公开(公告)号：JPH1062275A

公开(公告)日：1998-03-06

申请号：JP16956997

申请日：1997-06-11

Applicant: XEROX CORP

Inventor： PEETERS ERIC ,  KUBBY JOEL A ,  HUBBLE FRED F III ,  WALLACE STANLEY J ,  WERNER ALAN J JR ,  VITURRO ENRIQUE R

IPC: G01L5/00 ,  B81B3/00 ,  G01B7/06 ,  G01N19/02 ,  G01N33/34

Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive sheet processing system wherein sheet characteristics are detected, setting of a sheet transfer mechanism is adjusted based on the sheet characteristics, and characteristics such as speed and intervals for handling sheets are optimized. SOLUTION: A sensor system 200 for measuring sheet characteristics includes a diaphragm 202. The diaphragm 202 includes a first pair of piezo resistors A1, A2 and a second pair of piezo resistors B1, B2. The first pair of piezo resistors A1, A2 are placed orthogonally and closely to sides 204, 206 of the diaphragm 202. The second pair of piezo resistors B1, B2 are placed between the first pair, in parallel to them and separately from sides 208, 210 of the diaphragm 202. If the first pair of the piezo resistors A1, A2 are equilibrated with the second pair of piezo resistors B1, B2 in a Wheatstone's bridge, voltage proportional to a thickness of a sheet is caused. When the resistors of the first pair are equilibrated and the resistors of the second pair are equilibrated respectively, voltage indicating a coefficient of friction of the sheet is caused.

公开(公告)号：JP2006285242A

公开(公告)日：2006-10-19

申请号：JP2006086945

申请日：2006-03-28

Applicant: Xerox Corp ,  ゼロックス コーポレイションXerox Corporation

Inventor： WANG YAO RONG ,  KUBBY JOEL A

IPC: G02B26/00 ,  G02B5/08 ,  H01L31/0232 ,  H01S5/183

CPC classification number: G02B26/001 ,  G01J3/02 ,  G01J3/0256 ,  G01J3/26 ,  G02B6/4204

Abstract: PROBLEM TO BE SOLVED: To provide a uniform and high reflectance over the entire optical band of a distributed Bragg reflector, because it is necessary to measure respective layer thicknesses of the distributed Bragg reflector, when the distributed Bragg reflector is to be formed. SOLUTION: The respective layer thicknesses of the distributed Bragg reflector are measured with λ 0 /4n, where λ 0 represents the central wavelength of the optical band and n represents the refractive index of light in the layer material. By using this method, the reflectance of the distributed Bragg reflector is enhanced at a wavelength close to λ 0 , but the reflectance at a wavelength far from λ 0 , for example at a wavelength adjacent to the central wavelength, cannot be enhanced to a required level. The distributed Bragg reflector includes a first layer formed to be a first thickness, and a second layer formed to be a second thickness. The method of forming the distributed Bragg reflector includes a step for forming the first layer to be the first thickness and a step for forming the second layer to be the second thickness. The first and second thicknesses are determined by using a wavelength that is adjacent to the center wavelength of an optical band of the distributed Bragg reflector. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了在分布布拉格反射器的整个光学带上提供均匀和高反射率，因为需要测量分布式布拉格反射器的各层厚度，当分布式布拉格反射器将要形成时 。 解决方案：分布式布拉格反射器的各层厚度用λ 0 / 4n测量，其中λ 0 表示光带的中心波长，n表示 层材料中的光的折射率。 通过使用该方法，分布式布拉格反射器的反射率在接近λ 0 的波长处增强，但是在远离λ 0 的波长处的反射率，例如在 与中心波长相邻的波长不能增强到所需的水平。 分布式布拉格反射器包括形成为第一厚度的第一层和形成为第二厚度的第二层。 形成分布式布拉格反射器的方法包括形成第一层的第一厚度的步骤和用于形成第二层的第二厚度的步骤。 通过使用与分布式布拉格反射器的光学带的中心波长相邻的波长来确定第一和第二厚度。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005208638A

公开(公告)日：2005-08-04

申请号：JP2005006110

申请日：2005-01-13

Applicant: Xerox Corp ,  ゼロックス コーポレイションXerox Corporation

Inventor： KUBBY JOEL A ,  WANG YAO RONG

IPC: G02B6/13 ,  G02B6/12 ,  G02B6/136

CPC classification number: G02B6/136 ,  G02B2006/12097

Abstract: PROBLEM TO BE SOLVED: To reduce an optical loss of the light propagated through a silicon rib waveguide. SOLUTION: A method of fabricating the silicon rib waveguide for a micro-optical device comprises steps of: preparing silicon-on-insulator structure having a single crystal silicon wafer with a surface thereof being bonded to a surface of a silicon wafer by a layer of an insulative bonding material; patterning a surface of the single crystal silicon wafer opposite to the above surface bonded to the surface of the silicon wafer to form at least one silicon rib waveguide having a side wall opposite to the top surface and an end wall; and forming a silicon nitride cladding layer having predetermined thickness on the top surface, the opposite side wall, and the end wall of at least one silicon rib. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：减少通过硅肋波导传播的光的光损耗。 解决方案：制造用于微光学器件的硅肋波导的方法包括以下步骤：制备具有单晶硅晶片的绝缘体上硅结构，其单晶硅晶片的表面通过 一层绝缘接合材料; 将与所述上表面相对的所述单晶硅晶片的与所述硅晶片表面相接合的表面形成至少一个具有与所述顶表面相对的侧壁和端壁的硅肋波导; 以及在至少一个硅肋的顶表面，相对侧壁和端壁上形成具有预定厚度的氮化硅覆层。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004287431A

公开(公告)日：2004-10-14

申请号：JP2004070776

申请日：2004-03-12

Applicant: Xerox Corp ,  ゼロックス コーポレイションXerox Corporation

Inventor： KUBBY JOEL A ,  FEINBERG KATHLEEN A ,  GERMAN KRISTINE A ,  GULVIN PETER M ,  MA JUN ,  LIN PINYEN

IPC: G02B26/02 ,  B81B3/00 ,  G02B6/12 ,  G02B6/35

CPC classification number: G02B6/3508 ,  G02B6/356 ,  G02B6/358 ,  G02B2006/12145

Abstract: PROBLEM TO BE SOLVED: To reduce the whole dimension of a chip of a micro-electromechanical system (MEMS) switch and a waveguide into the order of centimeter. SOLUTION: An optical multistate latching switch 100 includes one or more drive actuators 130, one or more latch actuators 120 having correlated teeth, an elastic cantilever platform 150 forming a plurality of optical waveguides 152 and 154, a connecting part which connects the drive actuator and the cantilever platform, a link mechanism which forms one or more link teeth, is connected to the drive actuator, so positioned to decide one or more latched condition positions and so positioned to engage with the latch teeth an electric stimulation means of which the timing is so set to variably operate the drive actuator and the latch actuator between a balanced state and a latched state. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2004287429A

公开(公告)日：2004-10-14

申请号：JP2004070774

申请日：2004-03-12

Applicant: Xerox Corp ,  ゼロックス コーポレイションXerox Corporation

Inventor： KUBBY JOEL A ,  FEINBERG KATHLEEN A ,  GERMAN KRISTINE A ,  GULVIN PETER M ,  MA JUN ,  LIN PINYEN

IPC: G02B26/02 ,  B81B3/00 ,  G02B6/12 ,  G02B6/35

CPC classification number: G02B6/3508 ,  G02B6/356 ,  G02B6/358 ,  G02B2006/12145

Abstract: PROBLEM TO BE SOLVED: To reduce the size of a multicomponent optical device and the production cost without sacrificing operation characteristic. SOLUTION: In a thermal drive actuator which has a thermal latch actuator and defines translating latch teeth, a movable waveguide shuttle platform which defines a plurality of optical waveguides and is connected with a suspension element, a tether which connects the thermal drive actuator to the movable waveguide platform, and a link mechanism which is arranged for deciding a latched state position and defines link mechanism teeth for diagonal connection of the thermal drive actuator to the translating latch teeth, the optical switch is so composed that an electrical stimulation is generated at a predetermined time for switching between an equilibrium state and a latched state by actuating one or more thermal drive actuators and thermal latch actuators. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2002301697A

公开(公告)日：2002-10-15

申请号：JP2001360361

申请日：2001-11-27

Applicant: MICROSCAN SYSTEMS INC ,  XEROX CORP

Inventor： ZOSEL ANDREW J ,  GULVIN PETER M ,  CHEN JINGKUANG ,  KUBBY JOEL A ,  LIN CHUANG-CHIA ,  TRAN ALEX T

IPC: B81C1/00 ,  B81B3/00 ,  G02B26/08 ,  H01L21/302 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/762 ,  H01L27/14

Abstract: PROBLEM TO BE SOLVED: To improve the mechanical and optical characteristic of a silicon (SOI) wafer on an insulating body by using a micro-mechanical or a micro- optomechanical structure. SOLUTION: The micro-mechanical or the micro-optomechanical structure is manufactured by a process including following stages. The structure is defined on a mono crystal silicon layer 12 separated from a substrate layer 14 by an insulating layer 16. Poly silicon layers 40 and 42 are formed on the mono crystal silicon layer 12 by vapor deposition and etching as the poly silicon forming a mechanical element or an optical element of the structure is left. A selected range of the mono crystal silicon layer 12 is exposed. The formed structure is dissociated.

公开(公告)号：JP2002283297A

公开(公告)日：2002-10-03

申请号：JP2001360362

申请日：2001-11-27

Applicant: MICROSCAN SYSTEMS INC ,  XEROX CORP

Inventor： SCHARF BRUCE R ,  KUBBY JOEL A ,  LIN CHUANG-CHIA ,  TRAN ALEX T ,  ZOSEL ANDREW J ,  GULVIN PETER M ,  CHEN JINGKUANG

IPC: B81C1/00 ,  B81B3/00 ,  H01L21/762 ,  H01L27/14

Abstract: PROBLEM TO BE SOLVED: To improve mechanical and optical characteristics by a micromechanical or microoptomechanical structure in a silicon (SOI) wafer on an insulator. SOLUTION: This invention provides the micromechanical or microoptomechanical structure. This structure is manufactured by processing comprising the following stages: that is, to define the structure on a monocrystal silicon layer 12 separated from a substrate layer 14 by an insulating layer 16, to selectively etch the monocrystal silicon layer 12, to deposit and etch polysilicon layers 40 and 42 on the insulating layer 16 while leaving polysilicon for forming a mechanical element of the structure as it is, and to dissociate the formed structure.

公开(公告)号：JP2000203029A

公开(公告)日：2000-07-25

申请号：JP2000007783

申请日：2000-01-17

Applicant: XEROX CORP

Inventor： KUBBY JOEL A

IPC: B41J2/135 ,  B23K26/38 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To provide a leak preventing ink jet nozzle used in a printer. SOLUTION: A nozzle plate 100 having an upper surface 102 and an under surface is prepared and the upper surface 102 of the nozzle plate 100 is subjected to ablation processing by laser to form a bore 110 extending from the upper surface 102 of the nozzle plate 100 to the under surface thereof and the under surface of the nozzle plate 100 is subjected to ablation processing by laser to form a lip 140 extending from the under surface of the nozzle plate 100 to the outside thereof.

公开(公告)号：JP2000108400A

公开(公告)日：2000-04-18

申请号：JP26933499

申请日：1999-09-22

Applicant: XEROX CORP

Inventor： PEETERS ERIC ,  NOOLANDI JAAN ,  APTE RAJ B ,  FLOYD PHILIP D ,  SMALL JONATHAN A ,  KOVACS GREGORY J ,  LEAN MENG H ,  VOLKEL ARMIN R ,  BOLTE STEVEN B ,  SHI AN-CHANG ,  ENDICOTT FREDERICK J ,  ANDERSON GREGORY B ,  HAYS DAN A ,  KUBBY JOEL A ,  JACKSON WARREN B ,  KAREN A MOFFAT ,  MCANENEY BRIAN T ,  VEREGIN RICHARD P N ,  MCDOUGALL MARIA N V ,  BOILS DANIELLE C ,  PAUL D SZABO ,  ANDREW A BERLIN ,  G A NAVIL CONELL

IPC: B41J2/385 ,  B41J2/01 ,  B41J2/14 ,  B41J2/21

Abstract: PROBLEM TO BE SOLVED: To provide a print head capable of high quality and high speed print ing. SOLUTION: There is disclosed a print head 34 used in a printer. In the print head 34, a propelling medium flows in a fluid passage toward a printing medium 38 and a printing material such as ink or toner is controlled to be introduced into the propelling medium flow such that sufficient energy for moving to the printing medium 38 is supplied to the them. A plurality of fluid passages for directing the propelling medium flow and printing material enable high quality and high resolution printing. The plurality of printing materials are introduced into the passage to be mixed in the fluid passage before printing on the printing medium 38. The printing materials are mixed and superposed on the printing medium 38 without executing aligning of a registor. One embodiment of a full-color printer having a single fluid passage is disclosed.

公开(公告)号：JPH1065233A

公开(公告)日：1998-03-06

申请号：JP12400697

申请日：1997-05-14

Applicant: XEROX CORP

Inventor： PEETERS ERIC ,  KUBBY JOEL A

IPC: C23F4/00 ,  B81C1/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/683 ,  H01L49/00

Abstract: PROBLEM TO BE SOLVED: To provide a dry etching device which is suitable for manufacturing a micro device and a fine electric mechanical system. SOLUTION: A dry etching device 10 is so formed as to execute micromachine processing to a substrate 24 equipped with a first layer 26 and a second layer 28 which are formed of different materials and jointed together, forming a heterojunction 29. In this case, a substrate holding fixer 30 is provided, a first and a second electric contacts, 32 and 34, which are capable of being positioned, so as to come into contact with the layers 26 and 28 and electrically insulated from each other are provided to the substrate holding fixer 30, a power supply 22 is connected to the first electric contact 32 of the substrate holding fixer 30, and a voltage is applied to the heterojunction 29 of the substrate 24. A plasma flow 12 which contains chemically reactive ions 14 is made to irradiate the second layer 26, and the unmasked region of the substrate 24 is kept being etched until the plasma flow 12 is substantially stopped by the biased heterojunction 29. The substrate 24 is cooled down or periodically recovered with a corrosive material, so as to protect its side wall against damages caused by downward etching.