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公开(公告)号：US09836176B1
公开(公告)日：2017-12-05
申请号：US15533416
申请日：2015-12-10
Applicant: MITSUBISHI PAPER MILLS LIMITED
Inventor： Takenobu Yoshiki , Kazuhiko Sunada
CPC classification number: G06F3/044 , G06F3/041 , G06F2203/04111 , G06F2203/04112 , H05K1/0274 , H05K1/0289 , H05K2201/0108 , H05K2201/0302 , H05K2201/09218 , H05K2201/09781
Abstract: Provided is an optically transparent conductive material which is suitable as an optically transparent electrode for capacitive touchscreens, the optically transparent conductive material not causing moire even when placed over a liquid crystal display, having a favorably low pattern conspicuousness (non-conspicuousness), and having a high reliability. The optically transparent conductive material has, on an optically transparent support, an optically transparent conductive layer having optically transparent sensor parts electrically connected to terminal parts and optically transparent dummy parts not electrically connected to terminal parts, and in this optically transparent conductive material, the sensor parts and the dummy parts are formed of a metal thin line pattern having a mesh shape, and in the plane of the optically transparent conductive layer, the contour shape of each of the sensor parts extends in a first direction, the dummy parts are arranged alternately with the sensor parts in a second direction perpendicular to the first direction, the sensor parts are arranged at a cycle of L in the second direction, at least part of the metal thin line pattern in the sensor parts has a cycle of 2L/N in the second direction (wherein N is any natural number), and the metal thin line pattern in the dummy parts has a cycle longer than 2L/N or does not have a cycle in the second direction.
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公开(公告)号：US09741652B1
公开(公告)日：2017-08-22
申请号：US15488659
申请日：2017-04-17
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Yuta Sakaguchi , Yusuke Gozu , Noriyoshi Shimizu
IPC: H05K1/02 , H05K1/11 , H01L23/498 , H01L21/48 , H05K1/18
CPC classification number: H01L23/49838 , H01L21/481 , H01L21/4853 , H01L23/145 , H01L23/49822 , H01L23/49866 , H05K1/0216 , H05K1/0284 , H05K1/0296 , H05K1/111 , H05K1/181 , H05K2201/09218
Abstract: A wiring substrate includes a wiring layer on a projection of an insulating layer. The wiring layer includes a first metal layer on an end face of the projection with a peripheral portion of the end face exposed, a second metal layer that is on the first metal layer and wider than the end face, and a third metal layer. The second metal layer includes first and second opposite surfaces with the second surface on the first metal layer with a peripheral portion thereof exposed. The third metal layer covers side surfaces of the first metal layer, and the first surface, the peripheral portion of the second surface, and side surfaces of the second metal layer, and fills in a region where the end face and the peripheral portion of the second surface face each other. The materials of the second and third metal layers are different.
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公开(公告)号：US20170135204A1
公开(公告)日：2017-05-11
申请号：US15141997
申请日：2016-04-29
Applicant: HE BEI SINOPACK ELECTRONIC TECH CO., LTD.
Inventor： Fei Ding , Linjie Liu , Lei Zhang
CPC classification number: H05K1/0306 , H01L23/13 , H05K1/0213 , H05K1/0243 , H05K1/0298 , H05K1/112 , H05K3/005 , H05K3/188 , H05K3/40 , H05K3/4038 , H05K3/4617 , H05K2201/0723 , H05K2201/09218 , H05K2201/09618 , H05K2201/10303
Abstract: The present invention discloses a ceramic insulator for electronic packaging and a method for fabricating the same, and relates to a technical field of outer shell packaging of electronic devices. Under the circumstance of using neither a chemical coating nor any bonding wire connection circuit, through a design that builds a electroplated circuit into the ceramic insulator, the method accomplishes coating of a nickel alloy protection layer onto a porcelain by an electroplating method, so that not only quality of a coating layer but also requirement of a complete appearance can be ensured. All circuits of the ceramic insulator fabricated by the aforesaid method can conduct with external circuits, such that the electroplating method can be used to accomplish coating of the nickel alloy layer, after accomplishment of all metal coating, metallization parts on an end surface of the porcelain is removed.
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74.发明申请公开(公告)号：US20170094795A1
公开(公告)日：2017-03-30
申请号：US15310991
申请日：2015-05-13
Inventor： Johannes Stahr , Wolgang Schrittwieser , Mike Morianz , Christian Vockenberger , Markus Leitgeb
CPC classification number: H05K1/18 , H05K1/025 , H05K1/0251 , H05K1/0306 , H05K1/0366 , H05K1/09 , H05K1/115 , H05K1/185 , H05K3/10 , H05K3/1258 , H05K3/40 , H05K3/4053 , H05K2201/09218 , H05K2201/098 , H05K2201/09854
Abstract: The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an electrically conducting contact structure which extends from the surface into the support structure and is electrically connected to the conductor path at a connection point, thereby forming a common conductor track. The conductor path and the contact structure transition into each other in an enlargement-free manner at the connection point.
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公开(公告)号：US09554465B1
公开(公告)日：2017-01-24
申请号：US14593849
申请日：2015-01-09
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Dick Pang , Murad Kurwa
CPC classification number: H05K1/092 , H05K1/0283 , H05K1/03 , H05K1/0393 , H05K1/147 , H05K1/183 , H05K3/285 , H05K2201/0133 , H05K2201/0162 , H05K2201/09218 , H05K2201/09227 , H05K2201/09263 , H05K2201/09281
Abstract: A stretchable interconnect includes a plurality of electrically conductive traces formed as a complex pattern on an elastic substrate. The form of the electrically conductive traces is such that when the elastic substrate is in a relaxed, or non-stretched, state each of the electrically conductive traces forms a tortuous path, such as a waveform, along the elastic substrate. The tortuous path of the electrically conductive traces provides slack such that as the elastic substrate is stretched the slack is taken up. Once released, the elastic substrate moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the electrically conductive traces in the form of the original tortuous path.
Abstract translation: 可拉伸互连件包括在弹性基底上形成为复合图案的多个导电迹线。 导电迹线的形式使得当弹性基底处于松弛或非拉伸状态时，每个导电迹线沿着弹性基底形成诸如波形的曲折路径。 导电迹线的弯曲路径提供松弛，使得当弹性基底被拉伸时松弛松弛。 一旦释放，弹性基板从拉伸位置移动到松弛的非拉伸位置，并且以原始曲折路径的形式将松弛重新引入导电迹线。
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Patent Agency Ranking
公开(公告)号：US20160150652A1
公开(公告)日：2016-05-26
申请号：US14905241
申请日：2014-07-15
Applicant: NOVALIA LTD
Inventor： Kate Stone
CPC classification number: H05K1/189 , H01L23/13 , H01L23/49811 , H01L23/49838 , H01L23/49855 , H01L23/5386 , H01L23/5387 , H01L23/5388 , H01L2924/0002 , H05K1/0213 , H05K2201/09218 , H01L2924/00
Abstract: An article comprises an electronic component, such as an integrated circuit or packaged integrated circuit, and a circuit sheet arrangement. The circuit sheet arrangement may comprise a flexible planar substrate and conductive tracks formed on a face of the substrate. The substrate is configured to have an aperture enclosed by surrounding portion of the substrate and to have at least two arms supporting respective conductive tracks which extend into the aperture from the surrounding portions. The electronic component is disposed over the aperture and is attached to conductive tracks on the arms, for example, using conductive glue or ink.
Abstract translation: 一种物品包括诸如集成电路或封装集成电路的电子部件和电路板布置。 电路板布置可以包括柔性平面基板和形成在基板的表面上的导电轨道。 衬底被配置为具有由衬底的周围部分包围的孔，并且具有支撑从周围部分延伸到孔中的相应导电轨道的至少两个臂。 电子部件设置在孔的上方，并且例如使用导电胶或油墨附接到臂上的导电轨道上。
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公开(公告)号：US20150161929A1
公开(公告)日：2015-06-11
申请号：US14535216
申请日：2014-11-06
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Minghui Han
CPC classification number: G09G3/20 , G09G2300/0404 , G09G2310/06 , G09G2310/08 , H01L23/66 , H01L2924/0002 , H05K1/0242 , H05K1/0246 , H05K1/025 , H05K1/0296 , H05K1/11 , H05K2201/09218 , H05K2201/097 , H05K2201/09727 , H05K2201/09827 , H05K2201/10128 , H01L2924/00
Abstract: A trace to be coupled to an input of a receiver, the trace including: a plurality of first portions; and a plurality of second portions alternately coupled in series with the first portions, the second portions having a width that is different from that of the first portions.
Abstract translation: 要耦合到接收器的输入的迹线，所述迹线包括：多个第一部分; 以及与第一部分交替耦合的多个第二部分，第二部分具有与第一部分不同的宽度。
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公开(公告)号：US20150091674A1
公开(公告)日：2015-04-02
申请号：US14564140
申请日：2014-12-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO , Satoshi ISHINO , Jun SASAKI , Kuniaki YOSUI , Takahiro BABA , Nobuo IKEMOTO
IPC: H01P3/08
CPC classification number: H01P3/02 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/082 , H01P3/085 , H01P5/00 , H01P5/028 , H05K1/0218 , H05K1/0221 , H05K1/0237 , H05K1/0242 , H05K1/025 , H05K1/028 , H05K1/0296 , H05K1/14 , H05K1/148 , H05K1/186 , H05K3/361 , H05K2201/0707 , H05K2201/09218
Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.
Abstract translation: 扁平电缆的传输线部分包括交替连接的第一区域和第二区域。 在第一区域中，传输线部分是包括具有信号导体的介质元件，包括开口部分的第一接地导体和作为固体填充导体的第二接地导体的柔性三板传输线。 在第二区域中，传输线部分是包括具有曲折导体的宽电介质元件和固体填充导体的第一接地导体和第二接地导体的硬三板传输线。 第二区域中的特性阻抗的变化幅度大于第一区域中的特性阻抗的变化宽度。
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公开(公告)号：US20240012458A1
公开(公告)日：2024-01-11
申请号：US18473567
申请日：2023-09-25
Applicant: Apple Inc.
Inventor： Anne M. Mason
CPC classification number: H05K1/0212 , G01K7/24 , H05K1/112 , H05K1/181 , H05K2201/09218 , G06F1/3206
Abstract: An electronic device may include a printed circuit with a surface-mounted component. The component may produce resistive heating within the printed circuit. Resistive thermal devices (RTDs) may be embedded within the printed circuit. An RTD may at least partially overlap the electrical component. The RTD may include contact pads on a flexible substrate and a meandering conductive trace between the contact pads. The trace may have a resistance varying linearly as a function of temperature. A data acquisition system (DAQ) may measure the resistance of the RTD. Control circuitry may identify the temperature of the printed circuit based on the resistance of the RTD measured by the DAQ and may reduce power consumption by the component when the temperature exceeds a threshold. This may serve to prevent overheating in the printed circuit over time, thereby maximizing the operating life of the printed circuit.
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公开(公告)号：US20240006669A1
公开(公告)日：2024-01-04
申请号：US17856525
申请日：2022-07-01
Applicant: Apple Inc.
Inventor： Pouya Ghalei , Cong Zheng , Shunlong Xiao , Manpreet Singh , Charles E Chang , Steve Chikin Lo
CPC classification number: H01M10/425 , H01M10/484 , H05K1/09 , H05K1/181 , H01M2010/4271 , H05K2201/09218
Abstract: A battery circuit board includes a substrate, a first trace configured to receive a voltage and forming a first closed loop around a perimeter of the substrate, and a second trace forming a second closed loop around the perimeter of the substrate. The battery circuit board also includes an electrical assembly configured to determine a presence of an electrolyte on the battery circuit board in response to a short circuit between the first closed loop of the first trace and the second closed loop of the second trace.
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