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公开(公告)号：KR101295705B1
公开(公告)日：2013-08-16
申请号：KR1020110038357
申请日：2011-04-25
Applicant: 도레이첨단소재 주식회사
IPC: C08L71/12 , C08G65/38 , C09D171/12 , C08J7/04
CPC classification number: C08G65/48 , C08G18/4879 , C08G2650/56 , C08L71/00 , C08L75/08 , Y10T428/1086 , Y10T428/269 , C08L75/16
Abstract: 본 발명은 투명 플라스틱기판용 페녹시수지 조성물 및 이를 이용한 투명 플라스틱 기판소재에 관한 것으로서, 보다 상세하게는 고분자로서 페녹시수지를 사용함으로써 내열성과 내화학성, 접착성이 우수하고 수분침투성과 선형열팽창계수가 낮아 종래의 유리기판을 효과적으로 대체할 수 있는 투명 플라스틱기판용 페녹시수지 조성물 및 이를 이용한 투명 플라스틱 기판소재에 관한 것이다. 이를 위해 본 발명에 따른 투명 플라스틱기판용 페녹시수지 조성물은 투명 플라스틱기판용 페녹시수지 조성물에 있어서, 하기 화학식 1의 화학구조를 갖는 페녹시수지를 포함하되,
(화학식 1)
인 것을 특징으로 하고, 또한 상기 페녹시수지 화학구조의 상기 n 값은 35 내지 400인 것을 특징으로 한다.-
公开(公告)号：KR1020120120643A
公开(公告)日：2012-11-02
申请号：KR1020110038357
申请日：2011-04-25
Applicant: 도레이첨단소재 주식회사
IPC: C08L71/12 , C08G65/38 , C09D171/12 , C08J7/04
CPC classification number: C08G65/48 , C08G18/4879 , C08G2650/56 , C08L71/00 , C08L75/08 , Y10T428/1086 , Y10T428/269 , C08L75/16
Abstract: PURPOSE: A phenoxy resin composition for transparent plastic board is provided to effectively replace glass substrate because of low thermal expansion coefficient because of excellent heat resistance, chemical resistance, and low moisture impregnation and linear thermal expansion coefficient. CONSTITUTION: A phenoxy resin composition comprises a phenoxy resin having a chemical structure indicated in chemical formula 1. A transparent plastic resin using the transparent plastic substrate resin composition is a thin film with a thickness of 0.1-500 micron is coated on a polymer substrate. The waste phenoxy resin composition additionally contains energy ray-curable acrylic oligomer or acrylic polymer resin. The weight average molecular weight of the phenoxy resin composition is 1,000-100,000.
Abstract translation: 目的：提供透明塑料板用苯氧基树脂组合物，由于耐热性，耐化学性，低水分浸渍性和线性热膨胀系数优异，因此热膨胀系数低，有效地代替玻璃基板。 构成：苯氧基树脂组合物包含具有化学式1所示化学结构的苯氧基树脂。使用透明塑料基材树脂组合物的透明塑料树脂是将厚度为0.1-500微米的薄膜涂覆在聚合物基材上。 废苯氧树脂组合物另外含有能量射线固化型丙烯酸低聚物或丙烯酸类聚合物树脂。 苯氧基树脂组合物的重均分子量为1,000-100,000。
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公开(公告)号：KR1020120084549A
公开(公告)日：2012-07-30
申请号：KR1020110005978
申请日：2011-01-20
Applicant: 도레이첨단소재 주식회사
IPC: C09J7/02 , C09J133/04 , C09J4/02 , H01L21/683
CPC classification number: C09J7/385 , C09J4/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J133/04 , C09J2201/606 , C09J2201/61 , C09J2203/30 , C09J2205/102 , H01L21/6835 , H01L21/6836
Abstract: PURPOSE: An adhesive sheet for electroplating semiconductor elements and a plating method of the semiconductor using the same are provided to obtain high chemical resistance, reliability, and workability. CONSTITUTION: An adhesive sheet for electroplating semiconductor elements comprises a substrate and an adhesive layer(2) which is formed on one or more sides of the substrate(1). The adhesive layer comprises a thermosetting acrylic adhesive resin and a thermosetting material including a thermosetting agent. A plating method of the semiconductor device lead frame comprises the following steps: compressing the adhesive sheet for the semiconductor device to a lead frame; plating the other side of the lead frame; and exfoliating the adhesive sheet for plating the semiconductor device from the lead frame.
Abstract translation: 目的：提供用于电镀半导体元件的粘合片和使用其的半导体的镀覆方法以获得高耐化学性，可靠性和可加工性。 构成：用于电镀半导体元件的粘合片包括衬底和形成在衬底（1）的一个或多个侧面上的粘合剂层（2）。 粘合剂层包括热固性丙烯酸粘合剂树脂和包含热固性剂的热固性材料。 半导体器件引线框架的电镀方法包括以下步骤：将半导体器件的粘合片压缩到引线框架; 电镀引线框架的另一面; 并且将用于将半导体器件电镀的粘合片从引线框架剥离。
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公开(公告)号：KR1020120084547A
公开(公告)日：2012-07-30
申请号：KR1020110005975
申请日：2011-01-20
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/04 , C09J4/02 , C09J7/02 , H01L21/683
CPC classification number: C09J133/04 , C09J4/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J7/385 , C09J7/40 , C09J2201/606 , C09J2201/61 , C09J2203/326 , H01L21/6835 , H01L21/6836
Abstract: PURPOSE: An adhesive sheet for electronic parts is provided to improve plasma resistance, heat resistance and dimensional stability. CONSTITUTION: An adhesive sheet for electronic parts comprises a heat-resistant substrate(1) and adhesive layers(2) formed in one or more sides of the heat-resistant substrate. The adhesive layer is composed of a composition including a thermosetting acrylic adhesive resin, a thermosetting material, an energy beam cure type acryl class oligomer resin and an energy beam initiator. The heat resistant material is one or more of films which are selected from polyester, polyimide, polyamide, polyether sulfone, polyphenylene sulfide, polyether ketone, polyether-ether-ketone, triacetyl cellulose, polyether imide, poly ethylene naphthalate, polypropylene and polycarbonate.
Abstract translation: 目的：提供电子部件用粘合片，以提高等离子电阻，耐热性和尺寸稳定性。 构成：用于电子部件的粘合片包括耐热基材（1）和形成在耐热基材的一个或多个侧面上的粘合剂层（2）。 粘合剂层由包含热固性丙烯酸粘合树脂，热固性材料，能量束固化型丙烯酸类低聚物树脂和能量束引发剂的组合物组成。 耐热材料是选自聚酯，聚酰亚胺，聚酰胺，聚醚砜，聚苯硫醚，聚醚酮，聚醚醚酮，三乙酰纤维素，聚醚酰亚胺，聚萘二甲酸乙二醇酯，聚丙烯和聚碳酸酯中的一种或多种。
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公开(公告)号：KR1020120081383A
公开(公告)日：2012-07-19
申请号：KR1020110002698
申请日：2011-01-11
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J109/02 , C09J11/00 , C09J7/02
CPC classification number: C09J163/00 , C09J7/22 , C09J7/35 , C09J11/00 , C09J109/02 , C09J2201/61 , C09J2203/30 , C09J2205/102
Abstract: PURPOSE: An adhesive composition for a halogen-free coverlay film is provided to have excellent conservation safety, not to need additional cost for storing a coverlay film, thereby capable of reducing cost. CONSTITUTION: An adhesive composition for a halogen-free coverlay film comprises a non-halogen-based epoxy resin, a carboxy group-containing acrylonitrile butadiene rubber, a hardener, 50-100.0 parts by weight of a latent hardener based on 100.0 parts by weight of the hardener, and non-halogen phosphorous-based flame retardant, and an inorganic filler. The non-halogen phosphorous-based epoxy resin comprises at least two epoxy groups per a molecule. The equivalent ratio of the non-halogen phosphorous-based epoxy resin is 230-1000 g/eq. The hardener is a mixture of two or more selected from an amine based resin, an acid anhydride based resin, or a phenol resin.
Abstract translation: 目的：提供一种无卤素覆盖膜用粘合剂组合物以具有优异的保存安全性，而不需要额外的成本来存储覆盖膜，从而能够降低成本。 构成：用于无卤素覆盖膜的粘合剂组合物包括非卤素类环氧树脂，含羧基的丙烯腈丁二烯橡胶，硬化剂，50-100.0重量份基于100.0重量份的潜在硬化剂 的固化剂和非卤素磷系阻燃剂，以及无机填料。 非卤素磷系环氧树脂每分子含有至少两个环氧基。 无卤磷系环氧树脂的当量比为230〜1000g / eq。 固化剂是选自胺系树脂，酸酐系树脂或酚醛树脂中的两种以上的混合物。
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Patent Agency Ranking
公开(公告)号：KR101132346B1
公开(公告)日：2012-04-05
申请号：KR1020100008320
申请日：2010-01-29
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/08 , C09J4/02 , C09J7/02 , H01L21/30
Abstract: PURPOSE: An adhesive composition is provided to prevent the deformation of an adhesive layer with no interaction with a resin sealant and to avoid dishift and moldflash by the resin sealing temperature and pressure. CONSTITUTION: An adhesive composition for a fan-out wafer level package comprises 100.0 parts by weight of acrylic copolymers, 0.1~20 parts by weight of thermosetting materials, 0.2-10 parts by weight of energy beam-curable acrylic oligomer, and 0.05-15 parts by weight of photoinitiators. The molecular weight of the acrylic copolymer is 400,000~4,000,000 g/mol. The photoinitiator is one or more selected from the group consisting of phenyl glyoxylate- and acyl phosphine oxide-based photoinitiators.
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公开(公告)号：KR1020110121195A
公开(公告)日：2011-11-07
申请号：KR1020100040676
申请日：2010-04-30
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/04 , C09J4/02 , C09J7/02 , B32B7/06
CPC classification number: C09J133/04 , B32B7/06 , C09J4/00 , C09J7/22 , C09J7/38 , C09J7/385 , C09J2201/606 , C09J2203/30 , C09J2205/10
Abstract: PURPOSE: A processing film for a film assist mold is provided to avoid the damage from working resistance and impact and a cleaning process for preventing the contamination of a matrix when applied to a mold matrix such as compression molding. CONSTITUTION: A processing film for a film assist mold has a bilayered structure which forms a base film and an adhesive layer having releasability on the base film. The elongation rate of the base film is 150~300%. The one side of the processing film is treated by a primer. The adhesive layer having releasability is coated by an adhesive composition including an acryl-based polymer, UV curable acrylate oligomer, photoinitiator and hardener.
Abstract translation: 目的：提供一种用于胶片辅助模具的加工膜，以避免工作阻力和冲击的损害，以及用于防止当被施加到诸如压缩成型的模具基体时对基体的污染的清洁过程。 构成：用于胶片辅助模具的加工膜具有双层结构，其形成基膜和在基膜上具有剥离性的粘合剂层。 基膜的伸长率为150〜300％。 处理膜的一面用底漆处理。 具有脱模性的粘合剂层通过包含丙烯酸类聚合物，UV固化丙烯酸酯低聚物，光引发剂和硬化剂的粘合剂组合物涂布。
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公开(公告)号：KR1020110119013A
公开(公告)日：2011-11-02
申请号：KR1020100038470
申请日：2010-04-26
Applicant: 도레이첨단소재 주식회사
IPC: H01L21/50
Abstract: PURPOSE: A method for manufacturing a fan out type wafer level package is provided to secure dimensional stability by forming an adhesive layer which is robust against shear stress. CONSTITUTION: An auxiliary device(1) laminates and fixes an adhesive tape. A carrier(2) supporting the adhesive tape is located under the auxiliary device. The adhesive tape includes a single structure with a die bonding surface adhesive layer(3) on a base film(4) or a double sided structure with the die bonding surface adhesive layer and a carrier surface adhesive layer(5) on both sides of the base film. The inner diameter of the auxiliary device is larger than the outer diameter of the carrier.
Abstract translation: 目的：提供一种用于制造扇出型晶片级封装的方法，以通过形成对剪切应力鲁棒的粘合剂层来确保尺寸稳定性。 构成：辅助装置（1）层叠并固定胶带。 支撑粘合带的载体（2）位于辅助装置下方。 胶带包括在基膜（4）上具有芯片接合表面粘合剂层（3）的单一结构或具有芯片粘合表面粘合剂层的双面结构和在两个侧面上的载体表面粘合剂层（5） 底片 辅助装置的内径大于载体的外径。
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公开(公告)号：KR1020110105449A
公开(公告)日：2011-09-27
申请号：KR1020100024570
申请日：2010-03-19
Applicant: 도레이첨단소재 주식회사
IPC: H01L31/04
CPC classification number: H01G9/2009 , H01G9/2031 , H01G9/2059 , Y02E10/542 , Y02P70/521
Abstract: 본 발명은 염료감응태양전지용 고분자전해질 및 이를 이용한 염료감응태양전지의 제조방법에 관한 것으로서, 보다 상세하게는 종래의 액상전해질을 사용하는 염료감응태양전지의 최대 단점인 누액을 원천적으로 방지할 수 있을 뿐만 아니라, 종래의 고분자전해질과 비교해 높은 광전환효율을 나타내고, 대면적의 염료감응태양전지나 플렉시블(flexible) 염료감응태양전지의 제조공정에 적용할 수가 있는 등의 우수한 염료감응태양전지용 고분자전해질 및 이를 이용한 염료감응태양전지의 제조방법에 관한 것이다. 이를 위해 본 발명에 따른 염료감응태양전지용 고분자전해질은 열경화형 에폭시수지, 이미다졸계 경화촉진제 및 금속염을 포함하는 것을 특징으로 하고, 염료감응태양전지용 고분자전해질을 이용한 염료감응태양전지의 제조방법은 상기 염료감응태양전지용 고분자전해질을 사용하되, 상기 염료감응태양전지용 고분자전해질을 작동전극과 상대전극간의 접착물로 이용하고 최종적인 접합의 형태가 고체상을 유지하는 것을 특징으로 한다.
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公开(公告)号：KR1020110088698A
公开(公告)日：2011-08-04
申请号：KR1020100008320
申请日：2010-01-29
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/08 , C09J4/02 , C09J7/02 , H01L21/30
CPC classification number: C09J133/08 , C09J4/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J7/385 , C09J7/40 , C09J2203/326 , H01L21/30
Abstract: PURPOSE: An adhesive composition is provided to prevent the deformation of an adhesive layer with no interaction with a resin sealant and to avoid dishift and moldflash by the resin sealing temperature and pressure. CONSTITUTION: An adhesive composition for a fan-out wafer level package comprises 100.0 parts by weight of acrylic copolymers, 0.1~20 parts by weight of thermosetting materials, 0.2-10 parts by weight of energy beam-curable acrylic oligomer, and 0.05-15 parts by weight of photoinitiators. The molecular weight of the acrylic copolymer is 400,000~4,000,000 g/mol. The photoinitiator is one or more selected from the group consisting of phenyl glyoxylate- and acyl phosphine oxide-based photoinitiators.
Abstract translation: 目的：提供粘合剂组合物，以防止与树脂密封剂无相互作用的粘合剂层的变形，并且通过树脂密封温度和压力避免冷却和吹塑。 构成：用于扇出晶片级封装的粘合剂组合物包含100.0重量份的丙烯酸共聚物，0.1〜20重量份的热固性材料，0.2-10重量份的能量束固化的丙烯酸低聚物和0.05-15 重量份的光引发剂。 丙烯酸共聚物的分子量为400,000〜4,000,000g / mol。 光引发剂是选自苯基乙醛酸酯化物和酰基氧化膦类光引发剂中的一种或多种。
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