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公开(公告)号：KR1020130054028A
公开(公告)日：2013-05-24
申请号：KR1020110119806
申请日：2011-11-16
Abstract: PURPOSE: A substrate bonding method is provided to arrange an edge of a bonding surface of an anisotropic conductive film in an upper direction of a protruded part, thereby evenly bonding a flexible circuit board in a central part of the anisotropic conductive film. CONSTITUTION: Bonding objects(100) are sequentially stacked in a stage(11) having a protruded part(11a). The protruded part is formed to have a curvature embossed to a top part. The bonding object has a substrate(20), an anisotropic conductive film(30) and a flexible circuit board(40). The bonding objects are pressurized through a bonding member(10). The bonding objects are reciprocally bonded.
Abstract translation: 目的：提供一种基板接合方法，用于将各向异性导电膜的接合表面的边缘布置在突出部分的上方，从而将柔性电路板均匀地粘合在各向异性导电膜的中心部分。 构成：在具有突出部分（11a）的台（11）中顺序堆叠粘合物（100）。 突出部分形成为具有压花到顶部的曲率。 接合体具有基板（20），各向异性导电膜（30）和柔性电路基板（40）。 接合物通过接合构件（10）加压。 粘结物体相互粘合。
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公开(公告)号：KR1020130030094A
公开(公告)日：2013-03-26
申请号：KR1020110093635
申请日：2011-09-16
Applicant: 한국과학기술원
CPC classification number: B29C65/02 , B29C65/08 , B29C66/9121 , B29C66/9141 , B29C66/9512 , B29C66/9516 , B29C66/963
Abstract: PURPOSE: A bonding device including a bonding temperature optimizing device and an optimizing method of bonding temperature using the same are provided to optimize the bonding temperature corresponding to a bonding object by detecting the temperature of binding agents arranged between the bonding objects when bonding the bonding object with ultrasonic waves or a thermo compression bonding method. CONSTITUTION: A bonding device including a bonding temperature optimizing device comprises an ultrasonic generator(110), a vibration tool(120), a temperature detecting unit(130), a display unit(140), and a control unit(150). The ultrasonic generator converts common electricity applied from the outside into electric power of an ultrasonic frequency. The vibration tool converts the electric power into mechanical vibration energy and transfers amplified vibration energy to a binding agent(15) arranged between a bonding objects(10). The temperature detecting unit is located between the bonding objects and directly detects heating temperature generated in the binding agent due to the vibration energy. The display unit displays one of temperature detected through the temperature detecting unit or a waveform of the electric power outputted from the ultrasonic generator. The control unit mutually compares the predetermined temperature with the temperature detected through the temperature detecting unit and variably controls output of the ultrasonic frequency so that the detected temperature is closed to the predetermined temperature. The control unit stores outputs in which are variably controlled according to time. [Reference numerals] (110) Ultrasonic generator; (140) Display unit; (150) Control unit; (160) Input unit; (AA) Commercial electricity
Abstract translation: 目的：提供包括接合温度优化装置和使用其的接合温度的优化方法的接合装置，以通过检测粘合物体之间的结合剂的粘合剂的温度来优化与接合体相对应的接合温度 用超声波或热压接法。 构成：包括接合温度优化装置的接合装置包括超声波发生器（110），振动工具（120），温度检测单元（130），显示单元（140）和控制单元（150）。 超声波发生器将从外部施加的普通电力转换为超声频率的电力。 振动工具将电力转换成机械振动能量，并将放大的振动能量转移到布置在结合物体（10）之间的粘合剂（15）。 温度检测单元位于结合对象之间，并且由于振动能量而直接检测粘合剂中产生的加热温度。 显示单元显示通过温度检测单元检测的温度之一或从超声波发生器输出的电力波形。 控制单元将预定温度与通过温度检测单元检测到的温度进行相互比较，并且可变地控制超声波频率的输出，使得检测到的温度接近预定温度。 控制单元存储根据时间可变地控制的输出。 （附图标记）（110）超声波发生器; （140）显示单元; （150）控制单元; （160）输入单元; （AA）商业用电
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公开(公告)号：KR1020120109145A
公开(公告)日：2012-10-08
申请号：KR1020110027378
申请日：2011-03-28
Applicant: 한국과학기술원
IPC: C09J11/00 , C09J7/00 , C09J201/00 , B05D5/10
CPC classification number: C09J11/00 , C08K3/08 , C08K3/36 , C08K5/375 , C08K7/16 , C08K2201/001 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2201/61 , C09J2203/326 , C09J2205/31 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/83101 , H01L2224/83203 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83885 , H01L2924/351 , H01L2924/00
Abstract: PURPOSE: A resin composition for an adhesive film is provided to have by semi-permanent by having excellent storage performance, to not have limitations of drying process, and to be able to improve reliability and adhesion of a package. CONSTITUTION: A manufacturing method of a resin composition for an adhesive film comprises: a step of preparing 5-60 weight% of a thermoplastic resin, 25-94.9 weight% of a thermosetting resin, and 0.1-30 weight% of a light-latent hardener; a step of preparing 40-250 weight% of an organic solvent based on a total weight of the thermoplastic resin, thermosetting resin and light-latent hardener combined; and a step of manufacturing the resin composition for the adhesive film by mixing and dissolving the thermoplastic resin, thermosetting resin, light-latent hardener, and the organic solvent.
Abstract translation: 目的：通过具有优异的储存性能，不具有干燥过程的限制，并且能够提高包装的可靠性和附着性，提供了用于粘合剂膜的树脂组合物具有半永久性。 构成：粘接膜用树脂组合物的制造方法，其特征在于，制备热塑性树脂5-60重量％，热固性树脂25-94.9重量％，光潜组分0.1-30重量％ 硬化剂; 基于热塑性树脂，热固性树脂和光潜硬化剂的总重量，制备40-250重量％的有机溶剂的步骤; 以及通过混合和溶解热塑性树脂，热固性树脂，光潜硬化剂和有机溶剂来制造粘合剂膜用树脂组合物的步骤。
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公开(公告)号：KR1020120028583A
公开(公告)日：2012-03-23
申请号：KR1020100090520
申请日：2010-09-15
Applicant: 한국과학기술원
Abstract: PURPOSE: A conductive polymer adhesive having excellent mechanical strength is provided to effectively restrain the flow of the conductive particles, and to have excellent electrical insulative properties and thermal-mechanical strengths. CONSTITUTION: A conductive polymer adhesive comprises: a polymer nanofiber structure irregularly shaped in one or more adhesive layers including a first adhesive layer and a second adhesive layer respectively or together; and one or more of a part in which conductive particles are distributed in a space set by the polymer nanofiber structures. The adhesive layer including the first adhesive layer and the second adhesive layer is an anisotropic conductive film or a non-conductive film.
Abstract translation: 目的：提供具有优异机械强度的导电聚合物粘合剂，以有效地抑制导电颗粒的流动，并且具有优异的电绝缘性能和热机械强度。 构成：导电聚合物粘合剂包括：聚合物纳米纤维结构，其在一个或多个粘合剂层中不规则地成形，分别包括第一粘合剂层和第二粘合剂层; 以及其中导电颗粒分布在由聚合物纳米纤维结构设置的空间中的一部分中的一种或多种。 包括第一粘合剂层和第二粘合剂层的粘合剂层是各向异性导电膜或非导电膜。
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公开(公告)号：KR101115686B1
公开(公告)日：2012-03-05
申请号：KR1020090092623
申请日：2009-09-29
Applicant: 한국과학기술원
Abstract: 본발명은제1전자부품의전기접속부인제1접속부와제2전자부품의전기접속부인제2접속부간의선택적통전및 제1전자부품과제2전자부품간의기계적결합을위한이방전도성필름(ACF; Anisotropic Conductive Film)에관한것으로, 상세하게본 발명에따른이방전도성필름은비전도성폴리머인나노파이버(nano fiber) 및전도성입자를포함하고상기전도성입자가상기나노파이버의폴리머에감싸여(embedded) 물리적으로상기나노파이버에고정되어있으며상기전도성입자가고정된상기나노파이버가서로불규칙적으로엉켜형성된나노구조체;를함유하는특징이있다.
Abstract translation: 本发明涉及第一电子部件的电连接部分和第二电子部件的第二电部分的第二部分之间的第一电子部件的通电和通电。 详细地说，根据本发明的各向异性导电膜包括作为非导电聚合物的纳米纤维和导电粒子，并且导电粒子嵌入在纳米纤维的聚合物中并物理嵌入纳米纤维中。 并且固定到纳米颗粒的纳米结构和固定有导电颗粒的纳米纤维彼此不规则地缠结。
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Patent Agency Ranking
公开(公告)号：KR1020110131972A
公开(公告)日：2011-12-07
申请号：KR1020100051725
申请日：2010-06-01
Applicant: 한국과학기술원
CPC classification number: H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/83851 , H01L2924/07811 , H01L2924/00
Abstract: PURPOSE: An electronic component assembly for flowing a bulk of a current and a forming method thereof are provided to reduce contact resistance by connecting the electrodes connected to electronic components with an area contact. CONSTITUTION: A first electronic component with a first electrode(110) is prepared. The adhesive member including a conductive connection particle(410) is arranged on the first electrode. A second electronic component with a second electrode(310) is prepared. A second electronic component is arranged to contact the second electrode with the adhesive member. An area contact part, which is contacted with at least one of the first electrode and the second electrode, is formed.
Abstract translation: 目的：提供用于流动电流的电子部件组件及其形成方法，以通过将连接到电子部件的电极与区域接触连接来减小接触电阻。 构成：制备具有第一电极（110）的第一电子部件。 包括导电连接颗粒（410）的粘合剂构件设置在第一电极上。 制备具有第二电极（310）的第二电子部件。 第二电子部件布置成使第二电极与粘合部件接触。 形成与第一电极和第二电极中的至少一个接触的区域接触部。
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公开(公告)号：KR1020110006012A
公开(公告)日：2011-01-20
申请号：KR1020090063434
申请日：2009-07-13
Applicant: 한국과학기술원
CPC classification number: C09J9/02 , C08K7/16 , C09J5/06 , C09J11/08 , C09J2203/326 , C09J2205/31 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29311 , H01L2224/29316 , H01L2224/29386 , H01L2224/2939 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/2949 , H01L2224/29493 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/83205 , H01L2224/83206 , H01L2224/83815 , H01L2224/83851 , H01L2224/83855 , H01L2224/83905 , H01L2924/00013 , H01L2924/01029 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/07811 , H01L2924/12041 , H01L2924/15788 , H01L2924/351 , H01L2924/014 , H01L2924/00014 , H01L2924/01083 , H01L2924/0103 , H01L2924/01047 , H01L2924/01079 , H01L2924/0105 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/0665
Abstract: PURPOSE: An anisotropic conductive adhesive is provided to reduce constant resistance between two electrodes, to allow a bulk of current to flow, and to prevent thermal transformation of electronic components. CONSTITUTION: An anisotropic conductive adhesive includes: an insulating polymer resin(430); bonding particles(410) which is welded by heat generated by ultrasonic wave applied to the anisotropic conductive adhesive; and spacer particles(420) with a melting point higher than that of the bonding particles.
Abstract translation: 目的：提供各向异性导电粘合剂以减少两个电极之间的恒定电阻，以允许大量电流流动，并防止电子部件的热转换。 构成：各向异性导电粘合剂包括：绝缘聚合物树脂（430）; 通过施加到各向异性导电粘合剂上的超声波产生的热而焊接的粘合颗粒（410） 和间隔物颗粒（420），其熔点高于粘合颗粒的熔点。
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78.发明公开접착제의 발열 온도 조절을 통한 전자부품간 접속 방법 및 접착제의 발열 온도 조절을 통한 전자부품간 접속 장치 无效（通过调节粘合剂的加热温度和调节粘合剂的加热温度之间的电气装置之间的装置来接合电气装置的方法
公开(公告)号：KR1020100053016A
公开(公告)日：2010-05-20
申请号：KR1020080111960
申请日：2008-11-12
Applicant: 한국과학기술원
IPC: H01L21/60
CPC classification number: H05K3/321 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/83194 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H05K2203/0285
Abstract: PURPOSE: A method and an apparatus for bonding electrical devices by adjusting the heating temperature of an adhesive are provided to reduce power consumption by heating the adhesive based on a self-heating system with an ultrasonic vibration. CONSTITUTION: A connection electrode(20) of a second electrical device is arranged on the upper side of a connection electrode(10) of a first electrical device. An ultrasonic vibration is applied to a conductive adhesive or a non-conductive adhesive(30) using a horn(40). The connection electrodes of the first electrical device and the second electrical device are connected. The strain of the adhesive is adjusted by controlling the amplitude of the ultrasonic vibration in order to adjust the temperature of the adhesive.
Abstract translation: 目的：提供一种通过调节粘合剂的加热温度来接合电气装置的方法和装置，以通过基于具有超声波振动的自加热系统加热粘合剂来降低功耗。 构成：第一电气装置的连接电极（10）的上侧配置有第二电气装置的连接电极（20）。 使用喇叭（40）将超声波振动施加到导电粘合剂或非导电粘合剂（30）上。 连接第一电气设备和第二电气设备的连接电极。 通过控制超声波振动的振幅来调节粘合剂的应变以调节粘合剂的温度。
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公开(公告)号：KR100821962B1
公开(公告)日：2008-04-15
申请号：KR1020070059918
申请日：2007-06-19
Applicant: 한국과학기술원
CPC classification number: H01L2224/73104 , H01L2224/83191 , H01L2924/07811 , H01L2924/00
Abstract: A method for fabricating a wafer-level flip-chip package using an ACF/NCA solution is provided to effective suppress shadow effect by directly coating a material of a solution stage having a composition of an ACA(anisotropic conductive adhesive) film or NCA(non-conductive adhesive) film on a wafer. After a mixture solution including insulation polymer resin, a hardening agent and an organic solvent is deposited on a wafer(100) with a non-solder bump(113), the deposited mixture solution(115) is dried to transform the mixture deposited on the wafer into a B-stage. The dried wafer is diced into individual chips. After the diced semiconductor chips(200) are aligned with an electrode of a substrate(300), heat and pressure is applied to perform a flip-chip bonding process. The mixture solution can include a conductive particle having 5~20 weight percent with respect to the insulation polymer resin.
Abstract translation: 提供使用ACF / NCA溶液制造晶片级倒装芯片封装的方法，以通过直接涂覆具有ACA（各向异性导电粘合剂）膜或NCA（非对称性）膜的组成的溶液级的材料来有效抑制阴影效应， 导电粘合剂）膜。 在包含绝缘聚合物树脂，硬化剂和有机溶剂的混合溶液在非焊料凸块（113）上沉积在晶片（100）上之后，将沉积的混合溶液（115）干燥以将沉积在 晶圆进入B阶段。 将干燥的晶片切成单独的芯片。 在切割的半导体芯片（200）与基板（300）的电极对准之后，施加热和压力以执行倒装芯片接合工艺。 混合溶液可以包括相对于绝缘聚合物树脂具有5〜20重量％的导电颗粒。
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公开(公告)号：KR1020070027800A
公开(公告)日：2007-03-12
申请号：KR1020050079620
申请日：2005-08-29
Applicant: 한국과학기술원
IPC: H01L21/60
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
Abstract: A flip chip connecting film is provided to enhance thermal and mechanical characteristics without the degradation of an electrical connection by using a physical property improving layer. A flip chip connecting film includes a physical property improving layer. The physical property improving layer is formed like a three-dimensional network structure. The three-dimensional network structure is obtained by reacting a multi-functional epoxy resin on a hardening agent. The multi-functional epoxy resin contains at least three epoxy radicals. The flip chip connecting film further includes conductive grains.
Abstract translation: 提供了一种倒装芯片连接膜，以通过使用物理性能改进层来增强热和机械特性，而不会降低电连接。 倒装芯片连接膜包括物理性能改进层。 物理性质改善层形成为三维网状结构。 通过使多功能环氧树脂在硬化剂上反应来获得三维网状结构。 多官能环氧树脂含有至少三个环氧基。 倒装芯片连接膜还包括导电颗粒。
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