: H01L21/68

CPC classification number: G03F7/708

Abstract: PURPOSE: An apparatus for eliminating particles adsorbed to a back surface of a wafer for fabricating a semiconductor is provided to minimize particles adsorbed to a chuck, by completely eliminating the particles absorbed to the back surface of the wafer during an exposure process. CONSTITUTION: A static electricity inducing unit(12) is installed in the periphery of the chuck(10) where the wafer(W) for forming a photoresist pattern is placed, facing the back surface of the wafer. The static electricity inducing unit is composed of a static electricity inducing bar(12a) for inducing static electricity to the back surface of the wafer and a grounding part(12b) for grounding th static electricity. The static electricity inducing unit induces the static electricity to the back surface of the wafer to neutralize the back surface of the wafer so that the absorption force of the particles adsorbed to the back surface of the wafer is weakened. A plurality of holes(14b) are installed in the static electricity inducing bar by a vacuum absorbing unit(14). The vacuum absorbing unit supplies vacuum absorption force to the back surface of the wafer through the holes and absorbs the particles of which the adsorption force is weakened by inducing the static electricity.

Abstract translation: 目的：提供一种用于消除吸附到用于制造半导体的晶片的背面的颗粒的装置，以通过在曝光过程中完全消除吸收到晶片的背面的颗粒来最小化吸附到卡盘的颗粒。 构成：静电诱导单元（12）安装在卡盘（10）的周围，其中放置用于形成光致抗蚀剂图案的晶片（W）面对晶片的后表面。 静电诱导单元由用于向晶片的背面引起静电的静电诱导杆（12a）和用于接地静电的接地部（12b）构成。 静电诱导单元对晶片的背面引起静电，以中和晶片的背面，使得吸附在晶片背面的颗粒的吸收力减弱。 多个孔（14b）通过真空吸收单元（14）安装在静电诱导杆中。 真空吸收单元通过孔向晶片的背面提供真空吸附力，并通过引起静电来吸收吸附力被削弱的颗粒。

公开(公告)号：KR100316712B1

公开(公告)日：2001-12-12

申请号：KR1019990023491

申请日：1999-06-22

Applicant: 삼성전자주식회사

Inventor： 양윤식 ,  김경대 ,  홍형식 ,  김민규

IPC: H01L21/68

CPC classification number: B24B37/345

Abstract: 화학기계적연마장치에웨이퍼를로딩/언로딩하기위한로드컵의페디스탈이개시된다. 개시된페디스탈은, 웨이퍼를지지하는페디스탈플레이트의상면에부착되어웨이퍼표면과접촉되는페디스탈필름을구비하며, 이페디스탈필름은웨이퍼표면과의접촉면적을감소시키기위하여페디스탈플레이트의상면에웨이퍼의진공흡착및 순수의분사를위해마련되는복수의유체포트주위를포함한제한된부위에만부착되는것을특징으로한다. 또한, 페디스탈플레이트는그 상면에잔류되는오염물질의양을최소화하기위하여유체포트가위치하지않은부위가제거된십자형상으로된 것을특징으로한다. 따라서, 페디스탈의상면에잔류되는오염물질이웨이퍼와의접촉에의해웨이퍼표면으로전이되는것을최소화할수 있다. 여기에서, 페디스탈필름은복수의유체포트각각의가장자리를따라고리형상으로부착될수 있으며, 또는페디스탈플레이트의상면에방사상으로부착될수 있다.

公开(公告)号：KR200211054Y1

公开(公告)日：2001-03-02

申请号：KR2019950035610

申请日：1995-11-24

Applicant: 삼성전자주식회사

Inventor： 최규상 ,  홍형식

IPC: H01L21/68

Abstract: 본 고안은 캐리어(2)를 수용할 수 있는 케이스(3)와, 상기 케이스의 상부를 개폐하는 것으로 내측에 캐리어의 일측을 눌러 고정하는 고정핀(6)이 형성된 뚜껑(5)으로 이루어진 반도체 웨이퍼 캐리어 운반용 박스에 관한 것으로, 상기 캐리어의 일측과 접촉되는 고정핀(6)의 끝단에 마찰부재(7)를 설치하여 캐리어 일측과의 마찰력이 증대되도록 구성된 것이다.
따라서 박스의 운반시 캐리어의 흔들림이 없어 웨이퍼가 손상되는 것이 방지되고, 박스 내부와 캐리어와의 마모로 인한 파티클의 생성이 억제되어 파티클에 의한 웨이퍼의 오염이 방지됨으로써 수욜이 향상되는 효과가 있다.

公开(公告)号：KR1020010008941A

公开(公告)日：2001-02-05

申请号：KR1019990027035

申请日：1999-07-06

Applicant: 삼성전자주식회사

Inventor： 홍형식 ,  김태형

IPC: H01L21/304

Abstract: PURPOSE: A pad backer of a semiconductor surface planarization apparatus is provided to enhance a polishing evenness and a fabrication efficiency by enlarging a frictional surface and improving a clearance distribution. CONSTITUTION: A pad backer(140) of a semiconductor surface planarization device is made of a circular-shape body, and mounts a polishing pad on an upper part of the pad backer. A slurry providing hole(144) for providing a polishing material in the body and many grooves(142) elastically curved about a rising pressure of a pressure rubber(38) are formed on the body. The grooves are formed to have a smaller clearance at an outer part of the body as compared to the center part of the body. The groove is formed as a straight line. The groove is formed as a curved line. Thereby, the pad backer of a semiconductor surface planarization apparatus enhances a polishing evenness and fabrication efficiency by enlarging a frictional surface and improving a clearance distribution.

Abstract translation: 目的：提供半导体表面平坦化装置的垫衬垫，通过增大摩擦面和改善间隙分布​​来提高抛光均匀性和制造效率。 构成：半导体表面平坦化装置的衬垫支撑件（140）由圆形体构成，并且将抛光垫安装在垫衬垫的上部。 在主体上形成有用于在主体中提供抛光材料的浆料提供孔（144）和围绕加压橡胶（38）的上升压力弹性弯曲的许多凹槽（142）。 与身体的中心部分相比，凹槽形成为在身体的外部具有较小的间隙。 槽形成为直线。 凹槽形成为曲线。 由此，半导体表面平坦化装置的垫支撑体通过扩大摩擦面并提高间隙分布来提高抛光均匀性和制造效率。

公开(公告)号：KR1020010003268A

公开(公告)日：2001-01-15

申请号：KR1019990023491

申请日：1999-06-22

Applicant: 삼성전자주식회사

Inventor： 양윤식 ,  김경대 ,  홍형식 ,  김민규

IPC: H01L21/68

CPC classification number: B24B37/345

Abstract: PURPOSE: A pedestal of a load-cup for loading/unloading a wafer into/from a chemical mechanical polishing apparatus is to minimize the transfer of a contaminant from on an upper face of the pedestal to a surface of the wafer, thereby reducing scratch on the surface of the wafer. CONSTITUTION: A pedestal(810) of a load-cup for loading/unloading a wafer into a chemical mechanical polishing apparatus comprises a pedestal plate(811) disposed in an inner portion of the load-cup to support the wafer; a pedestal supporting portion for supporting and lifting up/down the pedestal plate; a fluid port(814) provided at an upper face of the pedestal plate to vacuum-attach the wafer and spray pure wafer; a vertical fluid passage formed in an inner portion of the pedestal supporting portion; a lateral fluid passage formed in an inner portion of the pedestal plate to connect the fluid port and the vertical fluid passage; and a pedestal film(813) attached to an upper face of the pedestal plate to be contacted with the surface of the wafer, wherein the pedestal film is attached to only a limited portion including a peripheral portion of the fluid port.

Abstract translation: 目的：用于将晶片装入/卸载化学机械抛光装置的负载杯的底座是最小化污染物从基座上表面到晶片表面的转移，从而减少 晶片的表面。 构成：用于将晶片装载/卸载到化学机械抛光装置中的负载杯的基座（810）包括设置在负载杯的内部以支撑晶片的基座板（811） 用于支撑和提升基座板的基座支撑部分; 设置在所述基座板的上表面处以真空附着所述晶片并喷射纯晶片的流体端口（814） 形成在基座支撑部的内部的垂直流体通道; 横向流体通道，其形成在所述基座板的内部，以连接所述流体端口和所述垂直流体通道; 以及安装在基座板的上表面以与晶片的表面接触的基座膜（813），其中基座膜仅附接到包括流体端口的周边部分的限定部分。

公开(公告)号：KR1019990038800A

公开(公告)日：1999-06-05

申请号：KR1019970058663

申请日：1997-11-07

Applicant: 삼성전자주식회사

Inventor： 홍형식

IPC: H01L21/68

Abstract: 본 발명은 반도체장치 제조용 카세트에 관한 것이다.
본 발명은, 웨이퍼가 적재되는 다수의 슬롯이 형성되어 있고, 상기 슬롯을 지지하는 바닥면 및 받침대로 이루어지는 지지부가 구비되는 반도체장치 제조용 카세트는 상기 카세트의 슬롯에 적재된 웨이퍼가 일방향으로 정렬될 수 있도록 상기 카세트의 지지부를 경사가 지도록 제작되어 이루어진다.
따라서, 웨이퍼의 패턴이 없는 면 즉, 뒷면이 항상 슬롯과 마찰되도록 정렬되어 웨이퍼의 패턴이 있는 면의 오염 및 카세트의 오염을 방지하는 효과가 있다.

公开(公告)号：KR1019990038797A

公开(公告)日：1999-06-05

申请号：KR1019970058660

申请日：1997-11-07

Applicant: 삼성전자주식회사

Inventor： 홍형식

IPC: H01L21/02

Abstract: 본 발명은 작업자가 매뉴얼(Manual)로 웨이퍼를 카세트의 슬롯에 적재할 때, 부주의에 의해서 슬롯에 웨이퍼가 올바르게 적재되지 않는 것을 방지할 수 있는 반도체장치 제조용 카세트에 관한 것이다.
본 발명은, 개방부가 중앙에 형성됨으로서 상변부 및 하변부가 형성되고, 상기 상변부 및 하변부 내측에 다수의 슬롯이 형성된 반도체장치 제조용 카세트에 있어서, 상기 상변부 및 하변부 상단에 5미만의 자연수의 배수로서 상기 슬롯의 순서를 나타내는 숫자가 순차적으로 형성되거나 상기 상변부 및 하변부 상단에 상기 슬롯의 순서를 나타내는 정수가 순차적으로 형성되어 있는 것을 특징으로 한다.
따라서, 작업자가 카세트에 웨이퍼를 올바르게 적재함으로서 카세트에 적재된 웨이퍼를 로봇암이 로딩할 때, 웨이퍼가 깨지는 것을 미연에 방지할 수 있는 효과가 있다.