公开(公告)号：US20140307403A1

公开(公告)日：2014-10-16

申请号：US14314163

申请日：2014-06-25

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract translation: 该出版物公开了一种电路板结构和电子模块的制造方法，其中至少一个部件（6）嵌入在绝缘材料层（1）的内部，触点（14）被连接到组件 6）电连接到包含在电子模块中的导体结构（14,19）。 根据本发明，在组件（6）附近的绝缘材料层（1）中制造至少一个将组件（6）的热传导加热的热通孔（22）。

公开(公告)号：US20120155042A1

公开(公告)日：2012-06-21

申请号：US13278514

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K7/00

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.

Abstract translation: 微电子组件包括介电元件，第一和第二微电子元件，信号引线和一个或多个跳线。 电介质元件具有相对的第一和第二表面，并且第一和第二孔在表面之间延伸。 多个导电元件位于其上。 信号引线连接到一个或多个微电子元件，并且延伸通过第一或第二孔中的一个或多个到介电元件上的一些导电元件。 一个或多个跳线引线延伸穿过第一孔并且连接到第一微电子元件的触点。 一个或多个跨接线跨越第二孔并且连接到电介质元件上的导电元件。

公开(公告)号：US20120153435A1

公开(公告)日：2012-06-21

申请号：US13278506

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H01L29/02 ,  H01L23/538

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element having at least one aperture and electrically conductive elements thereon including terminals exposed at the second surface of the dielectric element; a first microelectronic element having a rear surface and a front surface facing the dielectric element, the first microelectronic element having a plurality of contacts exposed at the front surface thereof; a second microelectronic element having a rear surface and a front surface facing the rear surface of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element; and an electrically conductive plane attached to the dielectric element and at least partially positioned between the first and second apertures, the electrically conductive plane being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements.

Abstract translation: 微电子组件包括具有至少一个孔的电介质元件和其上的导电元件，其中包括在电介质元件的第二表面处暴露的端子; 第一微电子元件，其具有后表面和面向介电元件的前表面，所述第一微电子元件具有在其前表面处暴露的多个触点; 第二微电子元件，其具有背表面和面向第一微电子元件的后表面的前表面，第二微电子元件具有暴露在前表面处并突出超过第一微电子元件的边缘的多个触点; 以及连接到电介质元件并且至少部分地定位在第一和第二孔之间的导电平面，导电平面与第一或第二微电子元件中的至少一个的一个或多个触点电连接。

公开(公告)号：US20070210427A1

公开(公告)日：2007-09-13

申请号：US11372666

申请日：2006-03-10

Applicant: William Lytle ,  Scott Hayes ,  George Leal

Inventor： William Lytle ,  Scott Hayes ,  George Leal

IPC: H01L23/02

CPC classification number: H05K1/0271 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/5442 ,  H01L2223/5446 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/10507

Abstract: Methods and apparatus are provided for an electronic panel assembly (EPA) (82, 83), comprising: providing one or more electronic devices (30) with primary faces (31) having electrical contacts (36), opposed rear faces (33) and edges (32) therebetween. The devices (30) are mounted primary faces (31) down on a temporary support (60) in openings (44) in a warp control sheet (WCS) (40) attached to the support (60). Plastic encapsulation (50) is formed at least between lateral edges (32, 43) of the devices (30) and WCS openings (44). Undesirable panel warping (76) during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. After encapsulation cure, the EPA (82) containing the devices (30) and the WCS (40) is separated from the temporary support (60) and, optionally, mounted on another carrier (70) with electrical contacts (36) exposed. Thin film insulators (85) and conductors (87) are desirably applied to couple electrical contacts (36) on various devices (30) to each other and to external terminals (88), thereby forming an integrated multi-device EPA (84).

Abstract translation: 提供了一种用于电子面板组件（EPA）（82,83）的方法和装置，包括：为一个或多个电子设备（30）提供具有电触头（36），相对的后表面（33）和 其间的边缘（32）。 装置（30）在连接到支撑件（60）的经纱控制片（WCS）（40））的开口（44）中的主要面（31）向下安装在临时支撑件（60）上。 至少在装置（30）的横向边缘（32,43）和WCS开口（44）之间形成塑料封装（50）。 通过选择WCS热膨胀系数（CTE）小于封装CTE来减轻封装期间的不希望的面板翘曲（76）。 在封装固化之后，含有装置（30）和WCS（40）的EPA（82）与临时支撑件（60）分离，并且可选地安装在具有暴露的电触点（36）的另一个载体（70）上。 期望施加薄膜绝缘体（85）和导体（87）以将各种装置（30）上的电触头（36）彼此耦合到外部端子（88），从而形成集成的多装置EPA（84）。

公开(公告)号：US20240138066A1

公开(公告)日：2024-04-25

申请号：US18483929

申请日：2023-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Hideo NAKAGOSHI ,  Hiroki YOSHIMORI

IPC: H05K1/14 ,  H05K1/02

CPC classification number: H05K1/144 ,  H05K1/0203 ,  H05K2201/0379 ,  H05K2201/10507 ,  H05K2201/10977

Abstract: An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.

公开(公告)号：US11824429B2

公开(公告)日：2023-11-21

申请号：US17283738

申请日：2019-10-18

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kazuki Sasao ,  Masanori Hayashibara ,  Hideki Ito

IPC: H02M3/158 ,  H02M1/084 ,  H05K1/02

CPC classification number: H02M3/1584 ,  H02M1/084 ,  H05K1/0231 ,  H05K2201/10166 ,  H05K2201/10507

Abstract: A DC/DC converter includes N inductors and N power modules which correspond to N phases. The N inductors each include a plurality of inductor chips that are electrically connected in parallel to each other. The plurality of inductor chips are mounted separately on a main mounting surface and a sub-mounting surface of a printed circuit board. The sub-mounting surface is opposite to the main mounting surface.

公开(公告)号：US20180122596A1

公开(公告)日：2018-05-03

申请号：US15410943

申请日：2017-01-20

Applicant: PRIMAX ELECTRONICS LTD.

Inventor： Chien-Hung Liu

IPC: H01H13/81 ,  H01H3/12 ,  H01H13/52 ,  H05K1/18

CPC classification number: H01H13/81 ,  H01H3/12 ,  H01H13/52 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10507

Abstract: A keyboard includes a base plate, a pressure sensing layer, plural key structures, a circuit board, a flexible layer and a controlling unit. The pressure sensing layer is disposed on the base plate and located under the circuit board. The flexible layer is disposed on the pressure sensing layer and located under the circuit board. While a key structure is depressed, a part of the key structure is penetrated through the circuit board to press the flexible layer, and a force is transmitted from the flexible layer to the pressure sensing layer. The controlling unit compares the force with a predetermined force value. According to the comparing result, the controlling unit generates a corresponding pressure sensing signal. Consequently, the use of a single key structure can achieve the functions of multiple keys.

公开(公告)号：US09615468B2

公开(公告)日：2017-04-04

申请号：US14458232

申请日：2014-08-12

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K5/00 ,  H05K5/02 ,  B29C45/14 ,  H05K1/18 ,  H05K3/30 ,  H05K1/02 ,  F21V8/00 ,  D06F39/00

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface.

公开(公告)号：US09414497B2

公开(公告)日：2016-08-09

申请号：US14815184

申请日：2015-07-31

Applicant: Cisco Technology, Inc.

Inventor： Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

IPC: H01L29/06 ,  H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H01L23/24 ,  H01L23/31

CPC classification number: H05K1/183 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/095 ,  H05K2201/10492 ,  H05K2201/10507 ,  H01L2924/00

Abstract: An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.

Abstract translation: 一种装置包括形成在支撑结构中的空腔，所述支撑结构可操作以支撑半导体器件。 电路元件设置在支撑结构中的空腔中，并且支撑结构中的空腔填充有不导电的填充材料，以便至少部分地围绕电路元件与非导电填充材料。 半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。

公开(公告)号：US20150229021A1

公开(公告)日：2015-08-13

申请号：US14425277

申请日：2013-06-20

Applicant: DENSO CORPORATION

Inventor： Yasumune Yukizaki ,  Tadao Suzuki ,  Ryohei Kataoka ,  Yuji Sugimoto

IPC: H01Q1/32 ,  H01Q1/24 ,  H01Q1/42 ,  H05K1/18 ,  H05K5/00

CPC classification number: H01Q1/3275 ,  H01Q1/02 ,  H01Q1/241 ,  H01Q1/42 ,  H01Q9/42 ,  H05K1/181 ,  H05K5/003 ,  H05K2201/10098 ,  H05K2201/10507

Abstract: A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on a surface of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section implemented on the board at a position away from the base in the first direction.

Abstract translation: 车载天线装置包括基座，板，电路部分和壳体。 基座可安装在车辆的屋顶上。 该电路板具有天线元件部分，并且站在基座的表面上。 电路部分用作电连接到天线元件部分的无线通信电路的至少一部分。 壳体由树脂材料制成并形成车辆外形的突起。 板和电路部分位于由基座和壳体形成的空间中。 板位于基座的表面上，使得垂直于基座表面的第一方向与等于板的厚度方向的第二方向不同。 电路部分在基板上在第一方向上远离基座的位置处实现。