DENDRITIC STARCH-BASED DEXTRIN ADHESIVES
    61.
    发明申请
    DENDRITIC STARCH-BASED DEXTRIN ADHESIVES 审中-公开
    基于淀粉的淀粉粘合剂

    公开(公告)号:WO2013070204A1

    公开(公告)日:2013-05-16

    申请号:PCT/US2011/059942

    申请日:2011-11-09

    Abstract: Starch-based dextrin adhesive additives and methods of preparation are described. Adhesives containing the additive exhibit antimicrobial properties and increased water solubility. The additive contains at least one sugar unit, at least one polyphenol side chain, and at least one Frechet-type poly (aryl ether) dendron.

    Abstract translation: 描述了基于淀粉的糊精粘合剂添加剂和制备方法。 含有添加剂的粘合剂表现出抗菌性能和水溶性。 添加剂含有至少一个糖单元,至少一个多酚侧链和至少一个Frechet型聚(芳基醚)树突。

    WATERBORNE COPOLYMER DISPERSION
    64.
    发明申请
    WATERBORNE COPOLYMER DISPERSION 审中-公开
    水性共聚物分散体

    公开(公告)号:WO2004016700A1

    公开(公告)日:2004-02-26

    申请号:PCT/SE2003/001268

    申请日:2003-08-13

    Abstract: The present invention refers to a waterborne copolymer dispersion comprising at least one alkenyl functional dendritic polymer being copolymerised to the polymer backbone of at least one homo or copolymer obtainable by polymerisation, such as emulsion polymerisation, in an aqueous medium of at least one at least one polymerisable allyl, vinyl, maleic or diene monomer. Said dendritic polymer is built up from a dendritic core polymer and at least one alkenyl functional compound bonded to said core polymer. In a further aspect the present invention refers to the use of said copolymer dispersion.

    Abstract translation: 本发明涉及一种水性共聚物分散体,其包含至少一种链烯基官能树枝状聚合物,该聚合物主链与至少一种均聚物或共聚物共聚合,所述共聚物或共聚物可通过在至少一种至少一种的水性介质中的聚合,如乳液聚合 可聚合烯丙基,乙烯基,马来酸或二烯单体。 所述树枝状聚合物由树枝状核聚合物和键合至所述芯聚合物的至少一种链烯基官能化合物构成。 在另一方面,本发明涉及所述共聚物分散体的用途。

    DENDRITIC MACROMOLECULE, PROCESS FOR PREPARATION THEREOF AND USE THEREOF
    65.
    发明申请
    DENDRITIC MACROMOLECULE, PROCESS FOR PREPARATION THEREOF AND USE THEREOF 审中-公开
    疏水性大分子,其制备方法及其用途

    公开(公告)号:WO1993017060A1

    公开(公告)日:1993-09-02

    申请号:PCT/SE1993000148

    申请日:1993-02-24

    Inventor: PERSTORP AB

    Abstract: The invention relates to a dendritic macromolecule of the polyester type, which macromolecule is composed of a central initiator molecule or initiator polymer having one or more reactive groups (A), which groups (A) under formation of an initial tree structure are bonded to reactive groups (B) of a monomeric chain extender holding the two reactive groups (A) and (B). The tree structure is potentially extended and further branched from the initiator molecule or initiator polymer by an addition of further molecules of a monomeric chain extender by means of bonding between the reactive groups (A) and (B) thereof and is possibly further extended by a reaction with a chain stopper. The invention also comprises a process for preparation of the dendritic macromolecule and the use of such a macromolecule.

    Abstract translation: 本发明涉及一种聚酯型树枝状高分子,该高分子由具有一个或多个反应性基团(A)的中心引发剂分子或引发剂聚合物组成,其中在初始树结构形成时(A)组与反应性基团结合 保持两个反应性基团(A)和(B)的单体扩链剂组(B)。 通过借助于其反应性基团(A)和(B)之间的键合加入另外的单体扩链剂分子,树结构可能延伸并进一步从引发剂分子或引发剂聚合物分支,并可能进一步扩展为 与链塞的反应。 本发明还包括制备树枝状高分子的方法和这种高分子的用途。

    반도체용 접착제 조성물 및 이를 이용한 반도체용 접착 필름
    66.
    发明公开
    반도체용 접착제 조성물 및 이를 이용한 반도체용 접착 필름 有权
    用于半导体器件的胶粘组合物和使用它的粘合剂

    公开(公告)号:KR1020120061610A

    公开(公告)日:2012-06-13

    申请号:KR1020100122967

    申请日:2010-12-03

    Abstract: PURPOSE: An adhesive composition for semiconductors and an adhesive film using thereof are provided to enhance void elimination property during molding and to prevent lifting of close die during a pick-up process. CONSTITUTION: An adhesive composition for semiconductors comprises 50-90 weight% of polymer resin, 5-30 weight% of epoxy resin, and 1-30 weight% of hardener. A melting point at 175 deg. Celsius after 3 times of curing cycles at 125 deg. Celsius for 1 hour is 1.0×10^5 - 3.0×10^6 poise. The adhesive film for semiconductors comprises a base film, a tackifier layer which is laminated on the base film, an adhesive layer which is laminated on the adhesion layer and is formed with the adhesive composition, and a protective film which is laminated on the bonding layer.

    Abstract translation: 目的:提供用于半导体的粘合剂组合物和使用其的粘合剂膜,以增强模制期间的空隙消除性能,并且防止在拾取过程中关闭模具的提升。 构成:半导体用粘合剂组合物包含50-90重量%的聚合物树脂,5-30重量%的环氧树脂和1-30重量%的硬化剂。 熔点为175度 摄氏度为125度后3次固化循环。 摄氏1小时为1.0×10 ^ 5 - 3.0×10 ^ 6泊。 半导体用粘合膜包括基膜,层叠在基膜上的增粘层,层叠在粘合层上并形成有粘合剂组合物的粘合层和层叠在接合层上的保护膜 。

    내열성과 접착력이 우수한 열경화성 접착 필름
    68.
    发明公开
    내열성과 접착력이 우수한 열경화성 접착 필름 无效
    热固性胶粘剂在胶粘性和耐热性方面优秀

    公开(公告)号:KR1020120000196A

    公开(公告)日:2012-01-02

    申请号:KR1020100060401

    申请日:2010-06-25

    Abstract: PURPOSE: A thermo-setting adhesive film is provided to have excellent adhesive force and heat resistance at high temperature and high humidity environments, thereby increasing the reliability and the yield of product. CONSTITUTION: A thermo-setting adhesive film comprises a release film, and a thermoplastic resin, a thermosetting resin, an amine-based curing agent and a polyfunctional polythiol hardener, as an adhesive layer coated on at least one side of the release film. The adhesive composition comprises 50-200 parts by weight thermosetting resin, 1-15 parts by weight amine-based curing agent and 0.1-5 parts by weight polyfunctional polythiol hardener on the basis of 100.0 parts by weight thermoplastic resin.

    Abstract translation: 目的:提供一种热固性粘合膜,以在高温高湿环境下具有优异的粘合力和耐热性,从而提高产品的可靠性和产率。 构成:热固性粘合剂膜包括剥离膜,热塑性树脂,热固性树脂,胺基固化剂和多官能多硫醇硬化剂,作为涂覆在剥离膜的至少一面上的粘合剂层。 基于100.0重量份热塑性树脂,粘合剂组合物包含50-200重量份热固性树脂,1-15重量份胺基固化剂和0.1-5重量份多官能多硫醇硬化剂。

    접착테이프와 이를 이용한 실링방법
    70.
    发明公开
    접착테이프와 이를 이용한 실링방법 无效
    粘合胶带和使用该胶带的密封方法

    公开(公告)号:KR1020080046890A

    公开(公告)日:2008-05-28

    申请号:KR1020060116529

    申请日:2006-11-23

    Inventor: 전용수

    CPC classification number: G02F1/1341 C09J109/02 C09J201/005 G02F2201/54

    Abstract: An adhesive tape and a sealing method by using the same are provided to improve the structure of a tape, thereby reducing the inflow of the adhesive components separated from the tape into the installation device. The second film(200) is formed on the first surface of the first film(100) and located between the middle area of the first film. An adhesion layer(300) is formed on the first surface of the first film and located at the circumferential area for encompassing the middle area. The second film is contacted with the first film. The adhesion layer is formed on the entire of the first surface of the first film. The second film is formed on the adhesion layer. The material of the first film includes the polymer materials such as PVC(PolyVinylChloride). The material of the adhesion layer includes an acryl group. The material of the second film includes PE(PolyEthylene) or PET(PolyEthyleneTerephthalate). The second film is extended lengthily and exposed to the middle area of the first film.

    Abstract translation: 提供了一种胶带和使用该胶带的密封方法以改善胶带的结构,从而减少了从胶带分离到安装装置中的粘合剂组分的流入。 第二膜(200)形成在第一膜(100)的第一表面上并且位于第一膜的中间区域之间。 在第一膜的第一表面上形成粘合层(300),并位于围绕中间区域的周边区域。 第二个胶片与第一个胶片接触。 粘合层形成在第一膜的整个第一表面上。 第二膜形成在粘合层上。 第一膜的材料包括聚合物材料如聚氯乙烯(PolyVinylChloride)。 粘合层的材料包括丙烯酰基。 第二膜的材料包括PE(聚乙烯)或PET(聚对苯二甲酸乙二醇酯)。 第二部电影长度延长并暴露在第一部电影的中间区域。

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