公开(公告)号：KR1020120071921A

公开(公告)日：2012-07-03

申请号：KR1020100133657

申请日：2010-12-23

Applicant: 한국전자통신연구원

Inventor： 최광성 ,  엄용성 ,  배현철 ,  문종태

IPC: H01L23/48

CPC classification number: H01L21/76898 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

Abstract: PURPOSE: A composition for filling TSVs(Through Silicon Via), a filling method thereof, and a substrate including a TSV filling material manufactured using the composition are provided to improve brittleness, impact resistance, and moisture absorption resistance by providing toughness to an intermetallic compound. CONSTITUTION: Metal powder(100) provides necessary intensity and toughness in a TSV(Through Silicon Via). The 1 to 50 volume% of the metal powder is included based on a gross volume of a composition for TSV filling. Solder power(200) provides an electrical passage while forming an inter metallic compound with the metal powder. A hardened resin(300) absorbs displacement according to stress of metal or a thermal expansion coefficient. The hardened resin prevents moisture from being penetrated into metal or the inter metallic compound in a moisture-absorption reliability test.

Abstract translation: 目的：提供一种用于填充TSV（通过硅通孔）的组合物，其填充方法和包含使用该组合物制造的TSV填充材料的基材，以通过向金属间化合物提供韧性来提高脆性，耐冲击性和耐吸湿性 。 构成：金属粉末（100）在TSV（通过硅通孔）中提供必要的强度和韧性。 基于用于TSV填充的组合物的总体积，包括1至50体积％的金属粉末。 焊接电源（200）在与金属粉末形成金属间化合物的同时提供电通路。 硬化树脂（300）根据金属的应力或热膨胀系数吸收位移。 在吸湿可靠性试验中，硬化树脂防止水分渗入金属或金属间化合物。

公开(公告)号：KR1020110130214A

公开(公告)日：2011-12-05

申请号：KR1020100049746

申请日：2010-05-27

Applicant: 한국전자통신연구원

Inventor： 임병옥 ,  정성혜 ,  배현철 ,  최광성 ,  엄용성 ,  문종태

IPC: H01L23/045 ,  H01L23/043 ,  H01L23/52

CPC classification number: H01L23/481 ,  H01L21/306 ,  H01L23/522

Abstract: PURPOSE: A manufacturing method of a semiconductor chip including a penetration electrode is provided to remove an edge of a first substrate without adding a resizing process by removing a recess region in forming a penetration hole. CONSTITUTION: In a manufacturing method of a semiconductor chip including a penetration electrode, a first substrate(100) has first and second sides which are faced with each other. The first side of the first substrate is selectively etched to form a recess region and a reserved penetration hole. A metal layer(160) is formed on one side of the second substrate(150). The metal layer of the second substrate and the first side of the first substrate are combined to form a combination structure. A penetration hole exposes the metal layer to the outside. A penetration electrode(140) filling a penetration hole is formed.

Abstract translation: 目的：提供一种包括穿透电极的半导体芯片的制造方法，以在形成贯通孔的同时，通过去除凹部区域而不添加尺寸调整处理来除去第一基板的边缘。 构成：在包括穿透电极的半导体芯片的制造方法中，第一基板（100）具有彼此面对的第一和第二侧面。 选择性地蚀刻第一衬底的第一侧以形成凹陷区域和预留的穿透孔。 金属层（160）形成在第二基板（150）的一侧上。 将第二基板的金属层和第一基板的第一面组合形成组合结构。 穿透孔将金属层暴露于外部。 形成了填充贯通孔的贯通电极（140）。

公开(公告)号：KR1020110108577A

公开(公告)日：2011-10-06

申请号：KR1020100027848

申请日：2010-03-29

Applicant: 한국전자통신연구원

Inventor： 엄용성 ,  문종태 ,  최광성 ,  배현철 ,  이종진

IPC: C08K3/08 ,  C08K7/18 ,  C08L101/00 ,  H01B1/22

CPC classification number: B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/321 ,  H05K2201/0245 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: 충진 조성물, 이를 포함하는 반도체 소자 및 반도체 소자를 제조하는 방법을 제공한다. 충진 조성물은, 구리 및 은으로 이루어진 군에서 선택된 적어도 하나를 포함하는 제1 입자, 제1 입자 사이를 전기적으로 연결하는 제2 입자 및 고분자 화합물, 경화제 및 환원제가 함유된 수지를 포함한다. 이때, 경화제는 아민 및 무수물로 이루어진 군에서 선택된 적어도 하나를 포함하고, 환원제는 카르복실기를 포함할 수 있다.

公开(公告)号：KR1020060024563A

公开(公告)日：2006-03-17

申请号：KR1020040073359

申请日：2004-09-14

Applicant: 한국전자통신연구원

Inventor： 엄용성 ,  문종태 ,  윤호경 ,  최병석 ,  이종현

IPC: G02B6/42

CPC classification number: G02B6/4246 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/423 ,  G02B7/027

Abstract: The present invention provides a transceiver module having advantages of minimizing the number of optical parts by using an optical collimator to which a lens having the same shape as a diameter of an optical fiber is attached on a light input/output end. An transceiver module according to the present invention includes, laser diode for generating an optical signal to transmit, a first photodiode for controlling the laser diode, a second and third photodiodes for receiving an optical signal of a first and second wavelengths, and an optical collimator formed at a light input/output end. On the optical collimator, a lens having an optical fiber shape is attached in a direction the light proceeds.

公开(公告)号：KR1020050055203A

公开(公告)日：2005-06-13

申请号：KR1020030088258

申请日：2003-12-05

Applicant: 한국전자통신연구원

Inventor： 윤호경 ,  최병석 ,  이종현 ,  최광성 ,  김성일 ,  김종덕 ,  엄용성 ,  문종태

IPC: G02B7/02

CPC classification number: G02B6/4208 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02438

Abstract: 본 발명은 광통신에 적용되는 광소자를 모듈화함에 있어 필요한 광학 부품을 고정하기 위한 광모듈 제작용 구조물에 관한 것으로 종래의 구조물들과 달리 커플링 렌즈, 콜리메이터, 미러 등의 광학 부품를 양방향으로 정확한 위치에 부착할 수 있으며 결과적으로 소자에서 나오는 광을 용도에 따라 정확하게 조절할 수 있는 위치에 렌즈를 위치시킬 수 있게 되어 우수한 광특성을 확보할 수 있는 광부품 부착용 구조물을 제공하기 위한 것이다.

公开(公告)号：KR100436777B1

公开(公告)日：2004-06-23

申请号：KR1020020046731

申请日：2002-08-08

Applicant: 한국전자통신연구원

Inventor： 엄용성

IPC: G02B6/24

Abstract: PURPOSE: A zig for aligning an optical fiber and a method for aligning an optical fiber by using the same are provided to easily align the optical fiber provided with a previously fabricated optical fiber. CONSTITUTION: A zig for aligning an optical fiber includes a first zig(3), a second zig, a third zig(7), a fourth zig(11), a fifth zig and a sixth zig. The first silicon bench which is formed thereon a plurality of holes for finally supporting a plurality of optical fibers is fixed to the first zig(3). The second silicon bench which is formed thereon a plurality of holes for supporting a plurality of optical fibers is fixed to the second zig. The third zig(7) is provided with a plurality of first pins for temporally supporting the optical fiber aligned to the second silicon bench. The fourth zig(11) supports optical fiber for preventing the dispersion of the optical fiber. The fifth zig supports the third silicon bench which is formed thereon a hole for temporally supporting the optical fiber selected from the plurality of optical fibers. And, the sixth zig is provided with a second pin for temporally supporting the optical fiber aligned at the third silicon bench.

Abstract translation: 目的：提供一种用于对准光纤的锯齿和一种通过使用该锯齿来对准光纤的方法，以容易地对准配备有先前制造的光纤的光纤。 构成：一种用于对准光纤的锯齿包括第一锯齿（3），第二锯齿，第三锯齿（7），第四锯齿（11），第五锯齿和第六锯齿。 其上形成有用于最终支撑多个光纤的多个孔的第一硅台被固定到第一Zig（3）。 在其上形成有用于支撑多根光纤的多个孔的第二硅台被固定到第二锯齿。 第三锯齿（7）设置有多个第一销，用于暂时支撑与第二硅台对准的光纤。 第四锯齿（11）支撑用于防止光纤分散的光纤。 第五锯齿支撑第三硅工作台，在该第三工作台上形成用于临时支撑从多根光纤中选择的光纤的孔。 并且，第六锯齿设置有用于暂时支撑在第三硅工作台处对齐的光纤的第二销。

公开(公告)号：KR1020040034175A

公开(公告)日：2004-04-28

申请号：KR1020020064259

申请日：2002-10-21

Applicant: 한국전자통신연구원

Inventor： 엄용성 ,  박흥우 ,  이종현 ,  윤호경 ,  최병석

IPC: H01L31/12

CPC classification number: G02B6/3582 ,  G02B6/3512 ,  G02B6/3546 ,  G02B6/3584

Abstract: PURPOSE: A silicon optical bench for the packaging of an optical switch device, an optical switch package using the same, a manufacturing method thereof are provided to be capable of exactly carrying out an aligning process between the optical switch device, a light input part, and a light output part. CONSTITUTION: A silicon optical bench(100) includes a silicon substrate(110). At this time, the silicon substrate includes the first region for loading an optical switch device, the second region located at the first side of the first region for forming a light input part, and the third region located at the second side of the first region for forming a light output part. A vacant space(120) is formed through the silicon substrate at the first region. A plurality of grooves(131,132,133) formed on the silicon substrate at the second and third region for loading a lens and an optical fiber.

Abstract translation: 目的：提供一种用于光开关器件封装的硅光学台，使用其的光开关封装件及其制造方法，以能够精确地执行光开关器件，光输入部件， 和光输出部。 构成：硅光学台（100）包括硅衬底（110）。 此时，硅衬底包括用于加载光开关器件的第一区域，位于第一区域的第一侧的第二区域，用于形成光输入部分，第三区域位于第一区域的第二侧 用于形成光输出部分。 在第一区域通过硅衬底形成空白空间（120）。 在第二和第三区域的硅衬底上形成用于加载透镜和光纤的多个凹槽（131,132,133）。

公开(公告)号：KR1020040013693A

公开(公告)日：2004-02-14

申请号：KR1020020046731

申请日：2002-08-08

Applicant: 한국전자통신연구원

Inventor： 엄용성

IPC: G02B6/24

Abstract: PURPOSE: A zig for aligning an optical fiber and a method for aligning an optical fiber by using the same are provided to easily align the optical fiber provided with a previously fabricated optical fiber. CONSTITUTION: A zig for aligning an optical fiber includes a first zig(3), a second zig, a third zig(7), a fourth zig(11), a fifth zig and a sixth zig. The first silicon bench which is formed thereon a plurality of holes for finally supporting a plurality of optical fibers is fixed to the first zig(3). The second silicon bench which is formed thereon a plurality of holes for supporting a plurality of optical fibers is fixed to the second zig. The third zig(7) is provided with a plurality of first pins for temporally supporting the optical fiber aligned to the second silicon bench. The fourth zig(11) supports optical fiber for preventing the dispersion of the optical fiber. The fifth zig supports the third silicon bench which is formed thereon a hole for temporally supporting the optical fiber selected from the plurality of optical fibers. And, the sixth zig is provided with a second pin for temporally supporting the optical fiber aligned at the third silicon bench.

Abstract translation: 目的：提供用于对准光纤的齐像和通过使用光纤对准光纤的方法，以容易地对准具有预先制造的光纤的光纤。 构成：用于对准光纤的光栅包括第一齐像（3），第二曲线，第三曲线（7），第四曲线（11），第五曲线和第六曲线。 在其上形成有用于最终支撑多根光纤的多个孔的第一硅台座固定到第一Zig（3）。 在其上形成有用于支撑多根光纤的多个孔的第二硅台座固定到第二锯齿。 第三齐像（7）设置有多个第一引脚，用于在时间上支撑与第二硅台架对准的光纤。 第四Zig（11）支持用于防止光纤分散的光纤。 第五个Zig支撑在其上形成有用于暂时支撑从多根光纤中选择的光纤的孔的第三硅台架。 而且，第六Zig设置有用于暂时支撑在第三硅台架上对准的光纤的第二引脚。