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公开(公告)号：KR1020040036377A
公开(公告)日：2004-04-30
申请号：KR1020020065381
申请日：2002-10-25
Applicant: 전자부품연구원
CPC classification number: H01B3/12 , C04B35/46 , C04B35/6262 , C04B35/6303
Abstract: PURPOSE: Provided is a low temperature co-fired ceramic(LTCC) composition, which has a high dielectric constant and a low firing temperature of 950 deg.C or less, which is lower than the melting point of a silver electrode. CONSTITUTION: The LTCC composition comprises TiO2 as a dielectric material having a high dielectric constant, and TeO2 as a low temperature co-firing agent. Particularly, the content of TeO2 is 3-15 mol%. The LTCC composition has a dielectric constant of 80 or more. The LTCC composition is prepared by the method comprising the steps of: weighing TiO2 and TeO2 powders and ball milling the powders; sintering the milled powders; forming the sintered powders; and firing the formed product at a temperature of 800-950 deg.C.
Abstract translation: 目的：提供一种低温共烧陶瓷（LTCC）组合物，其具有高的介电常数和950℃以下的低烧结温度，低于银电极的熔点。 构成：LTCC组合物包含TiO 2作为具有高介电常数的介电材料，TeO 2作为低温共烧发剂。 特别地，TeO 2的含量为3〜15摩尔％。 LTCC组合物的介电常数为80以上。 通过包括以下步骤的方法制备LTCC组合物：称重TiO 2和TeO 2粉末并粉碎粉末; 烧结研磨粉末; 形成烧结粉末; 并在800-950℃的温度下焙烧成形产品。
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公开(公告)号：KR100424408B1
公开(公告)日：2004-03-25
申请号：KR1020020008453
申请日：2002-02-18
Applicant: 전자부품연구원
Abstract: PURPOSE: An apparatus and a method for measuring a characteristic of an RF(Radio Frequency) signal transmission line are provided to accurately measure the transmission line of an RF signal inputted in a distributed feedback laser diode chip by measuring the characteristic of the RF signal in a package module. CONSTITUTION: A package module, having a transmission line in which an RF signal is inputted, is safely received in a PCB(Printed Circuit Board)(140). A microstrip line(120) is formed at one side of an upper surface of the PCB(140), and is electrically connected with a lead connected to one side of the transmission line of the package module. A connector(110) is connected with the microstrip line(120) by a conductor(111). A coaxial cable(130) is electrically connected with the other side of the transmission line by a conductor(131). A network analyzer(200) is connected with the coaxial cable(130) at the its first port, and is connected with a coaxial cable(150) connected with the connector(110), at the its second port, for measuring the RF signal.
Abstract translation: 目的：提供一种用于测量RF（射频）信号传输线的特性的设备和方法，以通过测量分布反馈激光二极管芯片中输入的RF信号的特性来准确测量输入到分布反馈激光二极管芯片中的RF信号的传输线 一个封装模块。 构成：具有其中输入RF信号的传输线的封装模块被安全地接收在PCB（印刷电路板）（140）中。 微带线（120）形成在PCB（140）的上表面的一侧，并且与连接到封装模块的传输线的一侧的引线电连接。 连接器（110）通过导体（111）与微带线（120）连接。 同轴电缆（130）通过导体（131）与传输线的另一侧电连接。 网络分析仪（200）在其第一端口与同轴电缆（130）连接，并且在其第二端口连接有与连接器（110）连接的同轴电缆（150），用于测量RF信号 。
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公开(公告)号：KR1020030043187A
公开(公告)日：2003-06-02
申请号：KR1020010074238
申请日：2001-11-27
Applicant: 전자부품연구원
IPC: H01L23/28
Abstract: PURPOSE: A method for manufacturing a window structure and an apparatus for fixing the window structure are provided to be capable of reducing manufacturing cost and simplifying manufacturing processes by carrying out the manufacturing processes without a photolithography process. CONSTITUTION: Mask paste(61) is printed on the center portion of the upper surface of a disc(60), wherein the disc(60) is used as a window of a photo diode package. After drying the mask paste(61), a metal layer(62) is deposited on the entire surface of the resultant structure. After carrying out a planarization process for exposing the mask paste(61), a groove is formed on the upper portion of the disc(60) by removing the mask paste(61). Preferably, the mask paste(61) has a viscosity of 2000-300000 cps.
Abstract translation: 目的：提供一种用于制造窗户结构的方法和用于固定窗户结构的设备，以便能够通过在没有光刻工艺的情况下进行制造工艺来降低制造成本并简化制造工艺。 构成：将掩模膏（61）印刷在盘（60）的上表面的中心部分，其中盘（60）用作光电二极管封装的窗口。 干燥掩模膏（61）后，在所得结构的整个表面上沉积金属层（62）。 在进行用于曝光掩模膏（61）的平坦化处理之后，通过去除掩模膏（61）在盘（60）的上部形成凹槽。 优选地，掩模膏（61）的粘度为2000〜300000cps。
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公开(公告)号：KR101387317B1
公开(公告)日：2014-04-18
申请号：KR1020120012994
申请日：2012-02-08
Applicant: 전자부품연구원
Abstract: 본 발명은 탄소 나노 튜브의 제조방법에 관한 것이다. 본 발명의 탄소 나노 튜브의 제조방법은, 제1탄소 소재에 원심력에 의해 전도성 입자를 응집시키는 단계 및 상기 전도성 입자가 응집된 제1탄소 소재를 나노 튜브로 성장시키는 단계를 포함한다. 본 발명의 탄소 나노 튜브의 제조방법에 따르면, 재현성 있고 효율적인 방법으로 탄소 나노 튜브를 제조할 수 있다.
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公开(公告)号：KR101332405B1
公开(公告)日：2013-11-22
申请号：KR1020120017051
申请日：2012-02-20
Applicant: 전자부품연구원
Abstract: 기판에 절연층을 형성하는 방법으로, 세라믹 분말을 이용하여 원료 분말을 생성하고, 원료 분말을 에어로졸 증착법을 이용하여 기판에 분사시켜서 세라믹 박막층을 형성한 다음 상기 세라믹 박막층이 형성된 기판 위에 세라믹 그린 시트를 부착시킨 후 소결하여 절연층을 형성한다.
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Patent Agency Ranking
公开(公告)号：KR1020130116590A
公开(公告)日：2013-10-24
申请号：KR1020120039117
申请日：2012-04-16
Applicant: 전자부품연구원
Abstract: PURPOSE: A manufacturing method of a conductive membrane is provided to render a conductive ink with low temperature sintering by using a main group element-based reducing agent, thereby forming an electric pattern on various heat-sensitive substrates such as paper and plastic. CONSTITUTION: A method of manufacturing a conductive membrane using a main group element-based reducing agent comprises steps of: a step of coating a conductive ink on a substrate; a step of sintering the conductive ink by coating the main group element-based reducing agent on the coated conductive ink; and a step of washing the conductive membrane formed by sintering the conductive ink. The sintering step for the conductive ink by coating the main group element-based reducing agent is processed in the temperature between 0 to 150°C among general atmosphere, vacuum, oxygen, nitrogen, and argon. [Reference numerals] (AA) Step of coating a conductive ink on a substrate; (BB) Step of sintering the conductive ink by coating the main group element-based reducing agent; (CC) Step of washing the conductive membrane
Abstract translation: 目的：提供一种导电膜的制造方法，通过使用主要基于元素的还原剂来形成具有低温烧结的导电油墨，从而在各种热敏基材如纸和塑料上形成电图案。 构成：使用主要基于元素的还原剂制造导电膜的方法包括以下步骤：在基板上涂覆导电油墨的步骤; 通过在所述涂覆的导电油墨上涂覆所述主要元素基还原剂来烧结所述导电油墨的步骤; 以及洗涤通过烧结导电油墨形成的导电膜的步骤。 通过涂覆主要元素基还原剂的导电油墨的烧结步骤在一般气氛，真空，氧气，氮气和氩气中在0至150℃之间的温度下进行处理。 （附图标记）（AA）在基板上涂布导电油墨的工序; （BB）通过涂覆主要元素基还原剂烧结导电油墨的步骤; （CC）洗涤导电膜的步骤
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公开(公告)号：KR1020130095535A
公开(公告)日：2013-08-28
申请号：KR1020120017051
申请日：2012-02-20
Applicant: 전자부품연구원
Abstract: PURPOSE: A method for forming an insulation layer of a substrate is provided to improve bonding property by using a process which is environment-friendly and simple. CONSTITUTION: Raw material powder is sprayed to a substrate. The spraying uses aerosol deposition method. A ceramic thin film layer (122) is formed by the spraying. A ceramic green sheet (124) is attached on the ceramic thin film layer. An insulation layer (120) is formed on the substrate by the attachment.
Abstract translation: 目的：提供一种形成基板绝缘层的方法，通过使用环境友好且简单的工艺来改善粘合性能。 构成：将原料粉末喷涂到基材上。 喷雾使用气溶胶沉积法。 通过喷涂形成陶瓷薄膜层（122）。 陶瓷生片（124）附着在陶瓷薄膜层上。 通过附件在基板上形成绝缘层（120）。
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公开(公告)号：KR1020130091595A
公开(公告)日：2013-08-19
申请号：KR1020120012994
申请日：2012-02-08
Applicant: 전자부품연구원
Abstract: PURPOSE: A manufacturing method of carbon nano-tubes is disclosed which makes it possible to produce reproducible carbon nano-tubes with a faster, simpler and more environmentally friendly process than the conventional one, to cut costs of the process and to enhance productivity. CONSTITUTION: A manufacturing method of carbon nano-tubes comprises the steps of: cohering conductive particles of a fist carbon material by using centrifugal force, and cultivating the first carbon material with the cohered conductive particles to be nano-tubes. The cohesion stage comprises following steps: injecting the first carbon material to a chamber and rotating the camber and injecting the conductive particles in the rotating chamber. [Reference numerals] (AA) Expanded graphite; (BB) Ni nano particle
Abstract translation: 目的：公开了一种碳纳米管的制造方法，其使得可以以比传统碳纳米管更快，更简单和更环保的方法生产可再生碳纳米管，以降低该方法的成本并提高生产率。 构成：碳纳米管的制造方法包括以下步骤：通过离心力粘结第一碳材料的导电颗粒，并将具有粘结的导电颗粒的第一碳材料培养成纳米管。 内聚阶段包括以下步骤：将第一碳材料注入室中并旋转外倾角并将导电颗粒注入旋转室。 （标号）（AA）膨胀石墨; （BB）Ni纳米颗粒
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公开(公告)号：KR101153818B1
公开(公告)日：2012-07-03
申请号：KR1020090091343
申请日：2009-09-25
Applicant: 전자부품연구원
Abstract: PURPOSE: An LED module and a manufacturing method thereof are provided to improve performance and reliability by preventing degradation by forming a solder resist layer on a ceramic PCB with a ceramic rear printing method. CONSTITUTION: A ceramic PCB(110) includes a bottom part(111) and a partition part(112). An LED package(120) is mounted in an inner space comprised of the bottom part and the partition part. A cover(130) covers the upper side of the ceramic PCB. A heat sink is positioned on the lower side of the ceramic PCB. The heat sink discharges heat from the LED package to the outside.
Abstract translation: 目的：提供一种LED模块及其制造方法，其通过在陶瓷PCB上通过陶瓷后印刷方法形成阻焊层来防止劣化来提高性能和可靠性。 构成：陶瓷PCB（110）包括底部（111）和分隔部分（112）。 LED封装（120）安装在由底部和分隔部分构成的内部空间中。 盖（130）覆盖陶瓷PCB的上侧。 散热器位于陶瓷PCB的下侧。 散热片将LED封装的热量排放到外部。
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公开(公告)号：KR101104134B1
公开(公告)日：2012-01-13
申请号：KR1020090104542
申请日：2009-10-30
Applicant: 전자부품연구원
Abstract: 반도체 칩 패키징 방법이 개시된다. 본 발명에 따른 반도체 칩 패키징 방법은 다이싱 테잎(tape)에 웨이퍼를 부착시켜 다이싱하고, 다이싱된 칩(diced chip) 영역을 커버하는 노광부위를 포함하는 포토마스크를 통해 다이싱 테잎을 노광시켜 기판 상에 칩 부착영역을 정의하도록 노광시킨다. 다이싱 테잎을 기판과 접촉시켜 노광부위에 대응하는 칩을 기판의 칩 부착영역에 부착시킨다. 그 후, 다이싱 테잎이 부착된 칩이 포토마스크의 노광부위에 대응되도록 다이싱 테잎을 일정한 간격만큼 이동시킨다. 이에 따라 초소형 반도체 칩의 패키징 공정시간을 단축시킬 수 있다.
다이싱 테잎(Dicing Tape), 포토마스크(Photomask)
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