公开(公告)号：US07662662B2

公开(公告)日：2010-02-16

申请号：US11685751

申请日：2007-03-13

Applicant: Jun-Chung Hsu ,  Bing-Kuen Lin ,  Chao-Lung Wang

Inventor： Jun-Chung Hsu ,  Bing-Kuen Lin ,  Chao-Lung Wang

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H05K3/421 ,  H05K1/116 ,  H05K3/108 ,  H05K3/426 ,  H05K2201/09545 ,  H05K2201/09563 ,  Y10T29/49162

Abstract: A carrier substrate and a method for manufacturing the carrier substrate are disclosed herein. The method includes the steps of: providing a core substrate; forming a build-up material layer on the core substrate; forming a via in the build-up material layer; forming a patterned photoresist layer on the build-up material layer covering a portion of the via and exposing an opening from uncovered portion of the via, and a wiring slot connected to the opening; and forming a metal-electroplated layer on the via and the wiring slot. In forming a trace according to the present invention, the metal-electroplated layer is formed as the trace and directly connected to the via, striding or not striding over the via. Additionally, in the carrier substrate structure, there is no need an annular ring to connect the trace to the via, and thus the wiring space is increased.

Abstract translation: 本文公开了载体基板和用于制造载体基板的方法。 该方法包括以下步骤：提供芯基板; 在所述芯基板上形成积层材料层; 在积层材料层中形成通孔; 在所述积层材料层上形成图案化的光致抗蚀剂层，所述图案化的光致抗蚀剂层覆盖所述通孔的一部分，并且从所述通孔的未覆盖部分露出开口，以及连接到所述开口的布线槽; 以及在通孔和布线槽上形成金属电镀层。 在形成根据本发明的迹线的情况下，金属电镀层形成为迹线，并且直接连接到通孔，跨越通道或跨过通孔。 此外，在载体基板结构中，不需要环形环来将迹线连接到通孔，因此布线空间增加。

公开(公告)号：US07488675B2

公开(公告)日：2009-02-10

申请号：US11684583

申请日：2007-03-09

Applicant: Ting-Hao Lin

Inventor： Ting-Hao Lin

IPC: H01L21/44

CPC classification number: H05K1/116 ,  H05K3/064 ,  H05K3/427 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09736 ,  Y10T29/41 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for fabricating an IC board without a ring structure is provided. In the method, after the completion of the core board (including the core through hole), the second pattern photoresist layer is used to mask over the first deposited metal layer, and a portion of the second deposited metal layer (this portion of the second deposited metal layer is to electrically couple to the conductive circuit of the core through hole). Later, the second deposited metal layer, the first deposited metal layer, the metal layer, and the substrate at the innermost layer which are not masked by the second pattern photoresist layer are removed. As a result, the substrate is exposed to form the ringless structure, and to couple a conductive line to the core board through hole.

Abstract translation: 提供一种制造没有环形结构的IC板的方法。 在该方法中，在芯板（包括芯通孔）完成之后，第二图案光致抗蚀剂层用于掩蔽第一沉积金属层，并且第二沉积金属层的一部分（第二次 沉积的金属层电连接到芯通孔的导电电路）。 然后，去除未被第二图案光刻胶层掩蔽的第二沉积金属层，第一沉积金属层，金属层和最内层的基板。 结果，基板被暴露以形成无环结构，并且将导电线耦合到芯板通孔。

公开(公告)号：US10720694B2

公开(公告)日：2020-07-21

申请号：US16175807

申请日：2018-10-30

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Ting-Hao Lin ,  Yung-Lin Chia ,  Chiao-Cheng Chang

IPC: H05K13/00 ,  H01Q1/22 ,  H05K1/11 ,  H05K1/14 ,  H01Q1/52 ,  H05K1/18 ,  H01Q5/307

Abstract: An antenna carrier plate structure has a first circuit board and a second circuit board. The first circuit board has a first substrate and a conductive connector disposed in the first substrate. The conductive connector has two opposite connecting ends respectively protruding from two opposite surfaces of the first substrate. The second circuit board has a second substrate formed with a through hole, and a connecting plug is disposed in the through hole. One end of the connecting plug is formed with an engaging concave portion for engaging one end of the conductive connector of the first substrate. Therefore, each circuit board can be firmly fixed and electrically connected by engaging to form a multi-layer circuit board module, thereby avoiding joint tolerances during soldering and ensuring a correct connection of the joints.

公开(公告)号：US10532551B2

公开(公告)日：2020-01-14

申请号：US16199515

申请日：2018-11-26

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Shang-Chi Wang ,  Yun-Han Yeh ,  Cyuan-Bang Wu

IPC: B32B43/00 ,  B32B38/10

Abstract: A foil peeling apparatus adapted to a substrate having a foil thereon includes a foil peeling member, a connector and a controller. The foil peeling member has a foil peeling surface. The controller controls the connector to drive the peeling member to move along a path. The foil peeling surface of the peeling member in contact with, with an initial angle, the substrate, feeds toward the substrate for a first displacement, and then moves upwards and toward the substrate when the first feeding angle is decreased.

公开(公告)号：US10256030B2

公开(公告)日：2019-04-09

申请号：US15811317

申请日：2017-11-13

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Chiao-Cheng Chang ,  Yi-Nong Lin

IPC: H01F5/00 ,  H01F27/28 ,  H01F41/04 ,  H05K1/00 ,  H05K3/00 ,  H05K1/16 ,  H05K3/46

Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.

公开(公告)号：US09847165B2

公开(公告)日：2017-12-19

申请号：US14877981

申请日：2015-10-08

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Chiao-Cheng Chang ,  Yi-Nong Lin

IPC: H01F5/00 ,  H01F27/28 ,  H01F41/04 ,  H05K1/00 ,  H05K3/00

CPC classification number: H01F27/2804 ,  H01F41/041 ,  H01F2027/2809 ,  H05K1/00 ,  H05K1/165 ,  H05K3/00 ,  H05K3/4635 ,  H05K2201/09063

Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.

公开(公告)号：US09744624B2

公开(公告)日：2017-08-29

申请号：US14742070

申请日：2015-06-17

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jaen-Don Lan ,  Pin-Chung Lin ,  Chen-Rui Tseng ,  Cheng-En Ho ,  Yu-An Chen

IPC: H05K3/46 ,  B23K26/402 ,  H05K3/42 ,  B23K26/382 ,  B23K103/00

CPC classification number: B23K26/402 ,  B23K26/382 ,  B23K26/389 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0341

Abstract: Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.

公开(公告)号：US09570227B1

公开(公告)日：2017-02-14

申请号：US14809295

申请日：2015-07-27

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Chiao-Cheng Chang ,  Yi-Nong Lin

IPC: H01F5/00 ,  H01F27/30 ,  H01F27/28

CPC classification number: H01F27/2804

Abstract: Disclosed is a magnetic excitation coil structure including a magnetic coil sheet formed of a thin film and rolled as a cylindrical body with a hollow hole, and an insulation layer covering the outer surface of the cylindrical body formed by the magnetic coil sheet for protection. The magnetic coil sheet includes a flexible substrate, a dielectric layer attached to the flexible substrate, and a plurality of patterned circuit layers embedded in the flexible substrate and in contact with the dielectric layer. Each patterned circuit layer is separate, and the upper surfaces of the patterned circuit layers and the upper surface of the flexible substrate form a co-plane. The magnetic coil structure provides an electrical function of coil, which is enhanced by the patterned circuit layer due to its high aspect ratio of the electrical circuit, thereby greatly increasing the whole magnetic flux and electromagnetic effect.

Abstract translation: 公开了一种磁激励线圈结构，其包括由薄膜形成的作为具有中空孔的圆筒体并被卷绕的电磁线圈片，以及覆盖由用于保护的电磁线圈片形成的圆筒体的外表面的绝缘层。 磁性线圈片包括柔性衬底，附着到柔性衬底的电介质层和嵌入在柔性衬底中并与电介质层接触的多个图案化电路层。 每个图案化电路层是分离的，并且图案化电路层的上表面和柔性基板的上表面形成共面。 磁线圈结构提供线圈的电功能，由于其电路的高纵横比而由图案化电路层增强，从而大大增加了整个磁通量和电磁效应。

公开(公告)号：US09439290B1

公开(公告)日：2016-09-06

申请号：US14817268

申请日：2015-08-04

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Chiao-Cheng Chang ,  Yi-Nong Lin

IPC: H01F27/30 ,  H01F5/00 ,  H01F27/29 ,  H05K1/18 ,  H05K1/02 ,  H01F27/28

CPC classification number: H05K1/028 ,  H01F17/0013 ,  H05K1/118 ,  H05K1/165 ,  H05K2201/09036 ,  H05K2201/09063

Abstract: A carrier board structure includes at least one upper magnetic coil, at least one lower magnetic coil, a flexible board, a dielectric layer, at least one connection pad and at least one gold finger. The flexible board has a middle region having a middle hole, and two side regions thinner than the middle region. A groove used as a fold line is provided on the lower surface of each side region bordering on the middle region. The upper and lower magnetic coils are configured in the flexible board and separated by the dielectric layer. The gold fingers are provided on the two side regions and connected to the upper magnetic coils. The upper and lower magnetic coils are around the middle hole and connected by the connection pads. The fold lines help the two side regions to fold without damage to the upper and lower magnetic coils.

Abstract translation: 载体板结构包括至少一个上部磁线圈，至少一个下部磁线圈，柔性电路板，电介质层，至少一个连接焊盘和至少一个金手指。 柔性板具有中间区域，中间部分具有比中间区域薄的两个侧面区域。 用作折线的槽设置在与中间区域接壤的每个侧面的下表面上。 上下磁性线圈配置在柔性电路板中，由电介质层隔开。 金手指设置在两个侧面区域上并连接到上部磁性线圈。 上下磁性线圈围绕中间孔并通过连接垫连接。 折叠线帮助两个侧面区域折叠而不损坏上部和下部磁性线圈。

公开(公告)号：US09198296B1

公开(公告)日：2015-11-24

申请号：US14590235

申请日：2015-01-06

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  Fu-Song Chen

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/187 ,  H05K1/0213 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K2201/0376

Abstract: A double sided board with buried element and a method for manufacturing the same are disclosed. At least one buried element is fixed on a dielectric layer and embedded in an insulation layer. First and second electrical circuits are formed on upper and lower surfaces of the insulation layer, respectively. At least one through-hole is formed in the insulation layer and filled with a conductive layer to electrically connect the first and the second electrical circuits. The dielectric layer beneath the buried element and the insulation layer above the buried element are provided with at least one opening, respectively, which is filled with the conductive layer, thereby connecting the conductive layer and external circuits or electrical elements. Additionally, the first and second electrical circuits are covered with first and second solder masks, respectively, so as to avoid environmental effect and improve preciseness of the circuits.

Abstract translation: 公开了一种具有埋设元件的双面板及其制造方法。 至少一个埋入元件固定在电介质层上并嵌入绝缘层中。 第一和第二电路分别形成在绝缘层的上表面和下表面上。 在绝缘层中形成至少一个通孔，并填充有导电层以电连接第一和第二电路。 掩埋元件下面的绝缘层和掩埋元件上方的绝缘层分别设置有至少一个开口，其中填充有导电层，由此连接导电层和外部电路或电气元件。 此外，第一和第二电路分别被第一和第二焊接掩模覆盖，以避免环境影响并提高电路的精度。