公开(公告)号：DE10143790B4

公开(公告)日：2007-08-02

申请号：DE10143790

申请日：2001-09-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L23/50 ,  H01L21/58 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485

Abstract: An electronic component having at least one semiconductor chip, a rewiring layer connected to the semiconductor chip, and a printed circuit board associated with the rewiring layer. The rewiring layer is provided with flexible contacts that correspond with contact faces of the printed circuit board, and the rewiring layer is solidly connected to the printed circuit board via a flat intermediate layer. A method for producing the electronic component is described.

公开(公告)号：DE102005035393B4

公开(公告)日：2007-05-24

申请号：DE102005035393

申请日：2005-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY

IPC: H01L21/60 ,  H01L23/50 ,  H01L25/065

Abstract: The present invention relates to a method and apparatus for producing a chip arrangement. In one embodiment, the method includes providing a first chip having an electrically operable structure, of providing at least one through-via through the first chip, and of arranging at least one bond wire through the through-via in the first chip.

公开(公告)号：DE102004030813B4

公开(公告)日：2007-03-29

申请号：DE102004030813

申请日：2004-06-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/16 ,  H01L27/148

公开(公告)号：DE102004037826A1

公开(公告)日：2006-02-23

申请号：DE102004037826

申请日：2004-08-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MUFF SIMON

IPC: H01L23/538

Abstract: The present invention relates to a semiconductor device which provides a shortest possible connection between two semiconductor components 10 a and 10 b arranged in a manner lying opposite on a substrate 2 . The two semiconductor components 10 a and 10 b are in each case arranged with their chip contact-connection regions 11 a and 11 b facing the substrate 2 . A vertical through-plating device 20 connects the two chip contact-connection regions 11 a and 11 b.

公开(公告)号：DE102004030813A1

公开(公告)日：2006-01-19

申请号：DE102004030813

申请日：2004-06-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/16 ,  H01L27/148

公开(公告)号：DE102004030140B3

公开(公告)日：2006-01-19

申请号：DE102004030140

申请日：2004-06-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOLTER ANDREAS ,  HEDLER HARRY ,  IRSIGLER ROLAND ,  MEYER TORSTEN

IPC: G01R1/067 ,  G01R1/073 ,  H01L21/58 ,  H01L21/66 ,  H01L23/50 ,  H01R12/00 ,  H05K3/32 ,  H05K3/40

Abstract: The present invention relates to an elastic contact-connecting device. An elastic elevation 3 is applied to a carrier area 2 of a carrier 1 . The elastic elevation 3 has a first oblique area 4 , a second ramp 5 and a roof area 6 . The first oblique area 4 has a lesser inclination ( 30 ) with regard to the carrier area 2 than the second oblique area 5 . A contact region 20 is applied to the roof area 6 of the elastic elevation. The contact region 20 is connected to other structures 12 on the carrier 1 via a conductor track 10 . For this purpose, the conductor track 10 is guided over the first oblique area 4 . If a mating contact is pressed onto the contact region 20 , the elastic elevation yields, but presses against the mating contact on account of its elastic property and thus enables a reliable contact. In this case, essentially only the second oblique area 5 is deformed; the first oblique area 4 and the conductor track 10 applied thereto are not subjected to any mechanical stress.

公开(公告)号：DE10164800B4

公开(公告)日：2005-03-31

申请号：DE10164800

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BABARA

IPC: H01L21/98 ,  H01L25/065 ,  H01L21/58 ,  H01L23/50

公开(公告)号：DE10324450A1

公开(公告)日：2005-01-05

申请号：DE10324450

申请日：2003-05-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  WEITZ PETER ,  IRSIGLER ROLAND

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: A contact-connection device for electronic circuit units includes an adapter board, at least one elastic element arranged on the adapter board, conductor tracks arranged on the at least one elastic element and the adapter board, conductor track connecting elements deposited on the adapter board and electrically connected to the conductor tracks, and contact-connection elements deposited on the at least one elastic element and electrically connected to the conductor tracks, the contact-connection elements contact-connecting circuit unit connecting elements of the circuit units in an elastically pressing-on fashion.

公开(公告)号：DE10261410A1

公开(公告)日：2004-07-22

申请号：DE10261410

申请日：2002-12-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  IRSIGLER ROLAND

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L23/50

Abstract: Method for assembly of an integrated circuit (5) with a substrate by provision of a packing and substrate with the same number of junction regions, and relieved contact regions on the junction regions. Method for assembly of an integrated circuit (5) ,e.g. a chip, water or hybrid with a substrate by provision of a packing and substrate with the same number of junction regions, and relieved contact regions on the junction regions, forming first and second groups of contact regions, and creation of a connection between the packing and substrate over the relieved regions, where the two groups form rigid and elastic bonds respectively between the packing and substrate. An Independent claim is also included for a switching arrangement providing a connection between the integrated circuit, especially of a chip, wafer or hybrid with a substrate.

公开(公告)号：DE10319541A1

公开(公告)日：2004-07-08

申请号：DE10319541

申请日：2003-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KEMPER FRANZ ,  HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/36 ,  H01L23/04

Abstract: The device has a semiconducting chip with a contact device on a first surface, a bearer above the surface without the contact extending laterally above the chip and a structured re-wiring device for electrically connecting the chip's contact device to the connector. The re-wiring device is attached to the first surface of the chip and the corresponding surface of the bearer and the connector extends laterally over the width of the chip. The device has a semiconducting chip (10) with a contact device (11) on a first surface for providing an integrated electrical component, a bearer (12) above the surface without the contact extending laterally above the chip and a structured re-wiring device (13) for electrically connecting the contact device of the chip to the connector (14). The re-wiring device is attached to the first surface of the chip and the corresponding surface of the bearer and the connector extends laterally over the width of the chip. AN Independent claim is also included for the following: (a) a method of manufacturing an inventive device.