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    METHODS AND SYSTEMS FOR MICRO MACHINES
    62.
    发明申请
    METHODS AND SYSTEMS FOR MICRO MACHINES 审中-公开
    微机械的方法与系统

    公开(公告)号：WO2007143623A2

    公开(公告)日：2007-12-13

    申请号：PCT/US2007/070359

    申请日：2007-06-04

    Applicant: STALFORD, Harold, L.

    Inventor： STALFORD, Harold, L.

    CPC classification number: H02N10/00 ,  B81B3/0051 ,  B81B7/02 ,  B81B2201/035 ,  B81B2201/037 ,  F03G7/065 ,  F16C33/20 ,  F16C33/201 ,  F16C33/208 ,  F16C2223/60 ,  F16C2223/70 ,  H02N1/008 ,  H02N11/006

    Abstract: A micro machine may be in or less than the micrometer domain. The micro machine may include a micro actuator and a micro shaft coupled to the micro actuator. The micro shaft is operable to be driven by the micro actuator. A tool is coupled to the micro shaft and is operable to perform work in response to at least motion of the micro shaft. In accordance with other aspects of the disclosure methods and systems for micro transmissions for micro machines may be provided. Micro machines may include micro structures configured to move into engagement with other micro structures. A micro drive assembly may comprise a substrate, a micro shaft oriented in-plane with the substrate and at least one micro bearing to support rotation of the shaft. For example micro machines may include micro rotary machines and micro transport machines.

    Abstract translation: 微型机器可以在或小于微米范围。 微型机器可以包括微型致动器和联接到微型致动器的微型轴。 微型轴可由微型执行器驱动。 工具联接到微轴并且可操作以响应于微轴的至少运动而执行作业。 根据公开的其他方面，可以提供用于微机的微型传输的方法和系统。 微机器可以包括构造成移动成与其他微结构接合的微结构。 微型驱动器组件可以包括衬底，与衬底在平面内定向的微轴和支撑轴的旋转的至少一个微型轴承。 例如，微机器可以包括微型旋转机器和微型运输机器。

    Composite micromechanical component and method of fabricating the same
    65.
    发明授权
    Composite micromechanical component and method of fabricating the same 有权
    复合微机械部件及其制造方法

    公开(公告)号：US09045333B2

    公开(公告)日：2015-06-02

    申请号：US12797389

    申请日：2010-06-09

    Applicant: Pierre Cusin ,  Jean-Philippe Thiebaud

    Inventor： Pierre Cusin ,  Jean-Philippe Thiebaud

    IPC: B23P15/00 ,  C03C25/00 ,  B44C1/00 ,  B81C99/00 ,  B81C1/00 ,  B81B3/00 ,  C25D1/20 ,  G04B13/02 ,  G04D3/00 ,  C25D1/00 ,  C25D5/02

    CPC classification number: B81C99/008 ,  B81B3/0075 ,  B81B2201/035 ,  B81C1/00031 ,  B81C1/00087 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/032 ,  C25D1/003 ,  C25D1/20 ,  C25D5/022 ,  G04B13/022 ,  G04B13/026 ,  G04D3/0069

    Abstract: The invention relates to a method of fabricating a composite micromechanical component, particularly for timepiece movements, including steps: a) providing a substrate including a horizontal top layer and a horizontal bottom layer made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, horizontal, intermediate layer; b) etching a pattern in the top layer through to the intermediate layer, thereby forming at least one cavity in the substrate; c) coating the top part of the substrate with an electrically insulating coating; d) directionally etching the coating and the intermediate layer to limit the presence thereof exclusively at each vertical wall; e) performing an electrodeposition by connecting the electrode to the conductive bottom layer of the substrate to form at least one metal part of the component; g) releasing the composite component from the substrate.

    Abstract translation: 本发明涉及一种制造复合微机械部件的方法，特别是用于钟表运动的方法，包括步骤：a）提供包括由导电的可微加工材料制成的水平顶层和水平底层的基板，并通过 电绝缘的水平中间层; b）将顶层中的图案蚀刻到中间层，从而在衬底中形成至少一个空腔; c）用电绝缘涂层涂覆基材的顶部; d）定向蚀刻涂层和中间层，以限制其在每个垂直壁上的存在; e）通过将所述电极连接到所述基板的导电底层来进行电沉积以形成所述部件的至少一个金属部分; g）从基底释放复合组分。

    Method for making a reinforced silicon micromechanical part
    66.
    发明授权
    Method for making a reinforced silicon micromechanical part 有权
    制造增强硅微机械部件的方法

    公开(公告)号：US08992784B2

    公开(公告)日：2015-03-31

    申请号：US13386049

    申请日：2010-07-20

    Applicant: Nakis Karapatis

    Inventor： Nakis Karapatis

    IPC: B81C1/00

    CPC classification number: B81C1/00682 ,  B81B2201/035 ,  B81C1/00674 ,  B81C2201/0178 ,  Y10T29/49986

    Abstract: A method of fabricating a reinforced silicon micromechanical part includes: micro-machining the part, or a batch of parts in a silicon wafer; forming a silicon dioxide layer over the entire surface of the part, in one or plural operations, so as to obtain a thickness of silicon dioxide that is at least five times greater than the thickness of native silicon dioxide; and removing the silicon dioxide layer by etching.

    Abstract translation: 制造增强硅微机械部件的方法包括：在硅晶片中对所述部件或一批部件进行微加工; 在一个或多个操作中在整个表面上形成二氧化硅层，以获得比天然二氧化硅的厚度大至少五倍的二氧化硅的厚度; 并通过蚀刻去除二氧化硅层。

    MOULD FOR GALVANOPLASTY AND METHOD OF FABRICATING THE SAME
    69.
    发明申请
    MOULD FOR GALVANOPLASTY AND METHOD OF FABRICATING THE SAME 有权
    糖尿病模型及其制备方法

    公开(公告)号：US20130213800A1

    公开(公告)日：2013-08-22

    申请号：US13644215

    申请日：2012-10-03

    Applicant: Nivarox-FAR S.A.

    Inventor： Pierre Cusin ,  Clare Golfier ,  Jean-Philippe Thiebaud

    IPC: C25D1/10

    CPC classification number: C25D1/10 ,  B81B2201/035 ,  B81C99/009 ,  C25D17/00

    Abstract: The invention concerns the field of micromechanical parts, in particular, for timepiece movements. The invention relates to a method of fabricating a mould that includes the following steps: (a) providing a substrate that has a top layer and a bottom layer made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, intermediate layer; (b) etching at least one pattern in the top layer as far as the intermediate layer to form at least one cavity in the mould; (c) coating the top part of the substrate with an electrically insulating coating; and (d) directionally etching the coating and the intermediate layer to limit the presence thereof exclusively at each vertical wall formed in the top layer.

    Abstract translation: 本发明涉及微机械部件领域，特别涉及用于钟表运动的领域。 本发明涉及一种制造模具的方法，包括以下步骤：（a）提供具有由导电的可微加工材料制成的顶层和底层的基底，并通过电绝缘的中间体彼此固定 层; （b）蚀刻顶层中的至少一个图案直到中间层，以在模具中形成至少一个空腔; （c）用电绝缘涂层涂覆基材的顶部; 和（d）定向地蚀刻涂层和中间层，以限制其在顶层中形成的每个垂直壁上的存在。

    Method of manufacturing multi-level, silicon, micromechanical parts and parts thereby obtained
    70.
    发明授权
    Method of manufacturing multi-level, silicon, micromechanical parts and parts thereby obtained 有权
    由此得到多级，硅，微机械部件和部件的制造方法

    公开(公告)号：US08501584B2

    公开(公告)日：2013-08-06

    申请号：US12514352

    申请日：2007-11-01

    Applicant: Philippe Marmy ,  Jean-Luc Helfer ,  Thierry Conus

    Inventor： Philippe Marmy ,  Jean-Luc Helfer ,  Thierry Conus

    IPC: H01L21/30 ,  H01L21/46 ,  C23F1/00 ,  G04B15/00 ,  G04B1/00

    CPC classification number: B81C99/0095 ,  B81B2201/035 ,  B81C2201/019 ,  B81C2201/056 ,  B81C2203/038 ,  B81C2203/051 ,  G04B31/004 ,  G04D3/0069 ,  Y10T29/49579

    Abstract: The process comprises the following steps: a) a first element (3) or a plurality of said first elements (3) is/are machined in a first silicon wafer (1) keeping said elements (3) joined together via material bridges (5); b) step a) is repeated with a second silicon wafer (2) in order to machine a second element (4), differing in shape from that of the first element (3), or a plurality of said second elements (4); c) the first and second elements (3, 4) or the first and second wafers (1, 2) are applied, face to face, with the aid of positioning means (6, 7); d) the assembly formed in step c) undergoes oxidation; and e) the parts (10) are separated form the wafers (1, 2). Micromechanical timepiece parts obtained according to the process.

    Abstract translation: 该方法包括以下步骤：a）在第一硅晶片（1）中加工第一元件（3）或多个所述第一元件（3），以使所述元件（3）通过材料桥（5）连接在一起 ）; b）用第二硅晶片（2）重复步骤a），以便加工与第一元件（3）的形状不同的第二元件（4）或多个所述第二元件（4）; c）第一和第二元件（3,4）或第一和第二晶片（1,2）通过定位装置（6,7）面对面地施加; d）步骤c）中形成的组件经历氧化; 和e）部件（10）从晶片（1,2）分离。 根据工艺获得的微型钟表件。

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