Abstract:
주변 영역의 비트 라인의 두께를 증가시킴과 동시에, 상기 비트 라인 하부에 배치되는 게이트 패턴과의 단락 마진(short margin)을 확보할 수 있는 비휘발성 메모리 소자 제보 방법을 제공하는 것이다. 상기 비휘발성 메모리 소자 제조 방법은 기판 상의 제1 영역에 트랜지스터를 형성하고, 상기 트랜지스터와 연결되는 컨택을 형성하고, 상기 기판의 제2 영역 상에 2차원적으로 배치된 메모리 셀을 형성하고, 상기 콘택과 상기 정보 저장부를 덮는 정지막과 층간 절연막을 순차적으로 형성하고, 상기 콘택 상에 상기 정지막을 노출시키는 제1 트렌치로서, 상기 제1 트렌치의 하면은 상기 정보 저장부의 하면보다 낮게 형성되고, 상기 정지막을 관통하여 상기 콘택을 노출시키는 제2 트렌치를 형성하는 것을 포함한다.
Abstract:
In a method of manufacturing a semiconductor device, an interlayer dielectric is formed on a substrate. A first trench is formed by partly removing the interlayer dielectric. A mask layer which has a first thickness from the bottom of the first trench is formed by burying the first trench. The sidewall of the first trench is partly exposed by partly etching the mask layer. A part which is adjacent to the exposed sidewall forms a mask which has a second thickness which is thinner than the first thickness. The interlayer dielectric is partly removed by using the mask as an etch mask to form a second trench which is connected to the first trench. A conductive pattern which buries the first trench and the second trench is formed.
Abstract:
A magnetic device comprises a first magnetization layer, a second magnetization layer, a first tunneling barrier layer disposed between the first magnetization layer and the second magnetization layer and having first thickness, and a first insulating part disposed in a side of the first tunneling barrier layer and having thickness greater than the first thickness.
Abstract:
PURPOSE: A data storage device and a manufacturing method thereof are provided to prevent the degradation of a data storage unit due to a high temperature process. CONSTITUTION: A substrate includes a cell region and a peripheral circuit region. A data storage unit is located on the cell region. First bit lines (151) are connected to the data storage unit. First contacts (121) are connected to a peripheral transistor on the peripheral circuit region. Second bit lines (153) are arranged on the first contacts and are connected to the first contacts. The bottom of the second bit line is lower than the bottom of the data storage unit.
Abstract:
An operation method of the phase change memory device is provided, which recovers the phase-change layer to the steady-state by authorizing the treatment voltage greater than the reset voltage to the phase-change layer. An operation method of the phase change memory device authorizes the treatment voltage which is greater than the reset voltage to the phase-change layer. The authentication hour of the treatment voltage is longer than the authentication hour of the reset voltage. The intensity of the treatment voltage is 1.1 times or greater of the reset voltage. The authentication hour of the treatment voltage is one micro-second or greater. The treatment voltage is one pulse voltage. The treatment voltage comprises two or more pulse voltages which are consecutively applied.
Abstract:
A phase change material doped with Se and a PRAM comprising the same are provided to secure thermal stability at the temperature of 160 °C and more. A first and second impurity regions(S1,D1) doped with an n type impurity are defined on a substrate(40) of a p type. A gate insulating layer(42) and a gate electrode(44) are sequentially laminated on the semiconductor substrate between the first and second impurity regions. A first interlayer dielectric(46) is formed on the substrate. A contact hole is formed to expose the first impurity region. The first contact plug is filled with a conductive plug(50). A lower electrode is formed to cover the exposed part of the conductive plug. A second interlayer dielectric(62) is formed to cover the lower electrode. A via hole(h2) is formed to expose the lower electrode. The via hole is filled with a lower electrode contact layer(64). A phase change layer(66) is formed to cover the exposed part of the lower electrode contact layer. An upper electrode(68) is formed on the phase change layer.
Abstract:
A phase change memory device having a broad contact area between a lower electrode contact layer and a phase change layer is provided to avoid a contact defect like delamination between a lower electrode contact layer and a phase change layer in a repetitive writing operation by increasing a contact area between the lower electrode contact layer and the phase change layer. A phase change memory device includes a storage node and a switching device connected to a lower electrode contact layer(60) filled in a via hole(58), wherein the storage node includes the lower electrode contact layer, a phase change layer(62) and an upper electrode layer. The lower electrode contact layer has a protrusion part(60a) protruding to the phase change layer. The protrusion part can be extended to the circumference of the via hole. The switching device can be a transistor or a diode.
Abstract:
본 발명은 네트워크의 성능 데이터를 수집하는 네트워크 관리 장치 및 방법에 관한 것으로, 관리대상이 되는 네트워크 장치로부터의 성능 데이터 수집이 실패한 경우, 해당 네트워크 장치로부터의 성능 데이터 수집을 재시도함으로써 네트워크 장치의 성능 데이터와 네트워크 관리 장치의 성능 데이터간의 불일치가 발생하는 것을 방지할 수 있다.
Abstract:
소스 라인 구동 신호의 출력 타이밍을 조절할 수 있는 액정 표시 장치의 소스 드라이버가 제공된다. 소스 드라이버는 다수의 출력 회로들을 포함하고, 각각의 출력 회로들은 출력 버퍼 및 스위치를 포함한다. 출력 버퍼는 아날로그 영상 신호를 증폭하고, 스위치는 제어 신호의 활성화에 응답하여, 출력 버퍼에 의해 증폭된 아날로그 영상 신호를 출력 타이밍이 조절된 소스 라인 구동 신호로서 출력한다. 소스 드라이버는 출력 회로의 스위치를 제어하는 제어 신호의 지연 시간을 조절할 수 있으므로 소스 라인 구동 신호의 출력 타이밍을 조절할 수 있다.