Abstract:
Starch-based dextrin adhesive additives and methods of preparation are described. Adhesives containing the additive exhibit antimicrobial properties and increased water solubility. The additive contains at least one sugar unit, at least one polyphenol side chain, and at least one Frechet-type poly (aryl ether) dendron.
Abstract:
Die vorliegende Erfindung betrifft eine Polyurethandispersion, die wenigstens ein hochverzweigtes Polymer enthält, ein Beschichtungsmittel oder einen Klebstoff auf Basis einer solchen Polyurethandispersion, ein Verfahren zur Modifizierung der rheologischen Eigenschaften von Beschichtungsmitteln oder Klebstoffen sowie die Verwendung von hochverzweigten Polymeren als Zusatzstoff für wässrige Polyurethandispersionen mit modifizierten rheologischen Eigenschaften.
Abstract:
Novel hyperbranched segmented copolymers include at least one oligomer. Spacing of branch points in a hyperbranched hyperbranched polymer (A 2 B n ) x are manipulated by having either A 2 or B n or both A 2 and B n be in the form of an oligomer (as opposed to a monomer).
Abstract:
The present invention refers to a waterborne copolymer dispersion comprising at least one alkenyl functional dendritic polymer being copolymerised to the polymer backbone of at least one homo or copolymer obtainable by polymerisation, such as emulsion polymerisation, in an aqueous medium of at least one at least one polymerisable allyl, vinyl, maleic or diene monomer. Said dendritic polymer is built up from a dendritic core polymer and at least one alkenyl functional compound bonded to said core polymer. In a further aspect the present invention refers to the use of said copolymer dispersion.
Abstract:
The invention relates to a dendritic macromolecule of the polyester type, which macromolecule is composed of a central initiator molecule or initiator polymer having one or more reactive groups (A), which groups (A) under formation of an initial tree structure are bonded to reactive groups (B) of a monomeric chain extender holding the two reactive groups (A) and (B). The tree structure is potentially extended and further branched from the initiator molecule or initiator polymer by an addition of further molecules of a monomeric chain extender by means of bonding between the reactive groups (A) and (B) thereof and is possibly further extended by a reaction with a chain stopper. The invention also comprises a process for preparation of the dendritic macromolecule and the use of such a macromolecule.
Abstract:
PURPOSE: An adhesive composition for semiconductors and an adhesive film using thereof are provided to enhance void elimination property during molding and to prevent lifting of close die during a pick-up process. CONSTITUTION: An adhesive composition for semiconductors comprises 50-90 weight% of polymer resin, 5-30 weight% of epoxy resin, and 1-30 weight% of hardener. A melting point at 175 deg. Celsius after 3 times of curing cycles at 125 deg. Celsius for 1 hour is 1.0×10^5 - 3.0×10^6 poise. The adhesive film for semiconductors comprises a base film, a tackifier layer which is laminated on the base film, an adhesive layer which is laminated on the adhesion layer and is formed with the adhesive composition, and a protective film which is laminated on the bonding layer.
Abstract:
접착 테이프, 접착 테이프를 포함하는 물품, 접착 테이프의 제조 방법, 및 접착 테이프의 용도가 기술된다. 접착 테이프는 연신 분리가능하며, 2개의 기재를 함께 결합시키기 위해 사용될 수 있다. 임의의 이유로 2개의 기재를 분리하기 위하여 접착 테이프를 용이하게 제거할 수 있다. 접착 테이프는 배킹층, 및 배킹층에 인접한 적어도 하나의 감압성 접착제층을 포함한다. 배킹층은 제1 아크릴계 공중합체를 포함한다. 각각의 감압성 접착제층은 제2 아크릴계 공중합체와 더불어 제2 아크릴계 공중합체 내에 분산되거나 현탁된 무기 입자를 포함한다.
Abstract:
PURPOSE: A thermo-setting adhesive film is provided to have excellent adhesive force and heat resistance at high temperature and high humidity environments, thereby increasing the reliability and the yield of product. CONSTITUTION: A thermo-setting adhesive film comprises a release film, and a thermoplastic resin, a thermosetting resin, an amine-based curing agent and a polyfunctional polythiol hardener, as an adhesive layer coated on at least one side of the release film. The adhesive composition comprises 50-200 parts by weight thermosetting resin, 1-15 parts by weight amine-based curing agent and 0.1-5 parts by weight polyfunctional polythiol hardener on the basis of 100.0 parts by weight thermoplastic resin.
Abstract:
본 발명의 접착재 테이프 (10)은, 제1면 (F1) 및 이것과 반대측의 제2면 (F2)를 갖는 테이프상의 지지체 (1)과, 접착제 성분 (2a)를 함유하고, 지지체 (1)의 제1면 (F1) 위에 형성된 접착제층 (2)를 구비하고, 지지체 (1)의 제2면 (F2)는 2차원 표면 조도를 측정했을 때의 최대 높이 (Ry)가 1 ㎛ 이상이다.
Abstract:
An adhesive tape and a sealing method by using the same are provided to improve the structure of a tape, thereby reducing the inflow of the adhesive components separated from the tape into the installation device. The second film(200) is formed on the first surface of the first film(100) and located between the middle area of the first film. An adhesion layer(300) is formed on the first surface of the first film and located at the circumferential area for encompassing the middle area. The second film is contacted with the first film. The adhesion layer is formed on the entire of the first surface of the first film. The second film is formed on the adhesion layer. The material of the first film includes the polymer materials such as PVC(PolyVinylChloride). The material of the adhesion layer includes an acryl group. The material of the second film includes PE(PolyEthylene) or PET(PolyEthyleneTerephthalate). The second film is extended lengthily and exposed to the middle area of the first film.