公开(公告)号：EP3356289A1

公开(公告)日：2018-08-08

申请号：EP16852577.2

申请日：2016-09-29

Applicant: Mems Drive Inc.

Inventor： GUTIERREZ, Roman ,  TANG, Tony ,  LIU, Xiaolei ,  NG, Matthew ,  WANG, Guiqin

IPC: B81C1/00

CPC classification number: B81C1/00476 ,  B81B2201/033 ,  B81C1/00619 ,  B81C99/0095 ,  B81C2201/0132 ,  B81C2201/056

Abstract: A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.

公开(公告)号：EP3294665A1

公开(公告)日：2018-03-21

申请号：EP16725587

申请日：2016-05-09

Applicant: MURATA MANUFACTURING CO

Inventor： IIHOLA ANTTI ,  TORKKELI ALTTI

IPC: B81C1/00 ,  G01C19/5733 ,  G01C19/5769

CPC classification number: B81C1/00595 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/033 ,  B81B2203/0136 ,  B81C1/00603 ,  G01C19/56 ,  G01C19/5733 ,  G01C19/5769

Abstract: A method for manufacturing a micromechanical device layer is performed on a device wafer comprising a single layer of homogenous material. The method comprises patterning a first mask on a first face of the device wafer, the first mask patterning at least lateral dimensions of comb structures and outlines of large device structures. First trenches are etched, the first trenches defining the lateral dimensions of the at least comb structures and outlines of large device structures in a single deep etching process. Recession etching may be used on one or two faces of the device wafer for creating structures at least partially recessed below the respective surfaces of the device wafer. A double mask etching process may be used on one or two faces of the device wafer for creating structures at least partially recessed to mutually varying depths from the respective face of the device wafer.

公开(公告)号：EP3257808A1

公开(公告)日：2017-12-20

申请号：EP17176388.1

申请日：2017-06-16

Applicant: Commissariat à l'énergie atomique et aux énergies alternatives

Inventor： MASPERO, Federico ,  JOET, Loïc

IPC: B81B3/00

CPC classification number: G01C19/5762 ,  B81B3/0045 ,  B81B3/0051 ,  B81B3/0062 ,  B81B2201/0228 ,  B81B2201/0242 ,  B81B2201/033 ,  B81B2203/053 ,  B81C99/003 ,  G01P15/125 ,  G01P2015/0822 ,  H01G5/14

Abstract: Capteur microélectromécanique comportant une partie fixe (2) et une partie mobile (4) suspendue à la partie fixe (2) de sorte que la partie mobile (4) soit apte à se déplacer au moins dans une direction de déplacement hors-plan (Z), la partie fixe (2) comportant au moins des premières électrodes (8) s'étendant parallèlement à la direction de déplacement (Z) de la partie mobile (4), la partie mobile (4) comportant une masse sismique (18) et au moins des deuxièmes électrodes (20) s'étendant parallèlement à la direction de déplacement hors-plan (Z), les premières électrodes (8) et les deuxièmes électrodes (20) étant disposées les unes par rapport aux autres de sorte à être interdigitées, dans lequel les deuxième électrodes (20) sont directement connectée à la masse inertielle (18) et une partie seulement de la face de chaque électrode mobile (20) est en regard d'une électrode fixe (8) au repos.

Abstract translation: 包括：固定部分（2）和可移动部分微机电传感器（4）悬挂在固定部分（2），使得所述可动部件（4）被适配为在一个移动方向至少移动到平面外（Z ），所述固定部分（2）具有至少第一电极（8）平行延伸的可动部（4）的位移方向（Z），（4），其具有振动质量的可动部分（18） 和至少第二电极（20）平行于离面位移方向（Z）延伸，所述第一电极（8）和第二电极（20）相对于一个设置在其他以便可 互相交叉的，其中，所述第二电极（20）被直接连接到所述惯性质量（18），只在可动电极的面的部分（20）是相对静止的固定电极（8）。

公开(公告)号：EP3014285A1

公开(公告)日：2016-05-04

申请号：EP14753156.0

申请日：2014-06-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： LIUKKU, Matti ,  RYTKÖNEN, Ville-Pekka

IPC: G01P15/125 ,  B81B5/00 ,  G01P15/08

CPC classification number: G01P15/125 ,  B81B3/0078 ,  B81B2201/0235 ,  B81B2201/033 ,  G01P15/0802 ,  G01P15/131 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0871

Abstract: The invention relates to a capacitive micromechanical sensor structure comprising a stator structure rigidly anchored to a substrate and a rotor structure movably anchored by means of spring structures to the substrate. The stator structure has a plurality of stator finger support beams and the rotor structure has a plurality of rotor finger support beams. Stator fingers along the stator finger support beam of the stator structure extend into rotor gaps along the rotor finger support beam of the rotor structure, and rotor fingers along the rotor finger support beam of the rotor structure extend into stator gaps along the stator finger support beam of the stator structure.

公开(公告)号：EP2743639A4

公开(公告)日：2014-06-18

申请号：EP11870767

申请日：2011-08-09

Applicant: TOYOTA MOTOR CO LTD

Inventor： NARITA KATSUTOSHI

IPC: G01C19/56 ,  B81B3/00 ,  G01B7/00 ,  G01C19/5733

CPC classification number: G01B7/14 ,  B81B3/0086 ,  B81B2201/033 ,  G01C19/5733

Abstract: The displacement amount monitoring electrode structure according to the present invention is for maintaining the amplitude of the detection mass at a constant target amplitude even when the relative relationship between a fixed electrode and a movable electrode changes, and includes a fixed electrode and a movable electrode each having a comb-teeth shape including a base part and electrode fingers extending from the base part in a predetermined axis direction parallel to a substrate, the fixed electrode and the movable electrode facing each other such that the electrode fingers of the fixed electrode and the electrode fingers of the movable electrode are meshed together, the fixed electrode being fixed to the substrate and the movable electrode being able to be displaced in the predetermined axis direction, wherein the displacement amount monitoring electrode structure monitors a displacement amount of a detection mass to be driven at a target amplitude based on a change amount of a capacitance between the fixed electrode and the movable electrode, wherein a change sensitivity of the change amount of the capacitance with respect to a displacement amount of the movable electrode in the predetermined axis direction, becomes larger after the displacement of the movable electrode in the predetermined axis direction reaches a target displacement amount corresponding to the target amplitude of the detection mass, compared to before the displacement of the movable electrode reaches the target displacement amount.

公开(公告)号：EP2435353A2

公开(公告)日：2012-04-04

申请号：EP10720157.6

申请日：2010-05-18

Applicant: Robert Bosch GmbH

Inventor： NJIKAM NJIMONZIE, Frederic ,  SCHOCK, Wolfram ,  MUCHOW, Joerg ,  LESTYAN, Zoltan

IPC: B81B3/00

CPC classification number: G02B26/0841 ,  B81B3/0021 ,  B81B2201/033 ,  B81B2201/042 ,  Y10T29/49002

Abstract: The invention relates to a micromechanical component comprising an outer stator electrode component (28) and an outer actuator electrode component (24) connected to a holding element (55) by means of at least one outer spring (81). A mobile element (10) can be moved about a first rotational axis (12) by applying a first voltage between the outer actuator electrode component (24) and the outer stator electrode component (28). Said micromechanical component also comprises an inner stator electrode component (30) and an inner actuator electrode component (26) comprising a first web (50) provided with at least one electrode finger (26a,26b), the mobile element (10) being mobile about a second rotational axis (14) by applying a second voltage between the at least one electrode finger (26a, 26b) of the inner actuator electrode component (26) and the inner stator electrode component (30), the inner actuator electrode component (26) being connected to the outer actuator electrode component (24) by means of an intermediate spring (52) oriented in the direction of the second rotational axis (14). The invention also relates to a production method for a micromechanical component.

公开(公告)号：EP2318303A2

公开(公告)日：2011-05-11

申请号：EP09779758.3

申请日：2009-06-15

Applicant: Robert Bosch GmbH

Inventor： FRIEDRICH, Thomas ,  MEISEL, Daniel, Christoph ,  RAUDZIS, Carsten

IPC: B81B3/00

CPC classification number: B81B3/0037 ,  B81B2201/033 ,  H02N1/008

Abstract: The invention relates to a micromechanical structure (1), in particular sensor or actuator, comprising at least one working gap (4, 5) delimited by at least two structure sections (6, 7, 8, 9) which are adjustable relative to one another, and comprising means for setting the working gap width. The invention provides for the means to be embodied such that they widen the working gap (4, 5) by adjusting the at least one structure section (6, 7) that is stationary relative to a reference point during operation of the micromechanical structure (1) relative to the structure section (8, 9) that is movable relative to said reference point during operation. The invention furthermore relates to a method for setting a working gap width.

公开(公告)号：EP1663850B1

公开(公告)日：2009-09-16

申请号：EP04773454.6

申请日：2004-09-21

Applicant: Panasonic Electric Works Co., Ltd.

Inventor： OKA, Naomasa, c/o Panasonic Electric Works Co., Ltd ,  HARADA, Hiroshi, c/o Panasonic Electric Works Co.,Ltd. ,  OGIHARA, Jun, c/o Panasonic Electric Works Co., Ltd. ,  FUKSHIMA, Hiroshi, c/o Panasonic Electric Works Co., Ltd. ,  NOGE, Hiroshi, c/o Panasonic Electric Works Co.,Ltd. ,  SUZUKI, Yuji, c/o Panasonic Electric Works Co., Ltd. ,  KAWANO, Kiyohiko, c/o Panasonic Electric Works Co., Ltd. ,  YOSHIHARA, Takaaki, c/o Panasonic Electric Works Co., Ltd. ,  SUZUMURA, Masahiko, c/o Panasonic Electric Works Co.,Ltd.

IPC: B81B3/00 ,  G02B26/08 ,  B81C1/00

CPC classification number: G02B26/0816 ,  B81B3/0086 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C2201/0109 ,  B81C2201/019 ,  G02B6/3516 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/355 ,  G02B6/357 ,  G02B6/3584 ,  H02N1/008

Abstract: A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower substrate. The upper substrate is selectively etched in its top layer to form therein a plurality of posts which project commonly from a bottom layer of the upper substrate. The posts include the fixed components to be fixed to the lower substrate and the movable components which are resiliently supported only to one or more of the fixed components to be movable relative to the fixed components. The lower substrate is formed in its top surface with at least one recess. The upper substrate is then bonded to the top of the lower substrate upside down in such a manner as to place the fixed components directly on the lower substrate and to place the movable components upwardly of the recess. Finally, the bottom layer of the upper substrate is removed to release the movable components from the bottom layer for floating the movable components above the recess and allowing them to move relative to the lower substrate, while keeping the fixed components fixed to the top of the lower substrate.

公开(公告)号：EP2038205A1

公开(公告)日：2009-03-25

申请号：EP07720006.1

申请日：2007-06-21

Applicant: Sun, Yu ,  Kim, Keekyoung

Inventor： Sun, Yu ,  Kim, Keekyoung

IPC: B81C1/00 ,  B81B3/00 ,  B82B3/00

CPC classification number: B81C99/002 ,  B25J9/104 ,  B81B2201/0292 ,  B81B2201/031 ,  B81B2201/033

Abstract: The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.

公开(公告)号：EP1975674A2

公开(公告)日：2008-10-01

申请号：EP08103114.8

申请日：2008-03-28

Applicant: Fujitsu Limited

Inventor： Tsuboi, Osamu ,  Mizuno, Yoshihiro ,  Soneda, Hiromitsu ,  Okuda, Hisao ,  Matsumoto, Tsuyoshi ,  Kouma, Norinao

IPC: G02B26/08

CPC classification number: G02B26/0841 ,  B81B3/0086 ,  B81B2201/033 ,  B81B2201/047

Abstract: A micro oscillating device includes a frame, an oscillating part including a first drive electrode for application of a reference electric potential, and a connecting part for connecting the frame and the oscillating part to each other, where the connecting part defines an axis of an oscillating motion of the oscillating part. A second drive electrode is fixed to the frame to cooperate with the first drive electrode for generation of a driving force for the oscillating movement. The first drive electrode includes a first end extension and a second end extension separated from each other and extending in a direction crossing the axis. The second drive electrode is within a separation distance between the first and the second end extensions.

Abstract translation: 微振荡装置包括框架，包括用于施加参考电位的第一驱动电极的振荡部分和用于将框架和振荡部分彼此连接的连接部分，其中连接部分限定摆动轴线 摆动部分的运动。 第二驱动电极固定到框架以与第一驱动电极协作以产生用于振荡运动的驱动力。 第一驱动电极包括彼此分离并沿与轴线交叉的方向延伸的第一端延伸部和第二端部延伸部。 第二驱动电极在第一和第二端部延伸部之间的间隔距离内。