公开(公告)号：EP1015669B1

公开(公告)日：2010-11-17

申请号：EP98914464.7

申请日：1998-04-03

Applicant: UNIVERSITY OF SOUTHERN CALIFORNIA

Inventor： COHEN, Adam, L.

IPC: C25D5/02 ,  C25D5/10

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：EP2150488A2

公开(公告)日：2010-02-10

申请号：EP08735918.8

申请日：2008-04-08

Applicant: Robert Bosch GmbH

Inventor： SCHEUERER, Roland ,  WEBER, Heribert ,  GRAF, Eckhard

IPC: B81C1/00

CPC classification number: B81C1/00333 ,  B81B2203/033 ,  B81C1/0015 ,  B81C2201/0197

Abstract: The invention relates to a method for producing a micromechanical component. According to said method, a trench structure is essentially completely filled with a first filler layer and a first masking layer is applied to the first filler layer, to which masking layer a second filler layer and a second masking layer are applied. The invention also relates to a micromechanical component, wherein the first filler layer fills the trench structure of the micromechanical component and at the same time forms a mobile sensor structure.

公开(公告)号：EP1711961A2

公开(公告)日：2006-10-18

申请号：EP05704921.5

申请日：2005-01-03

Applicant: Microfabrica Inc.

Inventor： KUMAR, Ananda, H. ,  COHEN, Adam, L. ,  LOCKARD, Michael, S.

IPC: H01L21/4763

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (98) (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture (292, 294, 296, 298) that ensures precise heights of deposited materials relative to an initial surface of a substrate (82), relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine (408).

公开(公告)号：EP1576207A2

公开(公告)日：2005-09-21

申请号：EP03726752.3

申请日：2003-05-07

Applicant: Microfabrica Inc.

Inventor： BANG, Christopher, A.

IPC: C25D1/00

CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFABTM formation process), and typically contain features having resolutions within the 1 to 100 µm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and iohardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract translation: 提供了用于制造模制结构的模制结构，方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其它模具部件组合，并将模塑材料注入模具中并硬化。 分层结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

公开(公告)号：EP1518822A2

公开(公告)日：2005-03-30

申请号：EP04015983.2

申请日：2002-12-06

Applicant: Memgen Corporation

Inventor： The designation of the inventor has not yet been filed

IPC: B81B3/00 ,  G02B26/08

CPC classification number: B81C1/00182 ,  B81B2201/042 ,  B81B2203/058 ,  B81C1/0038 ,  B81C2201/0197 ,  H01P3/08 ,  H01P11/003

Abstract: The invention concerns various embodiments directed to various microdevices, including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB tm ).
In particular, the invention concerns a microdevice comprising an electrostatically actuated micro-mirror scanning system comprising contoured electrodes that allow a reduced drive voltage without hindering mirror movement.

Abstract translation: 本发明涉及针对各种微器件的各种实施例，包括传感器，致动器，阀，扫描镜，加速度计，开关等。 在一些实施例中，通过电化学制造（EFAB tm）形成器件。 特别地，本发明涉及一种微型装置，其包括静电致动的微镜扫描系统，其包括允许减小的驱动电压而不阻碍反射镜运动的轮廓电极。

公开(公告)号：KR1020170054258A

公开(公告)日：2017-05-17

申请号：KR1020160140116

申请日：2016-10-26

Applicant: 인피니온 테크놀로지스 아게

Inventor： 클라인,볼프강

IPC: B81B7/02

CPC classification number: B81B3/0021 ,  B81B3/0059 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81B2203/0307 ,  B81C1/00158 ,  B81C2201/0197 ,  H01L29/84 ,  H02N1/008 ,  H02N2/02 ,  H04R1/04 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/003 ,  H04R2207/021 ,  H04R2231/003 ,  H04R2410/03

Abstract: 실시예에따르면, MEMS 디바이스는제1 복수의정전콤 핑거를포함하는편향가능멤브레인, 제1 서브세트의제1 복수의정전콤 핑거와맞물리는제2 복수의정전콤 핑거를포함하는제1 앵커구조, 및제2 서브세트의제1 복수의정전콤 핑거와맞물리는제3 복수의정전콤 핑거를포함하는제2 앵커구조를포함한다. 제2 복수의정전콤 핑거는제1 복수의정전콤 핑거로부터제1 방향으로오프셋되고제3 복수의정전콤 핑거는제1 복수의정전콤 핑거로부터제2 방향으로오프셋되고, 여기서제1 방향은제2 방향과상이하다.

Abstract translation: 根据本实施例中，第一锚到MEMS装置包括偏转潜在的膜，其包含：第一多个静电梳齿指与第二多个包含所述第一多个静电梳齿指所述子集的静电梳齿指的啮合的 以及与第二子集中的第一组多个电子指状物接合的第二组多个静电梳状指状物。 第二组多个电子指状件在第一方向上偏离第一组多个电子指状件，并且第三组多个电子指状件在第二方向上偏离第一组多个电子通信器， 与第二方向不同。

公开(公告)号：KR1020170021846A

公开(公告)日：2017-02-28

申请号：KR1020177001572

申请日：2015-07-06

Applicant: 인벤센스, 인크.

Inventor： 스미스,피터

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81C1/00238 ,  B81B7/02 ,  B81C1/00246 ,  B81C2201/0197 ,  B81C2203/0792

Abstract: CMOS-MEMS 구조를제공하는방법이개시된다. 본방법은 MEMS 작동기판상에제1 상부금속을및 CMOS 기판상에제2 상부금속을패터닝하는단계를포함한다. 상기 MEMS 작동기판및 상기 CMOS 기판각각은그 위에산화물층을포함한다. 본방법은 MEMS 작동기기판의상기제1 패터닝된상부금속을상기베이스기판의상기제2 패터닝된상부금속에접합하는제1 접합단계를이용하여, MEMS 작동기판및 베이스기판상에각각의산화물층을식각하는단계를포함한다. 마지막으로, 본방법은 MEMS 작동기판내로작동층을식각하는단계및 MEMS 작동기판을 MEMS 핸들기판에접합하는제2 접합단계를이용하는단계를포함한다.

Abstract translation: 公开了一种用于提供CMOS-MEMS结构的方法。 该方法包括图案化MEMS致动器板上的第一上部金属和CMOS衬底上的第二上部金属。 MEMS操作基板和CMOS基板中的每一个在其上包括氧化物层。 该方法包括以下步骤：应用将MEMS致动器基板的第一图案化的上金属结合到基底基板的第二图案化的上金属以在MEMS工作基板和基底基板上形成相应的氧化物层的第一结合步骤 和蚀刻。 最后，该方法包括使用第二接合步骤将有源层蚀刻到MEMS致动基板中并且将MEMS致动基板接合到MEMS处理基板。

公开(公告)号：KR1020100084527A

公开(公告)日：2010-07-26

申请号：KR1020107009432

申请日：2008-11-12

Applicant: 니바록스-파 에스.에이.

Inventor： 피아카브리노,진-찰스 ,  베랄도,마르코 ,  코누스,씨에리 ,  씨에바우드,진-필리페 ,  피터스,진-베르날드

IPC: B81C99/00 ,  C25D1/00 ,  G04B13/00

CPC classification number: F16H55/06 ,  B81B2201/035 ,  B81C99/0095 ,  B81C2201/0197 ,  C25D1/08 ,  C25D5/02 ,  C25D5/10 ,  G04B13/02 ,  G04B13/022 ,  G04B19/042 ,  Y10T74/1987

Abstract: The invention relates to a method for producing a silicon-metal composite micromechanical part, combining DRIE-type and LIGA-type processes. The invention also relates to a micromechanical part comprising a layer containing a silicon part (53) and a metal part in such a way as to form a composite-type micromechanical part. The invention can be used in the field of timekeeping movements.

Abstract translation: 本发明涉及一种组合DRIE型和LIGA型工艺的硅 - 金属复合微机械部件的制造方法。 本发明还涉及一种微机械部件，其包括含有硅部分（53）和金属部分的层，以形成复合型微机械部件。 本发明可用于计时运动领域。

公开(公告)号：WO2016029357A9

公开(公告)日：2016-05-12

申请号：PCT/CN2014085204

申请日：2014-08-26

Applicant: GOERTEK INC

Inventor： ZOU QUANBO ,  WANG ZHE ,  TAO JIFANG ,  QIU GUANXUN

IPC: H04R31/00 ,  H04R7/00 ,  H04R7/06 ,  H04R9/06

CPC classification number: H04R19/02 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/0197 ,  H04R7/06 ,  H04R19/013 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2307/027

Abstract: Providing a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate (1) to obtain an insulating layer (2) thereon and providing a metal layer (3) on the insulating layer (2); providing a sacrificial layer (4) on the metal layer (3); providing a first thermal bimorph layer (5) on the sacrificial layer (4); providing a second thermal bimorph layer (6) on the first thermal bimorph layer (5); providing a metal connecting layer (7) at the positions on the metal layer (3) where the sacrificial layer (4) is not provided; forming corresponding back holes (16) on the substrate (1) and the insulating layer (2) and releasing the sacrificial layer (4); forming a warped thermal bimorph diaphragm with the first thermal bimorph layer (5) and the second thermal bimorph layer (6) after the sacrificial layer (4) is released. With the MEMS speaker with thermal bimorphs, the problems of high production cost, complicated wafer process and limitations on sound performance improvements are solved.

Abstract translation: 提供一种用于制造热双压电晶片振膜和具有热双压电晶片的MEMS扬声器的方法，其中所述方法包括以下步骤：热氧化衬底（1）以在其上获得绝缘层（2）并且提供金属层（3） 绝缘层（2）; 在金属层（3）上提供牺牲层（4）; 在所述牺牲层（4）上提供第一热双压电晶片层（5）; 在所述第一热双压电晶片层（5）上提供第二热双压电晶片层（6）; 在未设置牺牲层（4）的金属层（3）上的位置设置金属连接层（7） 在所述衬底（1）和所述绝缘层（2）上形成相应的背孔（16）并释放所述牺牲层（4）; 在牺牲层（4）被释放后形成具有第一热双压电晶片层（5）和第二热双压电晶片层（6）的翘曲热双压电晶片振膜。 采用具有热双压电晶片的MEMS扬声器，解决了高生产成本，复杂的晶片工艺和对声音性能改进的限制的问题。

公开(公告)号：WO2014062273A2

公开(公告)日：2014-04-24

申请号：PCT/US2013/052974

申请日：2013-07-31

Applicant: ROBERT BOSCH GMBH ,  CHEN, Po-Jui ,  YAMA, Gary ,  LIGER, Matthieu ,  GRAHAM, Andrew

Inventor： CHEN, Po-Jui ,  YAMA, Gary ,  LIGER, Matthieu ,  GRAHAM, Andrew

IPC: B81B7/02 ,  B81C1/00

CPC classification number: H01L29/84 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/015 ,  B81C1/0023 ,  B81C2201/0197 ,  B81C2203/0136 ,  B81C2203/0771 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/18 ,  H01L29/66007

Abstract: A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.

Abstract translation: 具有多个封装功能层的器件包括衬底，位于衬底的顶表面上方的第一功能层，功能层包括第一器件部分，封装第一功能的第一封装层 位于第一封装层上方的第二功能层，第二功能层包括第二器件部分和封装第二功能层的第二封装层。