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公开(公告)号：KR1020110090099A
公开(公告)日：2011-08-10
申请号：KR1020100009685
申请日：2010-02-02
Applicant: 삼성전기주식회사
CPC classification number: H01G7/00 , H01G9/058 , H01G11/26 , H01G11/28 , H01G11/38 , H01G11/70 , Y02E60/13 , Y02T10/7022 , Y10T29/43
Abstract: PURPOSE: An electric double layer capacitor and a method for manufacturing the same are provided to implement a thin electrode since there is no need to install a current collector. CONSTITUTION: In an electric double layer capacitor and a method for manufacturing the same, first and the second electrodes(10A, 10B) are faced with each other. An ion permeability separation film(20) is arranged between the first electrode and the second electrode. One of the first electrode and the second electrode includes comprise compressed metal fibers(11a, 11b) to have the air gap therein and also includes an electrode material filled into a air gap.
Abstract translation: 目的：提供双电层电容器及其制造方法来实现薄电极，因为不需要安装集电器。 构成：在双电层电容器及其制造方法中，第一和第二电极（10A，10B）彼此面对。 在第一电极和第二电极之间布置有离子渗透性分离膜（20）。 第一电极和第二电极中的一个包括压缩金属纤维（11a，11b），其中具有气隙，并且还包括填充到气隙中的电极材料。
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公开(公告)号：KR1020110077788A
公开(公告)日：2011-07-07
申请号：KR1020090134449
申请日：2009-12-30
Applicant: 삼성전기주식회사
CPC classification number: H01B1/22 , H01G4/0085 , H01G4/30 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49117 , Y10T29/49155
Abstract: PURPOSE: A conductive paste composition is provided to manufacture a multilayer ceramic capacitor with excellent reliability and to facilitate proper viscosity control according to various printing methods such as screen printing or gravure printing. CONSTITUTION: A conductive paste composition for distributed inner electrodes includes: 100 parts by weight of metal powder in which the average particle diameter is 50-300 nm; and 4-10 parts by weight of a binder resin. The binder resin includes one or more resins selected from the group consisting of a polyvinylbutyral resin of high molecular weight with average molecular weight of 250,000-400,000, a polyvinyl butyral resin of low molecular weight with average molecular weight of 50,000-150,000, and rosin esters.
Abstract translation: 目的：提供导电糊剂组合物以制造具有优异可靠性的多层陶瓷电容器，并且可以根据各种印刷方法如丝网印刷或凹版印刷来促进适当的粘度控制。 构成：用于分布式内电极的导电糊组合物包括：平均粒径为50-300nm的金属粉末100重量份; 和4-10重量份的粘合剂树脂。 粘合剂树脂包括一种或多种选自平均分子量为25万至40万的高分子量聚乙烯醇缩丁醛树脂，平均分子量为50,000-150,000的低分子量聚乙烯醇缩丁醛树脂和松香酯 。
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公开(公告)号：KR101024940B1
公开(公告)日：2011-03-31
申请号：KR1020090008581
申请日：2009-02-03
Applicant: 삼성전기주식회사
IPC: H01G11/30
CPC classification number: H01G11/32 , H01G11/46 , Y02E60/13 , Y10T29/417
Abstract: 탄소 에어로젤 음극과 표면 산화된 전이금속질화물 에어로젤 양극을 사용하는 것을 특징으로 하는 하이브리드 수퍼커패시터가 개시된다. 상기 하이브리드 수퍼커패시터는 하이브리드 타입의 수퍼커패시터가 가지고 있는 장점인 전체 셀 포텐셜 증가에 따른 에너지 및 출력 밀도의 증가라는 장점을 그대로 가지면서, 전류집전체 및 바인더 없는 일체형의 전극을 사용함으로써 전극 내부저항 및 ESR(Equivalent Series Resistance)을 최소화 할 수 있다.
하이브리드 수퍼커패시터, 전이금속질화물-
公开(公告)号：KR1020110028135A
公开(公告)日：2011-03-17
申请号：KR1020090086085
申请日：2009-09-11
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A chip-type electric double layer capacitor and a manufacturing method thereof are provided to simplify the surface mounting process by applying the batch mounting technology using the solder method. CONSTITUTION: An external case(110) is made of the insulating resin and has the receiving space inside. A first external terminal(120a) and a second external terminal are buried in the case. The first and second external terminals connect the outer surface of the external case and the receiving space inside. Glue layers(115a, 115b) cover the boundary face of the first and second external terminals and the external case.
Abstract translation: 目的：提供一种芯片式双电层电容器及其制造方法，通过使用焊料法进行批量安装技术来简化表面安装工艺。 构成：外壳（110）由绝缘树脂制成，内部有接收空间。 第一外部端子（120a）和第二外部端子被埋在壳体中。 第一和第二外部端子将外壳的外表面和内部的接收空间连接起来。 胶层（115a，115b）覆盖第一和第二外部端子和外部壳体的边界面。
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公开(公告)号：KR1020110025463A
公开(公告)日：2011-03-10
申请号：KR1020090083543
申请日：2009-09-04
Applicant: 삼성전기주식회사
CPC classification number: H01G9/155 , H01G9/016 , H01G9/10 , H01G11/52 , H01G11/74 , H01G11/80 , H01G11/82 , H01G11/84 , Y02E60/13 , Y10T29/417
Abstract: PURPOSE: An array type chip resistor is provided to apply surface mounting technology by supplying a chip type electric double layer capacitor. CONSTITUTION: In an array type chip resistor, two electrodes(110,120) has electric terminal which is protruded from both sides respectively. A first separator(130) is arranged between two between electrodes. A second separator(140) is opposite to the first separator. An electric double layer part(100) comprises two electrodes, the first separator, and the second separator. A package houses the electric double layer.
Abstract translation: 目的：提供阵列型片式电阻器，通过提供片式双电层电容器来施加表面贴装技术。 构成：在阵列式片式电阻器中，两个电极（110,120）分别具有从两侧突出的电端子。 第一分离器（130）布置在两个电极之间。 第二分离器（140）与第一分离器相对。 电双层部分（100）包括两个电极，第一隔板和第二隔板。 一个包装包含电双层。
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Patent Agency Ranking
公开(公告)号：KR100999919B1
公开(公告)日：2010-12-13
申请号：KR1020080088414
申请日：2008-09-08
Applicant: 삼성전기주식회사
CPC classification number: H05K3/207 , H05K3/125 , H05K3/383 , H05K3/385 , H05K3/389 , H05K2201/015 , H05K2203/013 , H05K2203/095 , H05K2203/1173 , Y10T29/49155
Abstract: 인쇄회로기판 제조 방법이 개시된다. 캐리어(carrier)에 잉크젯(ink jet) 방식으로 전도성 잉크를 토출하여 회로 패턴을 형성하는 단계, 회로 패턴을 가열하여 소결하는 단계, 및 회로 패턴이 절연층에 매립되도록 절연층에 캐리어를 적층하여, 절연층에 회로 패턴을 전사하는 단계를 포함하는 인쇄회로기판 제조 방법은, 잉크젯 방식으로 회로 패턴을 미세하고 정밀하게 형성할 수 있고, 회로 패턴과 절연층 간의 접착력을 향상시킬 수 있다.
인쇄회로기판, 잉크젯, 전사-
公开(公告)号：KR1020100095947A
公开(公告)日：2010-09-01
申请号：KR1020090015008
申请日：2009-02-23
Applicant: 삼성전기주식회사
CPC classification number: H01G9/155 , H01G9/016 , H01G9/10 , H01G11/12 , H01G11/82 , Y02E60/13 , Y02T10/7022
Abstract: PURPOSE: An electric double layer capacitor package is provided to reduce thickness by arranging an electric double layer capacitor on the groove region of a package main body. CONSTITUTION: A package main body(101) has a groove region. An electric double layer capacitor is arranged in the groove region of the package main body. The electric double layer capacitor comprises a first and a second electrode(102,104) and an ion permeability separation film(103). The ion permeability separation film is formed between the first and the second electrode. A first and a second conductive via(107,108) are formed in the package main body. One end of the first and the second conductive via is connected to the first and the second electrode. The other end of the first and the second conductive via is extended towards the lower part of the package main body.
Abstract translation: 目的：提供双层电容器封装以通过在封装主体的沟槽区域上布置双电层电容器来减小厚度。 构成：包装体主体（101）具有沟槽区域。 在封装主体的沟槽区域中布置双电层电容器。 双电层电容器包括第一和第二电极（102,104）和离子透过性分离膜（103）。 离子透过率分离膜形成在第一和第二电极之间。 第一和第二导电通孔（107,108）形成在封装主体中。 第一和第二导电通孔的一端连接到第一和第二电极。 第一和第二导电通孔的另一端朝向封装主体的下部延伸。
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公开(公告)号：KR1020100030071A
公开(公告)日：2010-03-18
申请号：KR1020080088845
申请日：2008-09-09
Applicant: 삼성전기주식회사
CPC classification number: H05K3/107 , H05K3/125 , H05K3/386 , H05K2201/0129 , H05K2203/013 , H05K2203/0278 , H05K2203/1131
Abstract: PURPOSE: A printed circuit board and a method of manufacturing the same are provided to form a fine pattern by discharging a conductive Ink on an insulating layer. CONSTITUTION: A thermoplastic fiber layer is provided on a base substrate(S110). The thermoplastic fiber layer is surface-treated(S120). A circuit pattern is formed by discharging a conductive ink on the thermoplastic fiber layer through an ink jet mode(S130). The circuit pattern is heated by the temperature lower than a melting point of the thermoplastic fiber layer(S140). The circuit pattern is sintered(S150). A part of the circuit pattern is buried to the thermoplastic fiber layer by pressurizing the circuit pattern to the thermoplastic fiber layer(S160).
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以通过在绝缘层上放电导电墨来形成精细图案。 构成：在基底基板上设置热塑性纤维层（S110）。 对热塑性纤维层进行表面处理（S120）。 通过喷墨模式在热塑性纤维层上排出导电油墨形成电路图案（S130）。 电路图案被加热到比热塑性纤维层的熔点低的温度（S140）。 电路图案烧结（S150）。 通过将电路图案加压到热塑性纤维层，电路图案的一部分被埋入到热塑性纤维层中（S160）。
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公开(公告)号：KR1020100029579A
公开(公告)日：2010-03-17
申请号：KR1020080088414
申请日：2008-09-08
Applicant: 삼성전기주식회사
CPC classification number: H05K3/207 , H05K3/125 , H05K3/383 , H05K3/385 , H05K3/389 , H05K2201/015 , H05K2203/013 , H05K2203/095 , H05K2203/1173 , Y10T29/49155
Abstract: PURPOSE: A method of manufacturing a printed circuit board is provided to increase the adhesive force of an insulating layer and a circuit pattern by forming an adhesive layer on the circuit pattern after surface treatment of the circuit pattern. CONSTITUTION: A carrier is surface-treated(S100). A conductive ink is discharged in the carrier through an ink jet mode and a circuit pattern is formed(S110). The circuit pattern is heated and is sintered(S120). The circuit pattern is surface-treated in order to increase the adhesive force of the insulating layer and a circuit pattern(S130). The bonding layer is formed in the circuit pattern in order to increase the adhesive force of the insulating layer and circuit pattern(S140). The circuit pattern is transferred in the insulating layer by laminating the carrier in the insulating layer(S150). The carrier is separated from the insulating layer(S160).
Abstract translation: 目的：提供一种制造印刷电路板的方法，通过在电路图案的表面处理之后在电路图案上形成粘合剂层来增加绝缘层和电路图案的粘合力。 构成：对载体进行表面处理（S100）。 导电油墨通过喷墨模式在载体中排出并形成电路图案（S110）。 将电路图案加热并烧结（S120）。 对电路图案进行表面处理以增加绝缘层的粘附力和电路图案（S130）。 为了增加绝缘层和电路图案的粘合力，结合层形成在电路图案中（S140）。 电路图案通过在绝缘层中层叠载体而转移到绝缘层中（S150）。 载体与绝缘层分离（S160）。
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公开(公告)号：KR1020090120334A
公开(公告)日：2009-11-24
申请号：KR1020080046314
申请日：2008-05-19
Applicant: 삼성전기주식회사
IPC: H05K3/10
CPC classification number: H05K3/1258 , H05K3/125 , H05K2201/09909 , H05K2203/013 , H05K2203/1173
Abstract: PURPOSE: A method for forming a printed circuit pattern, a method for forming a guide, and an ink for forming the guide are provided to improve an aspect ratio by using an ink for forming a guide having a slip property. CONSTITUTION: A method for forming a printed circuit pattern comprises the following steps: a step for forming a guide through an ink for forming the guide having a slip property(102); a step for performing an in-situ ultraviolet hardening about the formed guide; and a step for forming a printed circuit pattern through a metal ink inside the hardened guide(103).
Abstract translation: 目的：提供一种用于形成印刷电路图案的方法，用于形成引导件的方法和用于形成引导件的墨水，以通过使用用于形成具有滑动性质的引导件的墨水来改善纵横比。 构成：用于形成印刷电路图案的方法包括以下步骤：用于通过用于形成具有滑动特性（102）的引导件的油墨形成引导件的步骤; 对形成的引导件进行原位紫外线硬化的步骤; 以及通过硬化导向件（103）内部的金属墨形成印刷电路图案的步骤。
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