公开(公告)号：WO01005518A1

公开(公告)日：2001-01-25

申请号：PCT/US2000/016324

申请日：2000-07-12

IPC: C23C18/16 ,  C23C18/22 ,  C23C18/30 ,  H05K3/18 ,  B05D1/18 ,  B05D3/10 ,  B29C45/00 ,  C08J5/00 ,  C08J7/04

CPC classification number: C23C18/22 ,  C23C18/1641 ,  C23C18/2086 ,  H05K3/181 ,  H05K2201/0236 ,  H05K2203/0789 ,  H05K2203/0793

Abstract: The present invention relates to an improved process for plating plastics using a catalytic filler. More specifically, the present invention relates to electroless plating. According to the present invention objects are created from a material obtained by compounding a granular plastic with a catalyst suitable for an electroless plating reaction. In a subsequent step, removal of the plastic from the surface of step exposes the catalyst. After this the exposed catalyst is activated. Finally the object is plated in an electroless metal bath.

Abstract translation: 本发明涉及使用催化填料对塑料进行电镀的改进方法。 更具体地，本发明涉及无电镀。 根据本发明，通过将颗粒状塑料与适用于无电解电镀反应的催化剂混合而获得的材料产生目的。 在随后的步骤中，从台阶表面去除塑料暴露了催化剂。 此后，暴露的催化剂被活化。 最后将该物体镀在无电镀金属浴中。

公开(公告)号：WO1992022191A1

公开(公告)日：1992-12-10

申请号：PCT/EP1992001132

申请日：1992-05-19

Applicant: AKZO N.V. ,  MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrik

Inventor： AKZO N.V.

IPC: H05K01/03

CPC classification number: H05K1/036 ,  B32B5/12 ,  H05K1/0366 ,  H05K2201/0236 ,  H05K2201/0287 ,  Y10T428/24058 ,  Y10T428/24124 ,  Y10T428/24917 ,  Y10T442/656

Abstract: The invention relates to a method of manufacturing a supporting board for printed circuits and to the board so obtainable, the method comprising the following steps: manufacturing an electrically non-conducting synthetic layer reinforced with unidirectionally oriented fibres, which will not be made to flow during the subsequent steps; coating at least part of the aforementioned unidirectional laminate with an adhesive on one or both sides; stacking the laminates which have at any rate been coated in part with an adhesive in such a way that there is at least one layer of adhesive between each pair of layers and practically the same amount of material of even thickness and composition is disposed in the virtually perpendicularly intersecting orientation directions; bonding the stacked UD-laminates by activating the adhesive layers.

Abstract translation: 本发明涉及一种制造用于印刷电路的支撑板和可获得的板的方法，该方法包括以下步骤：制造用单向取向纤维增强的不导电合成层，其不会在 后续步骤; 在一侧或两侧用粘合剂涂覆上述单向层叠体的至少一部分; 堆叠层压板，其任何速率部分地用粘合剂涂覆，使得在每对层之间存在至少一层粘合剂，并且实际上相同量的均匀厚度和组成的材料被放置在实际上 垂直相交的取向方向; 通过激活粘合剂层来粘结堆叠的UD-层压板。

公开(公告)号：US20180215894A1

公开(公告)日：2018-08-02

申请号：US15746985

申请日：2016-07-29

Applicant: SABIC Global Technologies B.V.

Inventor： Yunan CHENG ,  Yun ZHENG ,  Huihui LI ,  Haowei TANG ,  Chao LIU ,  Richard LIU

IPC: C08K3/22 ,  C08K3/013 ,  C08K5/00 ,  C08K7/14 ,  C08K7/06 ,  C08L69/00

CPC classification number: C08K3/22 ,  C08K3/013 ,  C08K5/0041 ,  C08K5/18 ,  C08K5/315 ,  C08K5/3447 ,  C08K7/06 ,  C08K7/14 ,  C08K2003/2231 ,  C08K2003/2248 ,  C08K2003/2293 ,  C08K2003/2296 ,  C08L23/0869 ,  C08L33/04 ,  C08L51/04 ,  C08L69/00 ,  C08L69/005 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/0275 ,  H05K2201/09118 ,  C08L101/00

Abstract: The disclosure concerns polymer compositions exhibiting LDS properties while maintaining mechanical properties and a dark color throughout the composition.

公开(公告)号：US20170194241A1

公开(公告)日：2017-07-06

申请号：US15461499

申请日：2017-03-17

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu ,  Wei-Jen Lai

IPC: H01L23/498 ,  H01L23/29 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/17 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/186 ,  H01L2924/19105 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, an insulator, a plurality of pads and a patterned circuit layer. The substrate includes a plurality of through holes. The insulator covers the substrate and is filled in the through hole. The conductive vias are located in the through holes and penetrate the insulator filled in the through holes. The pads are disposed on an upper surface and a lower surface of the insulator and electrically connected to the conductive vias. A bottom surface of each pad is lower than the top surface of the insulator. The patterned circuit layer is disposed on the top surface of the insulator and connected to the conductive vias and the pads. A bottom surface of the patterned circuit layer is lower than the top surface of the insulator.

公开(公告)号：US20170077045A1

公开(公告)日：2017-03-16

申请号：US15364185

申请日：2016-11-29

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu ,  Wei-Jen Lai

IPC: H01L23/00 ,  H01L25/10 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/35121 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674 ,  H01L2924/00014

Abstract: A semiconductor structure includes an insulating layer, a plurality of stepped conductive vias and a patterned circuit layer. The insulating layer includes a top surface and a bottom surface opposite to the top surface. The stepped conductive vias are disposed at the insulating layer to electrically connect the top surface and the bottom surface. Each of the stepped conductive vias includes a head portion and a neck portion connected to the head portion. The head portion is disposed on the top surface, and an upper surface of the head portion is coplanar with the top surface. A minimum diameter of the head portion is greater than a maximum diameter of the neck portion. The patterned circuit layer is disposed on the top surface and electrically connected to the stepped conductive vias.

Abstract translation: 半导体结构包括绝缘层，多个阶梯形导电通孔和图案化电路层。 绝缘层包括顶表面和与顶表面相对的底表面。 阶梯状导电通孔设置在绝缘层处以电连接顶表面和底表面。 每个阶梯式导电通孔包括头部和连接到头部的颈部。 头部设置在顶表面上，头部的上表面与顶表面共面。 头部的最小直径大于颈部的最大直径。 图案化电路层设置在顶表面上并电连接到阶梯式导电通孔。

公开(公告)号：US09587316B2

公开(公告)日：2017-03-07

申请号：US14427849

申请日：2013-09-05

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Takahiro Takano ,  Takahiko Sumino ,  Kentarou Ishihara ,  Naohisa Akashi

IPC: C08K3/40 ,  C23C18/28 ,  C08K3/22 ,  C08K7/14 ,  H01Q1/38 ,  H01Q1/24 ,  C08G69/26 ,  C08L77/06 ,  C23C18/16 ,  C23C18/20 ,  C23C18/38 ,  H05K3/18 ,  H05K1/03

CPC classification number: C23C18/285 ,  C08G69/265 ,  C08K3/22 ,  C08K3/2279 ,  C08K7/14 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L53/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/182 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.

Abstract translation: 提供一种热塑性树脂组合物，其中可以获得具有高白度和机械强度的树脂模塑制品，同时保持树脂模塑制品的电镀性能。 包含热塑性树脂的热塑性树脂组合物和1至30重量份的激光直接结构化添加剂，0.1至20重量份的氧化钛和10至230重量份的玻璃纤维，相对于每100重量份的 所述热塑性树脂，其中所述激光直接结构化添加剂的L值为50以上，所述玻璃纤维包含SiO 2和Al 2 O 3，所述SiO 2和Al 2 O 3的比例为60〜70重量％的SiO 2和20〜30重量％的Al 2 O 3。

公开(公告)号：US20160215124A1

公开(公告)日：2016-07-28

申请号：US14916283

申请日：2014-09-03

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Takahiro TAKANO ,  Ryusuke YAMADA ,  Shinichi AYUBA

IPC: C08K13/04 ,  C09K5/14 ,  C23C22/82 ,  C08K13/06

CPC classification number: C08K13/04 ,  C08K3/22 ,  C08K3/24 ,  C08K3/28 ,  C08K3/38 ,  C08K7/14 ,  C08K13/06 ,  C08K2003/282 ,  C08K2003/385 ,  C08L77/06 ,  C09K5/14 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/204 ,  C23C22/82 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition capable of producing a resin molded article having high resistance to soldering heat, good platability (appearance of plating layer), high thermal conductivity and high volume resistivity. The thermoplastic resin composition includes, per (A) 100 parts by weight of crystallizable thermoplastic resin showing a melting point of 250° C. or higher when measured by differential scanning colorimetry (DSC) at a temperature elevation rate of 10° C./min; (B) 40 to 150 parts by weight of insulating thermal conductive filler showing a thermal conductivity of 10 w/m·K or larger; (C) 3 to 20 parts by weight of laser direct structuring additive; and (D) 10 to 130 parts by weight of titanium oxide; wherein a total content of the (B) insulating thermal conductive filler, the (C) laser direct structuring additive and the (D) titanium oxide is 40 to 65% by weight of the resin composition.

Abstract translation: 提供一种热塑性树脂组合物，其能够制造具有高耐焊接性，良好的镀覆性（镀层外观），高导热性和高体积电阻率的树脂模塑制品。 当通过差示扫描比色法（DSC）以10℃/ min的升温速度测量时，热塑性树脂组合物包含（A）100重量份可结晶热塑性树脂，其显示出250℃或更高的熔点 ; （B）40〜150重量份的导热率为10w / m·K以上的绝热导热填料; （C）3〜20重量份的激光直接结构添加剂; 和（D）10至130重量份的氧化钛; 其中（B）绝缘导热填料，（C）激光直接结构添加剂和（D）氧化钛的总含量为树脂组合物的40〜65重量％。

公开(公告)号：US20160053072A1

公开(公告)日：2016-02-25

申请号：US14753055

申请日：2015-06-29

Applicant: Ticona LLC

Inventor： Paul C. Yung ,  Michael Schaefer

IPC: C08K3/10 ,  C08K3/32 ,  H05K1/03 ,  C08K3/30 ,  C08K7/10 ,  C08K3/34 ,  C08K3/40

CPC classification number: C08K3/10 ,  C08G63/605 ,  C08K3/22 ,  C08K3/30 ,  C08K3/32 ,  C08K3/34 ,  C08K3/40 ,  C08K7/10 ,  C08K2003/2248 ,  C08K2003/2251 ,  C08K2003/3045 ,  C08K2003/325 ,  C08K2201/005 ,  C08L67/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/165 ,  H05K3/105 ,  H05K3/106 ,  H05K3/185 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0266 ,  H05K2201/10098 ,  H05K2203/107 ,  C08L67/00

Abstract: A polymer composition that comprises an aromatic polyester, a laser activatable additive, and a mineral filler is provided. The mineral filler has a median size of about 35 micrometers or less and the laser activatable additive has a mean size of about 1000 nanometers or less.

Abstract translation: 提供了包含芳族聚酯，激光可激活添加剂和矿物填料的聚合物组合物。 矿物填料的中值粒径约为35微米或更小，激光活化添加剂的平均粒径约为1000纳米或更小。

公开(公告)号：US20150125674A1

公开(公告)日：2015-05-07

申请号：US14071879

申请日：2013-11-05

Applicant: Thomas B. Brust ,  Mark Edward Irving ,  Catherine A. Falkner ,  Anne Troxell Wyand

Inventor： Thomas B. Brust ,  Mark Edward Irving ,  Catherine A. Falkner ,  Anne Troxell Wyand

IPC: G03F7/40 ,  G03F7/20 ,  G03F7/039 ,  G03F7/16

CPC classification number: G03F7/40 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/208 ,  C23C18/30 ,  C23C18/38 ,  G03F7/039 ,  G03F7/16 ,  G03F7/20 ,  H05K3/185 ,  H05K2201/0166 ,  H05K2201/0236 ,  H05K2203/0759 ,  Y10T428/24917

Abstract: A conductive pattern is prepared in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation having a λmax of at least 150 nm and up to and including 450 nm, and (c) a crosslinking agent. The polymeric layer is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. The pattern of electroless seed metal ions is then reduced to provide a pattern of corresponding electroless seed metal nuclei. The corresponding electroless seed metal nuclei are then electrolessly plated with a conductive metal.

Abstract translation: 在聚合物层中制备导电图案，该聚合物层具有（a）包含叔烷基酯基侧基的反应性聚合物，（b）在暴露于λmax为至少150nm并且包括 450nm，（c）交联剂。 图案化地暴露聚合物层以提供包含非暴露区域的聚合物层和包含包含羧酸基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电子种子金属离子的图案。 然后减少无电子种子金属离子的图案以提供相应的无电子种子金属核的图案。 然后将相应的无电子种子金属核用导电金属无电镀。

公开(公告)号：US08974869B2

公开(公告)日：2015-03-10

申请号：US12693548

申请日：2010-01-26

Applicant: Robert Hamilton ,  Ernest Long ,  Andrew M. Krol

Inventor： Robert Hamilton ,  Ernest Long ,  Andrew M. Krol

IPC: B05D1/18 ,  B05D3/00 ,  C08J7/18 ,  B05D3/06 ,  C23C18/16 ,  C23C18/20 ,  C23C18/38 ,  H05K3/18

CPC classification number: B05D3/06 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/38 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0786 ,  H05K2203/107 ,  H05K2203/122

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract translation: 描述了一种处理其中分散有金属化合物的激光活化热塑性基材的方法。 将底物与含水组合物接触，所述水性组合物包含：（i）硫醇官能的有机化合物; （ii）乙氧基化醇表面活性剂; 和（iii）黄原胶。 通过使用处理组合物，当基板随后通过无电镀进行激光激活和电镀时，基本上消除了基板的外部电镀。