公开(公告)号：KR1020130010428A

公开(公告)日：2013-01-28

申请号：KR1020120029739

申请日：2012-03-23

Applicant: 삼성전자주식회사

Inventor： 김영룡 ,  김태훈 ,  장철용 ,  이종호

IPC: H01L23/48

CPC classification number: H01L24/82 ,  H01L2224/24 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PURPOSE: A semiconductor package and a manufacturing method thereof are provided to maximize productivity by forming wires with electroless plating to perform a strip/panel-level batch process. CONSTITUTION: A substrate(20) includes a substrate connection terminal. A semiconductor chip(10a,10b,10c,10d) is laminated on a substrate. The semiconductor chip includes a chip connection terminal(3a). A first insulation layer(30) covers a part of the substrate and the semiconductor chip. The first insulation layer includes polymer and metal containing particles dispersed in the polymer. A wiring(40a) connects the substrate connection terminal to the chip connection terminal by passing through the first insulation layer.

Abstract translation: 目的：提供一种半导体封装及其制造方法，以通过用无电镀形成导线来最大限度地提高生产率，以执行条/面板级批处理。 构成：衬底（20）包括衬底连接端子。 半导体芯片（10a，10b，10c，10d）层叠在基板上。 半导体芯片包括芯片连接端子（3a）。 第一绝缘层（30）覆盖基板的一部分和半导体芯片。 第一绝缘层包括分散在聚合物中的聚合物和含金属的颗粒。 布线（40a）通过穿过第一绝缘层将基板连接端子连接到芯片连接端子。

公开(公告)号：KR1020130004834A

公开(公告)日：2013-01-14

申请号：KR1020110066128

申请日：2011-07-04

Applicant: 삼성전자주식회사

Inventor： 김영룡 ,  이종호 ,  조문기 ,  임환식 ,  박선희

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L24/11 ,  H01L23/3128 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/02123 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2224/05019 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05025 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05166 ,  H01L2224/0519 ,  H01L2224/05191 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/0556 ,  H01L2224/05562 ,  H01L2224/05568 ,  H01L2224/05666 ,  H01L2224/0569 ,  H01L2224/05691 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11912 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/14131 ,  H01L2224/1416 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/1435 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: PURPOSE: A semiconductor chip and a flip-chip package including the semiconductor chip are provided to form a buffer made of a metal or an insulating material within a bump structure and to reduce the stress due to the difference of the heat expansion coefficient between the semiconductor chip and a PCB. CONSTITUTION: A body part(110) includes a semiconductor structures and lines. A passivation layer(120) covers the upper surface of the body part and protects the body part. A pad(130) is electrically connected to the lines. A bump structure(180) is formed in the opening part of the passivation layer. The bump structure includes an UBM(Under Bump Metal)(140), a buffer(150) and a bump(160). The buffer is made of a conductive or an insulating material.

Abstract translation: 目的：提供包括半导体芯片的半导体芯片和倒装芯片封装，以在凸块结构内形成由金属或绝缘材料制成的缓冲器，并且减小由于半导体之间的热膨胀系数的差异引起的应力 芯片和PCB。 构成：身体部分（110）包括半导体结构和线。 钝化层（120）覆盖主体部分的上表面并保护身体部位。 衬垫（130）电连接到线路。 在钝化层的开口部分形成凸起结构（180）。 凸块结构包括UBM（低爆破金属）（140），缓冲器（150）和凸块（160）。 缓冲器由导电或绝缘材料制成。

公开(公告)号：KR1020120126856A

公开(公告)日：2012-11-21

申请号：KR1020110044955

申请日：2011-05-13

Applicant: 삼성전자주식회사

Inventor： 채승완 ,  김태훈 ,  이수열 ,  김성태 ,  이종호

IPC: H01L33/46

CPC classification number: H01L33/46 ,  H01L33/20 ,  H01L33/36

Abstract: PURPOSE: A semiconductor light emitting diode chip and a light emitting device using the same are provided to prevent damage to a reflective structure by preventing diffusion of an unwanted element of a eutectic bonding layer using a diffusion barrier. CONSTITUTION: A light emitting diode structure(40) comprises an n-type semiconductor layer(42), an active layer(45), and a p-type semiconductor layer(46). An n-side electrode(49a) is formed on the upper side of the exposed n-type semiconductor layer. A transparent electrode layer(47) is formed on the upper side of the p-type semiconductor layer. An optical subsidiary layer(53) is comprised of material having a predetermined refractive index.

Abstract translation: 目的：提供一种半导体发光二极管芯片和使用该半导体发光二极管芯片的发光器件，以通过防止使用扩散阻挡层的共晶接合层的不想要的元件的扩散来防止对反射结构的损坏。 构成：发光二极管结构（40）包括n型半导体层（42），有源层（45）和p型半导体层（46）。 在暴露的n型半导体层的上侧形成有n侧电极（49a）。 透明电极层（47）形成在p型半导体层的上侧。 光学辅助层（53）由具有预定折射率的材料构成。

公开(公告)号：KR1020120085078A

公开(公告)日：2012-07-31

申请号：KR1020110006487

申请日：2011-01-21

Applicant: 삼성전자주식회사

Inventor： 김홍수 ,  김세권 ,  이종호 ,  남궁은

IPC: H04W64/00 ,  H04W4/04 ,  H04W8/08 ,  G07C9/00

CPC classification number: G07C9/00103 ,  G07C9/00111 ,  H04W64/003 ,  G01S5/02 ,  H04W4/02 ,  H04W8/08 ,  H04W64/00

Abstract: PURPOSE: A ward location management method and apparatus thereof are provided to effectively manage the location of a ward and to reduce location management costs by monitoring a current location of a ward according to a location update period. CONSTITUTION: A location information management unit(105) determines a location update period based on a current location within a safety zone of a ward. The location information management unit confirms the current location of the ward in time according to the determined location update period. A communication unit(102) transmits the current location of the confirmed ward. The location information management unit determines the arrival time of the ward according to the location update period.

Abstract translation: 目的：提供病房位置管理方法及其装置，以便有效地管理病房的位置，并通过根据位置更新周期监视病房的当前位置来降低位置管理成本。 构成：位置信息管理单元（105）基于病房的安全区域内的当前位置来确定位置更新周期。 位置信息管理单元根据确定的位置更新周期及时确认病房的当前位置。 通信单元（102）发送确认病房的当前位置。 位置信息管理单元根据位置更新周期确定病房的到达时间。

公开(公告)号：KR3006429790000S

公开(公告)日：2012-05-11

申请号：KR3020100053934

申请日：2010-12-13

Applicant: 삼성전자주식회사

Designer： 임정수 ,  정우경 ,  이종호 ,  임애리 ,  손동훈

公开(公告)号：KR3006314660000S

公开(公告)日：2012-02-29

申请号：KR3020100054230

申请日：2010-12-14

Applicant: 삼성전자주식회사

Designer： 임정수 ,  정우경 ,  이종호 ,  임애리 ,  김장운

公开(公告)号：KR1020110045222A

公开(公告)日：2011-05-04

申请号：KR1020090101683

申请日：2009-10-26

Applicant: 삼성전자주식회사

Inventor： 임환식 ,  강선원 ,  이종호

IPC: H01L23/48

CPC classification number: H01L24/14 ,  H01L23/3128 ,  H01L23/3192 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05578 ,  H01L2224/0603 ,  H01L2224/06515 ,  H01L2224/13025 ,  H01L2224/13028 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14515 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PURPOSE: A semiconductor package and manufacturing method thereof are provided to combine bumps on one printed circuit board pattern, thereby enhancing mechanical and electrical features. CONSTITUTION: A package substrate has a circuit pattern. A semiconductor chip(150) is mounted on the package substrate. The semiconductor chip comprises bumps(130,140) electrically connected to the circuit pattern. The circuit pattern includes a ground pattern(124) and a signal pattern. The signal pattern transfers data between the package substrate and the semiconductor chip.

Abstract translation: 目的：提供半导体封装及其制造方法来组合一个印刷电路板图案上的凸块，从而增强机械和电气特征。 构成：封装衬底具有电路图案。 半导体芯片（150）安装在封装基板上。 半导体芯片包括电连接到电路图案的凸块（130,140）。 电路图案包括接地图案（124）和信号图案。 信号图案在封装基板和半导体芯片之间传送数据。

公开(公告)号：KR1020100083572A

公开(公告)日：2010-07-22

申请号：KR1020090003026

申请日：2009-01-14

Applicant: 삼성전자주식회사

Inventor： 장종혁 ,  박승권 ,  이종호

IPC: G10L15/06 ,  G10L15/28

CPC classification number: G10L15/065 ,  G10L2015/0631

Abstract: PURPOSE: A signal processing apparatus and a method of recognizing a voice of the signal processing apparatus are provided to learn repetitive mistakes, thereby successfully learning a voice command which is a mistake in the past. CONSTITUTION: A voice recognition unit(210) recognizes a voice. A voice recognition learning unit(220) learns a voice which is a target of voice recognition. A control unit(230) controls the voice recognition unit to recognize the voice which is a target of voice recognition among inputted voices. The control unit controls the voice recognition learning unit to learn the inputted voice when the voice recognition is failed. When the voice recognition is succeeded, the control unit performs a specific operation corresponding to the recognized voice.

Abstract translation: 目的：提供信号处理装置和识别信号处理装置的声音的方法，以学习重复的错误，从而成功地学习过去是错误的语音命令。 构成：语音识别单元（210）识别语音。 语音识别学习单元（220）学习作为语音识别的对象的声音。 控制单元（230）控制语音识别单元识别作为输入语音中的语音识别目标的声音。 当语音识别失败时，控制单元控制语音识别学习单元学习输入的语音。 当语音识别成功时，控制单元执行与所识别的语音相对应的特定操作。

公开(公告)号：KR1020100022202A

公开(公告)日：2010-03-02

申请号：KR1020080080753

申请日：2008-08-19

Applicant: 삼성전자주식회사 ,  한국과학기술원

Inventor： 이주현 ,  이종호 ,  황성수 ,  강준혁 ,  송원택 ,  박경호 ,  장남석

IPC: H04B7/04 ,  H04L1/06

CPC classification number: H04B7/0639 ,  H04L25/0204 ,  H04L25/0228

Abstract: PURPOSE: A transceiving method in a multiple antenna system for reducing necessary computational complexity in selection or the quantization of a coding word is provided to remove interference between multi users by quantizing error. CONSTITUTION: A transmitter receives a codebook index from a plurality of terminals(300). The transmitter selects the k terminal of a plurality of terminals(302). The transmitter generates the precoder matrices P put through to the codebook index of the selected terminal(304). The transmitter performs precoding(306). The transmitter transmits the transmission signal of which the precoding is performed for the first time slot(308).

Abstract translation: 目的：提供一种多天线系统中的收发方法，用于减少编码字的选择或量化中必要的计算复杂度，以通过量化误差来消除多用户之间的干扰。 构成：发射机从多个终端（300）接收码本索引。 发射机选择多个终端的k个终端（302）。 发射机产生预选码矩阵P放入所选终端的码本索引（304）。 发射机执行预编码（306）。 发射机发送对其进行第一时隙（308）的预编码的发送信号。

公开(公告)号：KR1020090124174A

公开(公告)日：2009-12-03

申请号：KR1020080050222

申请日：2008-05-29

Applicant: 삼성전자주식회사 ,  이화여자대학교 산학협력단

Inventor： 이종호 ,  윤상보 ,  김성환 ,  정성윤 ,  김낙명 ,  신수정 ,  강해린 ,  유혜인

IPC: H04B7/14 ,  H04B7/26

CPC classification number: H04B7/15557 ,  H04L41/30 ,  H04W24/02

Abstract: PURPOSE: An apparatus and a method for selecting a relay station mode in a BWA(Broadband Wireless Access) communication system based on a state of a neighbor terminal are provided to collect a terminal for a relay station by sensing a state of the neighbor terminal according to a service request of the user. CONSTITUTION: A receiver(950) receives a bidding value from a first relay station group in a base station. A controller(915) decides the winner repeater station of one or more auction based on each biding value and the first repeater station population each interference information in an active mode. When the number of users in a winner repeater station of the auction is smaller than the critical value, the controller activates the winner repeater station in a waiting mode.

Abstract translation: 目的：提供一种基于相邻终端的状态的BWA（宽带无线接入）通信系统中的选择中继站模式的装置和方法，用于通过根据邻居终端的状态感测邻居终端的状态来收集终端 到用户的服务请求。 构成：接收机（950）从基站中的第一中继站组接收出价值。 控制器（915）基于每个绑定值和第一中继站群在每个干扰信息中以主动模式决定一个或多个拍卖的胜者中继站。 当拍卖的获胜者中继站中的用户数量小于临界值时，控制器以等待模式激活胜者中继站。