公开(公告)号：US20170233554A1

公开(公告)日：2017-08-17

申请号：US15587185

申请日：2017-05-04

Applicant: LG Innotek Co., Ltd.

Inventor： Sang A JU ,  Hyun Gu IM ,  Jae Man PARK

IPC: C08K9/06 ,  H01L33/64 ,  H05K1/03 ,  C08K3/38 ,  B05D3/02

CPC classification number: C08K9/06 ,  B05D3/0254 ,  C08K3/22 ,  C08K3/38 ,  C08K9/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/385 ,  H01L33/641 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227 ,  C08L63/00

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

公开(公告)号：US09733565B2

公开(公告)日：2017-08-15

申请号：US14445771

申请日：2014-07-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan Seo ,  Jun Young Kim

IPC: G03F7/085 ,  C07D257/04 ,  H05K3/38 ,  G03F7/004 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/038 ,  H05K3/00 ,  H05K1/03

CPC classification number: G03F7/085 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/038 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/0023 ,  H05K3/38 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2203/0514 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.

公开(公告)号：US20170188468A1

公开(公告)日：2017-06-29

申请号：US15352264

申请日：2016-11-15

Applicant: Panasonic Intellectual Property Managemtent Co., Ltd.

Inventor： HIROHISA HINO ,  NAOMICHI OHASHI ,  YUKI YOSHIOKA ,  MASATO MORI ,  YASUHIRO SUZUKI

IPC: H05K3/34 ,  H05K1/18 ,  H05K1/11 ,  H01L23/00

CPC classification number: H05K3/3489 ,  B23K35/24 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13023 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13387 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/1601 ,  H01L2224/16013 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/16505 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81905 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0209 ,  H05K2201/0227 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/05432 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/066

Abstract: Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

公开(公告)号：US20170051133A1

公开(公告)日：2017-02-23

申请号：US15307639

申请日：2015-04-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Jina Gu ,  Gun Young Gil ,  Jae Man Park ,  Sung Jin Yun

IPC: C08K9/02 ,  H01B3/40 ,  H05K1/03 ,  H05K1/02 ,  C08K3/22 ,  C08K3/38

CPC classification number: C08K9/02 ,  C08K3/22 ,  C08K3/38 ,  C08K2003/2227 ,  C08K2003/382 ,  C08L63/00 ,  H01B3/40 ,  H05K1/0204 ,  H05K1/0298 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227

Abstract: An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.

Abstract translation: 根据本发明的一个实施方案的环氧树脂组合物包含环氧树脂，固化剂和无机填料，无机填料包括其上形成有金属氧化物膜的氮化硼。

公开(公告)号：US20160222195A1

公开(公告)日：2016-08-04

申请号：US14638474

申请日：2015-03-04

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang A JU ,  Hyun Gu IM ,  Jae Man PARK

IPC: C08K9/06 ,  C08K3/22 ,  C08K9/02

CPC classification number: C08K9/06 ,  B05D3/0254 ,  C08K3/22 ,  C08K3/38 ,  C08K9/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/385 ,  H01L33/641 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227 ,  C08L63/00

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

Abstract translation: 根据本发明的一个实施方案的无机填料包括氮化硼附聚物和形成在氮化硼附聚物上并包含-Si-R-NH 2基团的涂层，R选自具有 1至3个碳原子，具有2至3个碳原子的烯烃基和具有2至3个碳原子的炔基。

公开(公告)号：US09265144B2

公开(公告)日：2016-02-16

申请号：US13994253

申请日：2012-10-18

Applicant: Panasonic Corporation

Inventor： Masanori Minamio ,  Hiroki Ikeuchi

IPC: H05K1/00 ,  H05K1/03 ,  H01L23/29 ,  H01L23/427 ,  H01L23/433 ,  H01L23/495 ,  H01L23/498 ,  H05K3/46 ,  H01L23/31 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/0306 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/4275 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49861 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0224 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/186 ,  H05K3/284 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0227 ,  H05K2201/0376 ,  H05K2201/0723 ,  H05K2201/1056 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

Abstract translation: 半导体器件是包括用第一树脂6模制的半导体元件T1的树脂封装结构。第一树脂6包含填充物7，填充物7包括用相变材料包围的电绝缘胶囊，其吸收周围热量和相变 以提高介电强度。 填料7的效果达到具有令人满意的散热和高耐受电压的结构。

公开(公告)号：US20150050473A1

公开(公告)日：2015-02-19

申请号：US14445771

申请日：2014-07-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan SEO ,  Jun Young KIM

IPC: G03F7/085 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00

CPC classification number: G03F7/085 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/038 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/0023 ,  H05K3/38 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2203/0514 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.

Abstract translation: 树脂组合物，使用该组合物的印刷电路板以及印刷电路板的制造方法。 树脂组合物包括：可光聚合化合物，例如具有在分子中可聚合的烯属不饱和键的光聚合化合物，光引发剂和通过烷基磺化四唑化合物的表面改性二氧化硅。

公开(公告)号：US20150027763A1

公开(公告)日：2015-01-29

申请号：US14143681

申请日：2013-12-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Ho HONG ,  Geum Hee Yun ,  Dae Hui Jo ,  Sa Yong Lee ,  Jin Young Kim ,  Keun Yong Lee

IPC: H05K1/03 ,  H05K1/02 ,  C09C1/40

CPC classification number: H05K1/0373 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2004/80 ,  C01P2006/22 ,  C09C1/405 ,  C09C3/063 ,  C09C3/12 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/4676 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0239 ,  H05K2201/068

Abstract: An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler.

Abstract translation: 无机填料具有负的热膨胀系数和其上的壳，其使包含在无机填料中的离子的扩散减少到壳外部和有机填料。

公开(公告)号：WO2015167149A1

公开(公告)日：2015-11-05

申请号：PCT/KR2015/003831

申请日：2015-04-16

Applicant: 엘지이노텍 주식회사

Inventor： 구진아 ,  길건영 ,  박재만 ,  윤성진

IPC: C08K3/38 ,  C08L63/00 ,  C08K9/02 ,  C08K3/22

CPC classification number: C08K9/02 ,  C08K3/22 ,  C08K3/38 ,  C08K2003/2227 ,  C08K2003/382 ,  C08L63/00 ,  H01B3/40 ,  H05K1/0204 ,  H05K1/0298 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227

Abstract: 본 발명의 한 실시예에 따른 에폭시 수지 조성물은 에폭시 수지, 경화제, 그리고 무기충전재를 포함하며, 상기 무기충전재는 표면에 금속 산화막이 형성된 질화붕소를 포함한다.

Abstract translation: 根据本发明实施方案的环氧树脂组合物包含环氧树脂，固化剂和无机填料，其中无机填料含有其上形成有金属氧化物膜的表面的氮化硼。

公开(公告)号：WO2014180550A1

公开(公告)日：2014-11-13

申请号：PCT/EP2014/001183

申请日：2014-05-05

Applicant: MERCK PATENT GMBH

Inventor： KNIESS, Helge Bettina ,  QUITTMANN, Ulrich ,  PIENING, Oliver Robert ,  ROSENBERGER, Silvia

IPC: H05K1/03 ,  C08K9/02 ,  C08K3/22

CPC classification number: H05K1/0373 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2241 ,  H05K1/0284 ,  H05K3/105 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/09118 ,  C08L101/00

Abstract: Die vorliegende Erfindung bezieht sich auf ein LDS-aktives Additiv für LDS-Kunststoffe, auf eine Polymerzusammensetzung, enthaltend ein solches Additiv, sowie auf einen Artikel mit metallisierten Leiterbahnen, bei dem ein polymerer Grundkörper des Artikels oder eine polymere Beschichtung auf einem Grundkörper ein LDS-Additiv der genannten Art enthält.

Abstract translation: 本发明涉及一种LDS活性添加剂用于LDS-塑料，含有这种添加剂的聚合物组合物，以及与金属化轨道的制品，其中所述制品的聚合物基体上或在基体上的LDS的聚合物涂层 含有所述类型的添加剂。