Abstract:
A data processor (104) is described. The data processor (104) is capable of decoding and executing a first instruction (212) of a first instruction set and a second instruction (213-219) in a second instruction set wherein the first instruction (212) and the second instruction (213-219) originate from a single computer program (210, 211). Alternatively, the data processor (104) can also execute a first instruction (212) of a first instruction set in a first instruction set mode, receive a first interruption indication in the first instruction set mode, service the first interruption indication in a second instruction set mode, return to the first instruction set mode, receive a second interruption indication in the first instruction set mode, and service the second interruption indication in the first instruction set mode.
Abstract:
A high performance integrated circuit package (10) placed on a printed circuit (PC) board (56) and having a first dielectric layer. On top of this first dielectric layer a metallized die pad (22) and a first metal ring (38a), surrounding this metallized die pad, are positioned. The metallized die pad and the first metal ring electrically couple to the PC board to receive respectively a first power supply signal and a second power supply signal. An integrated circuit die (12) is then affixed to the metallized die pad. This integrated circuit die (12) has a first power supply signal bond pad (28, 30) and a second power supply signal bond pad (33, 34), which respectively are coupled to the metallized die pad and the first metal ring. Consequently, the metallized die pad and the first metal ring operate as a first power supply plane and a second power supply plane coupling the first and second power supply signals coming from the PC board to the first and second power supply signal bond pads on the integrated circuit die.
Abstract:
An integrated bus bridge and memory controller circuit (16) enables access to a shared memory (18) with high bandwidth data streaming. The bus bridge and memory controller circuit (16) performs a series of snoop ahead transactions over the processor bus (24) during access transactions to the shared memory (18) that originate over the peripheral bus (26) and thereby enables high bandwidth data streaming on the peripheral bus (26). The bus bridge and memory controller circuit (16) may be used in a computer system (10) having a processor (12) and a cache memory (14) coupled to the processor bus (24), and a set of bus agents (20, 22) coupled to the peripheral bus (26). The circuit (16) may include a write buffer (42) for merging write data received over the buses, a peripheral write buffer (46) that stores a snoop done flag, and a peripheral read prefetch buffer (44).
Abstract:
A method of utilizing error detecting and correcting circuitry (56) to detect and correct errors which can occur in data stored in multi-bit cell format in a flash EEPROM memory array (23) before those errors can affect the accuracy of data provided by a flash EEPROM memory array.
Abstract:
A method and apparatus for CPU (102) cycle stealing on a non-preemptive multi-tasking operating system (122) allowing a first application (118) to preempt other applications (114, 116) which are running concurrently on the operating system (122). The steps taken to perform the CPU (102) cycle stealing include: inserting (1, 2, 4) a hook near a starting address of message-monitoring calls (112), and vectoring the execution path to the first application (118) whenever one of the other applications calls the message-monitoring calls (112), allowing the first application (118) to steal CPU (102) cycles from one of the other applications (114, 116). The vectoring is provided by the hook (1, 2, 4) inserted near the starting address of the message-monitoring calls (112).
Abstract:
A method of forming a substantially planar surface over a trench isolation region (33) of a semiconductor substrate (30). Latent active regions (42) are formed within the trench isolation region (33). A dielectric layer (38) is then deposited over the surface of the semiconductor substrate (30). Then, the dielectric layer (38) is polished back to form a planar surface.
Abstract:
A sense amplifier (221) for detecting the difference in voltage between two bitlines (113, 115) of a momory circuit. The sense amplifier is comprised of a differential amplifier (201, 203) which is coupled to the two bitlines (113, 115) and generates an output signal based on voltage levels sensed in the bitlines (113, 115). The differential amplifier (201, 203) is coupled to Vcc and ground through an active load (205, 207) and a current source (209) respectively. To address the problem of increased common mode voltage levels found in the bitlines (113, 115), a pair of transistors (223, 225) are connected in parallel across the active load (205, 207) to Vcc and the differential amplifier (202, 203). The gate of one of the transistors is coupled to one of the bitlines (113, 115) and the gate of the other one of the transistors is coupled to the other one of the bitlines (113, 115). With these two transistors (223, 225) coupled in parallel across the load (205, 207) as described, the differential amplifier (201, 203) has increased immunity to elevated common mode levels found in the bitlines (113, 115).
Abstract:
Circuitry and complementary logic are provided to a bus controller (14), a number of 1:n bus signal distributor (18), and a number of bus interfaces (22) of a hierarchical serial bus assembly for the bus controller to dynamically detect and manage the interconnection topology of the serial bus elements. The serial bus assembly is used to serially interface a number of isochronous and asynchronous peripherals to the system unit of a computer system. These circuitry and complementary logic support a hierarchical view of the serial bus elements (16), logically dividing the hierarchy into multiple tiers. This logical view of the serial bus elements is used by the bus controller to detect the presence of interconnected serial bus elements and the functions of the bus agents, i.e. the system unit and the interconnected peripheral, as well as assignment of addresses to the serial bus elements and the functions, at power on, reset, and during operation when serial bus elements are hot attached to or detached from the serial bus assembly.
Abstract:
An integrated circuit having internal power supplies (60A, 240, 245 and 250) includes circuitry (270) for selecting either (Fig. 13A) the external supply voltages or the internal power supplies to supply voltages to the remaining circuitry of the integrated circuit. The integrated circuit comprises voltage detector circuits for detecting the external voltage levels and a control circuit for selecting either the external supply voltages or the internal power supplies in response to the detected external voltages. The integrated circuit may be a flash EEPROM, and the external voltages may be the operating supply voltage VCC and the programming supply voltage VPP.
Abstract:
A method of forming a memory device with improved isolation between diffusion lines. Parallel, spaced apart thick oxide strips (201) are grown on a substrate. Next, spaced apart, parallel strips (302) having a polysilicon (302a) and nitride (302b) layer, oriented perpendicular to the first strips (201), are formed. The oxide (201) between the second strips is removed, followed by an implantation to form source (402) and drain (401) regions. The nitride layer (302b) on the second strips is removed on those strips between two drain diffusions (401) and an oxidation is performed to form self-aligned thick oxide (602) over the source and drain regions. The strips from which the nitride has been removed are also oxidized, thus providing isolation between adjacent drain lines.