Lithographic projection apparatus and device manufacturing method

    公开(公告)号:US09639006B2

    公开(公告)日:2017-05-02

    申请号:US14624118

    申请日:2015-02-17

    CPC classification number: G03F7/70341 G03F7/70258 G03F7/709

    Abstract: A lithographic projection apparatus is disclosed where at least part of a space between a projection system of the apparatus and a substrate is filled with a liquid by a liquid supply system. The projection system is separated into two separate physical parts. With substantially no direct connection between the two parts of the projection system, vibrations induced in a first of the two parts by coupling of forces through the liquid filling the space when the substrate moves relative to the liquid supply system affects substantially only the first part of the projection system and not the other second part.

    Computational wafer inspection
    65.
    发明授权
    Computational wafer inspection 有权
    计算晶圆检查

    公开(公告)号:US09507907B2

    公开(公告)日:2016-11-29

    申请号:US14730993

    申请日:2015-06-04

    Abstract: Disclosed herein is a computer-implemented defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method comprising: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; and determining or predicting, using the actual value, an existence, a probability of existence, a characteristic, or a combination selected therefrom, of a defect produced from the hot spot with the device manufacturing process.

    Abstract translation: 这里公开了一种用于设备制造过程的计算机实现的缺陷预测方法,该方法涉及将设计布局的一部分处理到衬底上,所述方法包括:从所述设计布局的所述部分中识别热点; 确定所述热点的装置制造过程的处理参数的值的范围,其中当所述处理参数具有超出所述范围的值时,通过所述装置制造过程从所述热点产生缺陷; 确定处理参数的实际值; 并且使用实际值确定或预测由设备制造过程产生的缺陷产生的缺陷的存在,存在概率,特征或其选择的组合。

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