Abstract:
A lateral field-emission device (10) has a lateral emitter (100) substantially parallel to a substrate (20) and has a simplified anode structure (70). The anode's top surface is precisely spaced apart from the plane of the lateral emitter and receives electrons emitted by field emission from the edge of the lateral emitter cathode, when a suitable bias voltage is applied. The device may be configured as a diode, or as a triode, tetrode, etc. having control electrodes (140) positioned to allow control of current from the emitter to the anode by an electrical signal applied to the control electrode.
Abstract:
A plurality of edge emitters (113) in a FED array include a plate shaped substrate (100) having parallel, laterally spaced apart grooves (103) formed in a first surface (101) and parallel, laterally spaced apart grooves (104) formed in the opposite surface (102) so that each second groove (104) crosses each first groove (103) at an angle. The combined depths (d1, d2) of the grooves (103, 104) is greater than the thickness of the plate substrate (100) so that an opening (105) is formed through the substrate (100) at each point where a second groove (104) crosses a first groove (103). Gate metal (107) is deposited on the surfaces in the openings (105) and emitter material (113) is deposited on the lands of the first surface (101) to form FED emitters in each opening (105).
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for an electron-emitting element which has high electron-emitting efficiency and is highly reliable. SOLUTION: The manufacturing method for an electron-emitting element includes: a first process of preparing a first conductive film on at least a side face of an insulating layer having an upper face and the side face connected with the upper face; a second process of preparing a second conductive film from above the upper face over to above the side face of the first conductive film on the first conductive film; and a third process of etching the second conductive film. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a highly reliable electron-emitting element having high electron-emitting efficiency and equipped with a resistive layer having sufficient resistivity while suppressing increase in an occupancy area. SOLUTION: The electron-emitting element has at least a cathode electrode, an electron-emitting body electrically connected to the cathode electrode, and the resistive layer formed between the cathode electrode and the electron-emitting body. The resistive layer is constituted of the same material as that of the electron-emitting body, and a membrane density of the resistive layer is lower than that of the electron-emitting body. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
A vacuum electron tube comprises at least one electron-emitting cathode and at least one anode arranged in a vacuum chamber, the cathode having a planar structure comprising a substrate comprising a conductive material, a plurality of nanotube or nanowire elements electrically insulated from the substrate, the longitudinal axis of the nanotube or nanowire elements substantially parallel to the plane of the substrate, and at least one first connector electrically linked to at least one nanotube or nanowire element so as to be able to apply a first electrical potential to the nanowire or nanotube element.
Abstract:
An electronic device including a first conducting layer, a second conducting layer, and an insulating layer provided between the conducting layers. At least one side wall extends from the first conducting layer to the second conducting layer and includes at least a portion of the first conducting layer, the second conducting layer and the insulating layer. A bias voltage is applied between the first and second conducting layers, wherein responsive to the bias voltage, a two dimensional electron system is induced at least in one of the first conducting layer and the second conducting layer, and wherein electrons from the two dimensional electron system are emitted from the side wall side wall as a result of Coulombic repulsion and travel in air from the one of the first conducting layer and the second conducting layer to the other of the first conducting layer and the second conducting layer.
Abstract:
A method of making a field emitter includes following steps. A carbon nanotube layer is provided, and the carbon nanotube layer includes a first surface and a second surface opposite to each other. A carbon nanotube composite layer is formed via electroplating a first metal layer on the first surface and electroplating a second metal layer on the second surface. A first carbon nanotube layer and a second carbon nanotube layer is formed by separating apart the carbon nanotube composite layer, wherein a fracture surface is formed in the carbon nanotube composite layer, a number of first carbon nanotubes in the first carbon nanotube layer are exposed from the fracture surface, and a number of second carbon nanotubes in the second carbon nanotube layer are exposed from the fracture surface.
Abstract:
A field emission device may comprise: an emitter comprising a cathode electrode and an electron emission source supported by the cathode electrode; an insulating spacer around the emitter, the insulating spacer forming an opening that is a path of electrons emitted from the electron emission source; and/or a gate electrode comprising a graphene sheet covering the opening. A method of manufacturing a gate electrode may comprise: forming a graphene thin film on one surface of a conductive film; forming a mask layer having an etching opening on another surface of the conductive film, wherein the etching opening exposes a portion of the conductive film; partially removing the conductive film through the etching opening to partially expose the graphene thin film; and/or removing the mask layer.
Abstract:
A method for producing an electron-emitting device includes forming a first conductive film on a side surface of an insulation layer including the side surface and a top surface connected to the side surface; forming a second conductive film from the top surface to the side surface and on the first conductive film; and etching the second electrically conductive film.