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公开(公告)号：KR1020100121803A
公开(公告)日：2010-11-19
申请号：KR1020090040677
申请日：2009-05-11
Applicant: 전자부품연구원
IPC: H05B37/02
CPC classification number: H05B33/0815 , H05B33/0827 , Y02B20/347
Abstract: PURPOSE: A circuit and a method for driving light emitting diode are provided to restrain the occurrence of ripple of flicker of a load current by directly controlling the forward current of a light emitting diode inputted from the load transistor through the constant current source circuit. CONSTITUTION: A power supply circuit(10) supplies the output voltage to a plurality of light emitting diodes(20). A constant current source circuit(30) controls the optical power of the light emitting diode through the specific bias current value control. The constant current source circuit is either of current reference circuit or darlington circuit.
Abstract translation: 目的：提供驱动发光二极管的电路和方法，通过直流源电路直接控制从负载晶体管输入的发光二极管的正向电流来抑制负载电流的闪烁纹波的发生。 构成：电源电路（10）将输出电压提供给多个发光二极管（20）。 恒流源电路（30）通过特定的偏置电流值控制来控制发光二极管的光功率。 恒流源电路是电流参考电路或达林顿电路。
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公开(公告)号：KR1020100074514A
公开(公告)日：2010-07-02
申请号：KR1020080132974
申请日：2008-12-24
Applicant: 전자부품연구원
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: A package in which a planar light-wave circuit(PLC) is integrated with a heat spreader is provided to improve the operational stability of a PLC device by radiating heat from the PLC device. CONSTITUTION: A heat spreader(10) includes an upper metal film, an insulating film, a lower metal film and a protective film. The heat spreader is formed into a housing shape with a wick structure. A PLC chip(20) is attached on the upper metal film of a heat spreader. The heat spreader and the PLC chip are packaged. The insulating film is composed of ceramics.
Abstract translation: 目的：提供平面光波电路（PLC）与散热器一体化的封装，通过辐射来自PLC设备的热量来提高PLC设备的运行稳定性。 构成：散热器（10）包括上金属膜，绝缘膜，下金属膜和保护膜。 散热器形成具有灯芯结构的壳体形状。 PLC芯片（20）安装在散热器的上金属膜上。 散热器和PLC芯片封装。 绝缘膜由陶瓷组成。
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公开(公告)号：KR1020080113774A
公开(公告)日：2008-12-31
申请号：KR1020070062663
申请日：2007-06-26
Applicant: 전자부품연구원
IPC: G02B6/43
Abstract: A fabrication method for fiber array device is provided to reduce manufacturing time and cost since there is no need to polish the optical fiber array throughout. A fabrication method for fiber array device is comprised of steps: forming V-shape to mount optical fiber on the top of a substrate of which one side is cut by the angle of Œ5 -15‹ to a horizontal plane; preparing the optical fiber of which end is cut by the angle of Œ5~15‹ to the horizontal plane and mounting it in the groove; injecting the adhesive(140) into the top surface of the substrate; covering a cover(130) on the top of the optical fiber mounted on the top of substrate.
Abstract translation: 提供了一种用于光纤阵列器件的制造方法，以减少制造时间和成本，因为不需要在整个光纤阵列上进行抛光。 纤维阵列器件的制造方法包括以下步骤：形成V形以将光纤安装在其一侧被切割成与水平面成角度-15°-15°的基底的顶部上; 准备将其末端与水平面切割成角度为5〜15°的光纤，并将其安装在槽中; 将粘合剂（140）注入基材的顶表面; 覆盖安装在基板顶部上的光纤的顶部上的盖（130）。
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公开(公告)号：KR1020080103713A
公开(公告)日：2008-11-28
申请号：KR1020070050774
申请日：2007-05-25
Applicant: 전자부품연구원
IPC: G02B6/28
Abstract: An athermal arrayed waveguide diffraction grating including a bimetal part and a diffraction jig is provided to facilitate a micro angle adjustment of an optical fiber by broadening a temperature compensation range. An athermal arrayed waveguide diffraction grating comprises the followings: a input waveguide; a first slab waveguide(102) diffracting an optical signal inputted through the input waveguide; a array waveguide(103) delivering an output signal of the first slab waveguide to a second slab wave guide(104); an output waveguide(105) condensing the output signal of the array waveguide; an input optical fiber(101) connected to the input waveguide, and positioned between the input waveguide and the first slab waveguide; a bimetal part(120) controlling a location of the input optical fiber with a bimetal operation according to a temperature change; and a diffraction jig(110) diversifying an angle of the optical fiber, and positioned between the bimetal part and the first slab waveguide.
Abstract translation: 提供了包括双金属部分和衍射夹具的无阵列阵列波导衍射光栅，以通过拓宽温度补偿范围来促进光纤的微角度调整。 无阵列阵列波导衍射光栅包括：输入波导; 第一平板波导（102）衍射通过输入波导输入的光信号; 将第一平板波导的输出信号传送到第二平板波导管的阵列波导管; 输出波导（105），其聚集阵列波导的输出信号; 输入光纤（101），连接到输入波导，并且位于输入波导和第一平板波导之间; 双金属部件（120），其根据温度变化通过双金属操作来控制所述输入光纤的位置; 以及衍射夹具（110），其使所述光纤的角度分散，并且位于所述双金属部件和所述第一平板波导之间。
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公开(公告)号：KR100822337B1
公开(公告)日：2008-04-15
申请号：KR1020060072155
申请日：2006-07-31
Applicant: 전자부품연구원
Abstract: 본 발명은 브래그 격자(Bragg grating)를 이용한 광센서 칩 및 그의 제조 방법에 관한 것으로, 기판과; 상기 기판 상부에 형성된 클래드층과; 상기 클래드층 내부에 개재되어 있는 코어층과; 상기 코어층으로 입사되는 광 중 특정 파장을 중심으로 일정 대역의 광을 반사시키고 나머지 광은 통과시키도록, 상기 코어층에 형성되어 있는 브래그 격자패턴으로 구성된다.
또한, 본 발명은 PLC(Planar Lightwave Circuit) 기술을 이용하여 한 웨이퍼 안에다 수십∼수백개의 광센서칩을 동시에 노광시켜 양산해 낼 수 있으므로, 소자의 저가격화를 수행할 수 있는 효과가 있다.
브래그, 격자, 반사, 센서, 칩-
Patent Agency Ranking
公开(公告)号：KR1020080011765A
公开(公告)日：2008-02-11
申请号：KR1020060072155
申请日：2006-07-31
Applicant: 전자부품연구원
Abstract: An optical sensor chip using Bragg grating and a method for manufacturing the same are provided to expose the numerous optical sensor chips in one wafer at the same time by using a PLC(Planar Lightwave Circuit) technology. An optical sensor chip using Bragg grating includes a substrate, a clad layer(200), a core layer(250), and a Bragg grating pattern(251). The clad layer is formed on the substrate. The core layer is incorporated in the clad layer. The Bragg grating pattern is formed in the core layer so as to reflect one light beam having a predetermined band and transmit other light beams among light beams incident in the core layer. The substrate is a silicon substrate. The clad layer is a high-density silica film. The core layer is a germanium oxide film. The core layer is divided into plural core layer areas. The Bragg grating pattern is formed in each of the core layer areas. Optical fibers are optically arranged at one side of the core layer.
Abstract translation: 提供了使用布拉格光栅的光学传感器芯片及其制造方法，以通过使用PLC（平面光波电路）技术同时在一个晶片中露出多个光学传感器芯片。 使用布拉格光栅的光学传感器芯片包括衬底，包覆层（200），芯层（250）和布拉格光栅图案（251）。 覆层在基板上形成。 芯层结合在包覆层中。 在芯层中形成布拉格光栅图案，以便反射具有预定带的一个光束并在入射到芯层中的光束之间传输其他光束。 衬底是硅衬底。 包覆层是高密度二氧化硅膜。 核心层是氧化锗膜。 芯层分为多个芯层区域。 在每个核心层区域中形成布拉格光栅图案。 光纤布置在核心层的一侧。
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公开(公告)号：KR1020070006306A
公开(公告)日：2007-01-11
申请号：KR1020050061534
申请日：2005-07-08
Applicant: 전자부품연구원
CPC classification number: G02B6/3861 , G02B6/3833 , G02B6/4249
Abstract: An optical fiber array element manufacturing method is provided to simplify the process and to reduce the cost by producing optical fiber array elements by using rectangular single substrates at upper and lower, and left and right sides of an optical fiber. An optical fiber array element manufacturing method includes steps of: arranging a left substrate(130) after disposing a lower substrate(100) and an auxiliary substrate(110) on an L-shaped structure or arranging a right substrate(140) after disposing the lower substrate and the auxiliary substrate on a horizontally inversed L-shaped structure; aligning optical fibers(150) on the substrate with regulating the intervals; contacting the lower substrate with the optical fiber by placing an upper substrate(120) on the optical fiber and then applying pressure to the lower substrate; closely contacting the optical fiber to the left and right substrates by disposing the substrate on the opposite side to the left or right substrate and applying pressure; and fixing the upper, lower, left, and right substrates and the optical fiber by injecting an adhesive agent(160) to the structure comprising the substrates.
Abstract translation: 提供一种光纤阵列元件制造方法，通过在光纤的上下左右两侧使用矩形单个基板来简化工艺并通过制造光纤阵列元件来降低成本。 一种光纤阵列元件的制造方法，包括以下步骤：在将L基板（100）和辅助基板（110）配置在L字形结构上之后，配置左侧基板（130） 下基板和辅助基板在水平倒置的L形结构上; 在衬底上对准光纤（150）以调节间隔; 通过将上基板（120）放置在光纤上，然后向下基板施加压力，使下基板与光纤接触; 通过将基板设置在左或右基板的相对侧并施加压力，使光纤紧密接触左右基板; 以及通过将粘合剂（160）注射到包括所述基底的结构中来固定所述上，下，左，右和右基底和所述光纤。
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公开(公告)号：KR1020060061630A
公开(公告)日：2006-06-08
申请号：KR1020040100424
申请日：2004-12-02
Applicant: 전자부품연구원
IPC: G02B6/13
CPC classification number: G02B6/13 , B05D1/005 , G02B2006/12038 , G02B2006/12176
Abstract: 본 발명은 광도파로 소자 제조 방법에 관한 것으로, 광도파로 형상의 개구가 형성된 형틀판을 이용하여 광도파로 소자를 형성함으로써, 고가의 공정장비가 불필요하고, 공정이 간단하여 제조 경비를 절감하고 대량 생산할 수 있으며, 대면적의 광도파로 소자 제작이 가능하고 두께가 큰 광도파로를 쉽게 얻을 수 있는 효과가 있다.
광도파로, 소자, 개구, 형틀판-
公开(公告)号：KR1020040093799A
公开(公告)日：2004-11-09
申请号：KR1020030027628
申请日：2003-04-30
Applicant: 전자부품연구원
IPC: G02B6/40
Abstract: PURPOSE: A method for fabricating an optical array device is provided, in which an etching process and a lithography process are removed and an optical array device is manufactured without an endface process. CONSTITUTION: In the device, an optical fiber(120) having an uncovered coating layer is arrayed on a substrate(100) which is an inverted L shape. A coreless optical fiber(140) is inserted to control an interval between the optical fibers. A predetermined cover(110) is formed thereon. The optical fiber, the substrate, and the cover are adhered closely to each other by pressing and sliding the cover. And, then the optical fiber, the substrate, and the cover are adhered each other by using an adhesive(130).
Abstract translation: 目的：提供一种制造光学阵列器件的方法，其中去除蚀刻工艺和光刻工艺，并且在没有端面工艺的情况下制造光学阵列器件。 构成：在该装置中，将具有未覆盖的涂层的光纤（120）排列在倒L形的基板（100）上。 插入无芯光纤（140）以控制光纤之间的间隔。 在其上形成预定的盖（110）。 通过按压和滑动盖子，光纤，基板和盖子彼此紧密地彼此粘合。 然后，使用粘合剂（130）将光纤，基板和盖子彼此粘合。
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公开(公告)号：KR100392324B1
公开(公告)日：2003-07-22
申请号：KR1019990010299
申请日：1999-03-25
Applicant: 전자부품연구원
Abstract: PURPOSE: A heterozygous dielectric resonator and a band-pass filter therewith is provided to guarantee a temperature stability and utilize more kinds of dielectric substance having various characteristics for the resonator and filter therewith. CONSTITUTION: A heterozygous dielectric resonator and a band-pass filter therewith includes 1/4 wavelength (lambda) resonator which is generally a cylindrical coaxial type. A body(10) of the resonator has a longitudinal hole(11), and is coated with a conductive material(12) on the inside and the outside of the cylindrical type. A side of the hole(11) is opened and the other side is closed as an open side(13) and a short-circuit side(14). The dielectric substance includes a dielectric material having a high permittivity(epsilon r) and a low dielectric loss(tan delta). The dielectric substances includes a negative(-) temperature coefficient and a positive(+) temperature coefficient of a resonant frequency(tau f) are longitudinally connected in a determined longitudinal ratio. The first dielectric material(20), connected the short-circuit side(14), has a bigger dielectric constant than a second dielectric material(30), to shorten a total length of the resonator.
Abstract translation: 目的：提供一种杂合介质谐振器及其带通滤波器，以保证温度稳定性并利用具有各种特性的更多种类的介电物质用于谐振器和滤波器。 构成：杂合介质谐振器和带通滤波器包括通常为圆柱形同轴型的1/4波长（λ）谐振器。 谐振器的主体（10）具有纵向孔（11），并且在圆柱形类型的内侧和外侧上涂覆有导电材料（12）。 孔11的一侧打开，另一侧作为开路侧13和短路侧14闭合。 电介质包括具有高介电常数（εr）和低介电损耗（tanδ）的介电材料。 介电物质包括以确定的纵向比率纵向连接的负（ - ）温度系数和谐振频率（τf）的正（+）温度系数。 连接短路侧（14）的第一介电材料（20）具有比第二介电材料（30）更大的介电常数，以缩短谐振器的总长度。
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