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    Fluororesin substrate
    61.
    发明专利
    Fluororesin substrate 审中-公开
    氟菊酯底物

    公开(公告)号：JP2013201344A

    公开(公告)日：2013-10-03

    申请号：JP2012069591

    申请日：2012-03-26

    Applicant: Sumitomo Electric Fine Polymer Inc ,  住友電工ファインポリマー株式会社

    Inventor： NAKABAYASHI MAKOTO ,  IKEDA KAZUAKI

    IPC: H05K1/03

    CPC classification number: H05K1/0271 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0306 ,  H05K1/0373 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0358 ,  H05K2201/09136 ,  H05K2203/092 ,  Y10T428/24355 ,  Y10T428/249974

    Abstract: PROBLEM TO BE SOLVED: To provide a fluororesin substrate allowing sufficient suppression of warpage occurrence in reflowing and also exhibition of sufficiently excellent, high-frequency properties.SOLUTION: A fluororesin substrate is a fluororesin substrate where a dielectric layer with fluororesin being a main component is formed on a metal conductor and the dielectric layer contains hollow glass beads. The metal conductor has a surface roughness Rz (JIS B 0601-1994) of 2.0 μm or less. The fluororesin is irradiated with ionizing radiation in an irradiation dose of 0.01 to 500 kGy. The fluororesin is one, two, or more kinds of polytetrafluoroethylene (PTFE), a tetrafluoroethylene-perfluoroalkylvinyl ether copolymer (PFA), a tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and a tetrafluoroethylene-ethylene copolymer (ETFE).

    Abstract translation: 要解决的问题：提供一种允许充分抑制回流中翘曲发生的氟树脂基材，并且还展现出足够优异的高频性能。解决方案：氟树脂基材是以氟树脂作为主要成分的介电层为氟树脂基材， 形成在金属导体上，电介质层包含中空玻璃珠。 金属导体的表面粗糙度Rz（JIS B 0601-1994）为2.0μm以下。 用0.01〜500kGy的照射剂量的电离辐射照射氟树脂。 氟树脂是聚四氟乙烯（PTFE），四氟乙烯 - 全氟烷基乙烯基醚共聚物（PFA），四氟乙烯 - 六氟丙烯共聚物（FEP）和四氟乙烯 - 乙烯共聚物（ETFE）中的一种，两种或更多种。

    REDUCING DIELECTRIC LOSS IN SOLDER MASKS
    65.
    发明申请
    REDUCING DIELECTRIC LOSS IN SOLDER MASKS 有权
    降低焊接掩模中的电介质损耗

    公开(公告)号：US20140345923A1

    公开(公告)日：2014-11-27

    申请号：US13995667

    申请日：2011-12-09

    Applicant: Dennis J. Miller

    Inventor： Dennis J. Miller

    IPC: H05K3/00 ,  B01F3/12 ,  H05K3/28

    CPC classification number: H05K3/0076 ,  B01F3/12 ,  H05K3/28 ,  H05K3/285 ,  H05K2201/0254

    Abstract: A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons.

    Abstract translation: 电路板可以包括衬底，与衬底相关联的互连结构，以及与互连结构和衬底相关联的焊接掩模。 焊接掩模可以基于包括环氧树脂和粉末的混合物。 粉末可以是中空玻璃微球。

    Inorganic Hollow Particle, Process For Producing The Same, And Composition Containing The Same
    66.
    发明申请
    Inorganic Hollow Particle, Process For Producing The Same, And Composition Containing The Same 有权
    无机中空颗粒，其生产方法和含有它的组合物

    公开(公告)号：US20090030134A1

    公开(公告)日：2009-01-29

    申请号：US12278156

    申请日：2007-04-24

    Applicant: Shuji Sasaki ,  Yasuhisa Nishi ,  Shinji Yamano ,  Mitsuyoshi Iwasa

    Inventor： Shuji Sasaki ,  Yasuhisa Nishi ,  Shinji Yamano ,  Mitsuyoshi Iwasa

    IPC: C08K3/36 ,  C01B33/12

    CPC classification number: C01B33/18 ,  C01B13/322 ,  C01P2004/32 ,  C01P2004/34 ,  C01P2006/12 ,  C03C11/002 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/2982

    Abstract: The present invention herein provides fine inorganic hollow powder having a high hollowness rate, which can be incorporated into, for instance, a low dielectric rubber or resin composition. The inorganic hollow powder has an average hollowness rate of higher than 70% by volume and an average particle size ranging from 3 to 20 μm and the powder preferably has an average hollowness rate ranging from 75 to 85% by volume, an average particle size ranging from 5 to 15 μm, a maximum particle size of not more than 25 μm, a specific surface area of not more than 10 m2/g, an average sphericity degree of not less than 0.90 and a purity of not less than 99% by mass. The inorganic hollow powder can be prepared by a method comprising the steps of forming a flame using a burner provided with at least a triplet-tubular portion comprising, in order from the outermost side, a combustion-improving gas-supply pipe, a combustible gas-supply pipe and an inorganic raw powder-supply pipe assembled together; injecting, into the flame at a high discharge speed, inorganic raw powder having a specific particle size through the inorganic raw powder-supply pipe, while the powder is entrained with a carrier gas having a specific relative humidity, to thus subject the powder to a heat-treatment.

    Abstract translation: 本发明提供具有高中空率的细小的无机中空粉末，其可以结合到例如低介电橡胶或树脂组合物中。 无机中空粉末的平均中空率高于70体积％，平均粒径为3〜20μm，粉末的平均中空率优选为75〜85体积％，平均粒径为 5〜15μm，最大粒径为25μm以下，比表面积为10m2 / g以下，平均球形度为0.90以上，纯度为99质量％以上 。 无机中空粉末可以通过以下方法制备：使用设置有至少三重管状部分的燃烧器形成火焰的步骤，其包括从最外侧开始的燃烧改善气体供给管，可燃气体 供应管和无机原料粉供应管组装在一起; 通过无机原料粉供给管以高放电速度向火焰喷射具有特定粒径的无机原料粉末，同时将粉末夹在具有特定相对湿度的载气中，从而将粉末置于 热处理。

    Electronic package having controlled height stand-off solder joint
    68.
    发明授权
    Electronic package having controlled height stand-off solder joint 失效
    电子封装具有受控的高度接头焊点

    公开(公告)号：US06986454B2

    公开(公告)日：2006-01-17

    申请号：US10616617

    申请日：2003-07-10

    Applicant: Morris D Stillabower

    Inventor： Morris D Stillabower

    IPC: B23K31/00 ,  B23K31/02 ,  B23K35/12

    CPC classification number: H05K3/3484 ,  H01L2224/16225 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0254 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32 or 42). The stand-off members (32 or 42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.

    Abstract translation: 提供一种电子封装（10），其包括具有衬底（14）和电路（16）的电路板（12）和具有接触端子（24）的表面安装器件（22）。 在电路板（12）上形成安装垫（28）。 电子封装（10）还包括将表面安装器件（22）的接触端子（24）连接到电路板（12）上的安装焊盘（28）的焊接接头（30）。 焊接接头（30）包括可回流焊料和多个分离构件（32或42）。 分离构件（32或42）在电路板（12）和表面安装装置（22）之间提供在约0.01mm至0.10mm的范围内的间隔距离（H）。

    Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
    70.
    发明申请
    Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers 审中-公开
    成型尺寸组合物，涂覆其的玻璃纤维和由这种涂布纤维编织的织物

    公开(公告)号：US20020051882A1

    公开(公告)日：2002-05-02

    申请号：US09779732

    申请日：2001-02-09

    Inventor： Ernest L. Lawton ,  Kami Lammon-Hilinski

    IPC: D02G003/00

    CPC classification number: H05K1/0366 ,  B05C1/06 ,  B05C11/1039 ,  B05C11/1042 ,  C03C25/255 ,  C03C25/26 ,  C03C25/321 ,  C03C25/47 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2203/127 ,  Y10T428/2938

    Abstract: The present invention provides coated fiber strand comprising at least one fiber having a residue of an aqueous forming size composition applied to at least a portion of a surface of the at least one fiber, the aqueous forming size composition comprising: (a) at least one starch; (b) at least one film-forming material; (c) at least one lubricant; and (d) a plurality of discrete particles that provide interstitial space between the at least one fiber and at least one adjacent fiber sufficient to allow wet out of the fiber strand. In one embodiment of the invention, the fibers are glass fibers, the at least one starch comprises an oleophobic starch, the at least one film-forming material comprises a N-vinyl amide polymer, the at least one lubricant comprises an ester, and the particles are dimensionally stable particles selected from polymeric organic materials, non-polymeric organic materials, polymeric inorganic materials, non-polymeric inorganic materials, composite materials and mixtures thereof. In one non-limiting embodiment of the invention, the particles comprise hexagonal boron nitride particles and/or hollow particles formed from a copolymer of styrene and acrylic monomer. The present invention also provides a fabric incoporating the coated fabric strand and an electronic support and an electronic circuit board incorporating the fabric.

    Abstract translation: 本发明提供了包含至少一种具有至少一种纤维的水性成型尺寸组合物的残余物的纤维束，所述水性成型剂组合物包含：（a）至少一种 淀粉; （b）至少一种成膜材料; （c）至少一种润滑剂; 和（d）多个离散的颗粒，其在所述至少一个纤维和至少一个相邻的纤维之间提供足够的间隙，以允许从纤维束中脱出。 在本发明的一个实施方案中，所述纤维是玻璃纤维，所述至少一种淀粉包含疏油性淀粉，所述至少一种成膜材料包含N-乙烯基酰胺聚合物，所述至少一种润滑剂包含酯， 颗粒是选自聚合有机材料，非聚合有机材料，聚合物无机材料，非聚合无机材料，复合材料及其混合物的尺寸稳定的颗粒。 在本发明的一个非限制性实施方案中，颗粒包括由苯乙烯和丙烯酸单体的共聚物形成的六方氮化硼颗粒和/或中空颗粒。 本发明还提供了一种覆盖涂层织物线束的织物，以及包含织物的电子支架和电子电路板。

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