公开(公告)号：US09107303B2

公开(公告)日：2015-08-11

申请号：US14474063

申请日：2014-08-29

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： William H. Lytle ,  Scott M. Hayes ,  George R. Leal

IPC: H05K1/02 ,  H01L21/56 ,  H01L21/683 ,  H01L23/538 ,  H01L23/00 ,  H05K1/03 ,  H05K1/11 ,  H01L23/544

CPC classification number: H05K1/0271 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/5442 ,  H01L2223/5446 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/10507

Abstract: An electronic panel assembly (EPA) includes one or more electronic devices with primary faces having electrical contacts, opposed rear faces and edges therebetween. The devices are mounted primary faces down in openings in a warp control sheet (WCS). Cured plastic encapsulation is formed at least between lateral edges of the devices and WCS openings. Undesirable panel warping during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. Thin film insulators and conductors couple electrical contacts on various devices to each other and to external terminals, thereby forming an integrated multi-device EPA.

Abstract translation: 电子面板组件（EPA）包括一个或多个电子设备，其中主面具有电触头，相对的背面和边缘之间。 这些设备将主面向下安装在经纱控制板（WCS）的开口中。 至少在设备的侧边缘和WCS开口之间形成固化塑料封装。 通过选择WCS热膨胀系数（CTE）小于封装CTE来减轻封装期间的不希望的面板翘曲。 薄膜绝缘体和导体将各种装置上的电触点彼此连接到外部端子，从而形成集成的多装置EPA。

公开(公告)号：US09078373B1

公开(公告)日：2015-07-07

申请号：US14147225

申请日：2014-01-03

Applicant: International Business Machines Corporation

Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, Jr. ,  David B. Stone

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/183 ,  H05K1/0231 ,  H05K1/11 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/09645 ,  H05K2201/10015 ,  H05K2201/10507 ,  Y02P70/611 ,  Y10T29/49135

Abstract: Various embodiments include integrated circuit structures having an off-axis in-hole capacitor. In some embodiments, an integrated circuit (IC) structure includes: a substrate layer having an upper surface; an IC chip at least partially contained within the substrate layer and aligned with a minor axis perpendicular to the upper surface of the substrate layer; an aperture in the substrate layer, the aperture physically separated from the IC chip; and a capacitor in the aperture and at least partially contained within the substrate layer, the capacitor being physically isolated from the IC chip, wherein the capacitor is aligned with an axis perpendicular to the upper surface of the substrate layer and offset from the minor axis of the IC chip.

Abstract translation: 各种实施例包括具有离轴孔内电容器的集成电路结构。 在一些实施例中，集成电路（IC）结构包括：具有上表面的基底层; 至少部分地包含在所述衬底层内并与垂直于所述衬底层的上表面的短轴对准的IC芯片; 所述基板层中的孔，所述孔与所述IC芯片物理分离; 以及孔中的电容器，并且至少部分地包含在所述衬底层内，所述电容器与所述IC芯片物理隔离，其中所述电容器与垂直于所述衬底层的上表面的轴线对准，并且偏离所述衬底层的短轴 IC芯片。

公开(公告)号：US20140369015A1

公开(公告)日：2014-12-18

申请号：US14474063

申请日：2014-08-29

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： WILLIAM H. LYTLE ,  Scott M. Hayes ,  George R. Leal

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/5442 ,  H01L2223/5446 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/10507

Abstract: An electronic panel assembly (EPA) includes one or more electronic devices with primary faces having electrical contacts, opposed rear faces and edges therebetween. The devices are mounted primary faces down in openings in a warp control sheet (WCS). Cured plastic encapsulation is formed at least between lateral edges of the devices and WCS openings. Undesirable panel warping during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. Thin film insulators and conductors couple electrical contacts on various devices to each other and to external terminals, thereby forming an integrated multi-device EPA.

Abstract translation: 电子面板组件（EPA）包括一个或多个电子设备，其中主面具有电触头，相对的背面和边缘之间。 这些设备将主面向下安装在经纱控制板（WCS）的开口中。 至少在设备的侧边缘和WCS开口之间形成固化塑料封装。 通过选择WCS热膨胀系数（CTE）小于封装CTE来减轻封装期间的不希望的面板翘曲。 薄膜绝缘体和导体将各种装置上的电触点彼此连接到外部端子，从而形成集成的多装置EPA。

公开(公告)号：US08804344B2

公开(公告)日：2014-08-12

申请号：US13267801

申请日：2011-10-06

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K7/00

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface.

Abstract translation: 提供了一种用于控制组件的系统和方法，包括：第一膜，其被模制成包括装饰图形，前表面和后表面; 以及模制到第一膜的后表面的第二膜，其具有包括传感器，控制电路和互连件以及前表面和后表面的印刷电路。

公开(公告)号：US08789271B2

公开(公告)日：2014-07-29

申请号：US12736942

申请日：2009-05-29

Applicant: Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

Inventor： Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

IPC: H05K3/30

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Abstract translation: 该出版物公开了一种电路板结构和电子模块的制造方法，其中至少一个部件（6）嵌入在绝缘材料层（1）的内部，触点（14）被连接到组件 6）电连接到包含在电子模块中的导体结构（14,19）。 根据本发明，在组件（6）附近的绝缘材料层（1）中制造至少一个将组件（6）的热传导加热的热通孔（22）。

公开(公告)号：EP2894714B1

公开(公告)日：2018-11-14

申请号：EP13833774.6

申请日：2013-06-20

Applicant: Denso Corporation ,  Nippon Soken, Inc.

Inventor： YUKIZAKI, Yasumune ,  SUZUKI, Tadao ,  KATAOKA, Ryohei ,  SUGIMOTO, Yuji

IPC: H01Q1/32 ,  H01Q1/22 ,  H01Q1/02

CPC classification number: H01Q1/3275 ,  H01Q1/02 ,  H01Q1/241 ,  H01Q1/42 ,  H01Q9/42 ,  H05K1/181 ,  H05K5/003 ,  H05K2201/10098 ,  H05K2201/10507

Abstract: A vehicle-mounted antenna device (20) includes a base (22), a board (24), a circuit section (30), and a housing (32). The base is mountable on a roof (11) of a vehicle (10). The board has an antenna element section (26) and is stood on a surface (22a) of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section is implemented on the board at a position away from the base in the first direction.

公开(公告)号：EP3148297A1

公开(公告)日：2017-03-29

申请号：EP14892372.5

申请日：2014-05-22

Applicant: Mitsubishi Electric Corporation

Inventor： ARAKI, Rei ,  KAWANO, Yu ,  ASAO, Yoshihito

IPC: H05K1/02 ,  H02K11/00

CPC classification number: H02K5/24 ,  H02K11/21 ,  H02K11/25 ,  H02K11/33 ,  H05K1/0201 ,  H05K1/0216 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/1009 ,  H05K2201/10507

Abstract: A board (100) includes a separating zone (30) in an area closer to the edge than to the center of the board (100), the separating zone (30) including one elongated through hole (31). A first group of electronic components (10) that is a source of heat or electric noise is placed in a first area (101) on the center side with respect to the separating zone (30) of the board (100). On the other hand, a second group of electronic components (20) from which influence of heat or electric noise from other components needs to be eliminated to a maximum extent is placed in a second area (102) on the edge side with respect to the separating zone (30) of the board (100).

Abstract translation: 板（100）在比板（100）的中心更靠近边缘的区域中包括分离区（30），分离区（30）包括一个细长通孔（31）。 作为热或电噪声源的第一组电子部件（10）相对于基板（100）的分离区域（30）被放置在中心侧的第一区域（101）中。 另一方面，第二组电子部件（20）从其中需要将来自其它部件的热噪声或电噪声的影响最大程度地消除到第二组电子部件（20）的第二区域（102）中，相对于 板（100）的分离区（30）。

公开(公告)号：EP2849545A3

公开(公告)日：2015-05-06

申请号：EP14183876.3

申请日：2014-09-08

Applicant: Samsung Electronics Co., Ltd

Inventor： Rhee, Bongjae

IPC: H01M10/66 ,  H05K1/02 ,  H05K7/20 ,  H01M10/623 ,  H04M1/02 ,  H05K1/18 ,  H01M2/10

CPC classification number: H05K7/2039 ,  H01M2/1022 ,  H01M2/1066 ,  H01M10/425 ,  H01M10/615 ,  H01M10/623 ,  H01M10/667 ,  H01M2200/00 ,  H01M2220/30 ,  H04M1/0262 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0296 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10037 ,  H05K2201/10507

Abstract: A portable electronic device 100 and a battery pack 130 for the portable electronic device are provided. The portable electronic device includes a Printed Circuit Board (PCB) 113 in which at least one electronic component 114 is disposed, and a battery pack including a heat conductor 115 separately disposed at a gap from the PCB and that transfers heat generated in the electronic component to a battery cell.

公开(公告)号：EP2820929A1

公开(公告)日：2015-01-07

申请号：EP12869733.1

申请日：2012-03-01

Applicant: Autoliv Development AB

Inventor： CACLARD, Laurent

IPC: H05K9/00 ,  G12B17/02 ,  H05K1/02 ,  H05K5/00 ,  H05K5/04

CPC classification number: H05K9/0039 ,  H05K1/0215 ,  H05K1/0218 ,  H05K5/0047 ,  H05K7/1427 ,  H05K2201/0723 ,  H05K2201/0919 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2201/10507

Abstract: The present invention relates to an electronic unit (1) comprising a circuit board, PCB, (2) arranged to be mounted in a main housing (6, 7). The main housing comprises a first housing part (6) and a second housing part (7), where the first housing part (6) at least partly is electrically conducting. The PCB (2) comprises a first outer layer (3), a second outer layer (4), and a ground plane (5), where the first outer layer (3) mainly faces the first housing part (6) and the second outer layer (4) mainly faces the second housing part (7) when mounted. Furthermore, when mounted, the ground plane (5) is arranged to make electrical contact with the first housing part (6) such that a first chamber (29), facing the first outer layer (3), and a second chamber (30), facing the second outer layer (4), are formed. Said chambers (29, 30) are separated by means of the ground plane (5), such that an electromagnetic shielding is created between the chambers (29, 30).

Abstract translation: 一种电子单元（1），具有布置成安装在主壳体（6,7）中并且具有第一壳体部分（6）和第二壳体部分（7）的电路板，PCB，（2），其中第一壳体 部分（6）至少部分导电，PCB（2）具有第一外层（3），第二外层（4）和接地平面（5），第一外层（3） 第一壳体部分（6）和第二外层（4）面向第二壳体部分（7）。接地平面（5）与形成第一室（29）的第一壳体部分（6）电接触， 第一外层（3）和与第二外层（4）相对的第二室（30），室（29,30）由接地平面（5）分开， 30）。

公开(公告)号：EP2817711A1

公开(公告)日：2014-12-31

申请号：EP13710604.3

申请日：2013-02-19

Applicant: Ambianti B.V. ,  Metaxas, Georgios

Inventor： METAXAS, Georgios

IPC: G06F3/14 ,  G09G3/20 ,  G09F19/22 ,  H05K1/14

CPC classification number: H05K1/0292 ,  G06F3/1446 ,  G09G3/20 ,  G09G3/2085 ,  G09G3/2088 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2310/0278 ,  G09G2310/0281 ,  G09G2330/08 ,  G09G2340/0492 ,  G09G2360/141 ,  G09G2370/18 ,  H05K1/0286 ,  H05K3/0052 ,  H05K2201/09972 ,  H05K2201/10507

Abstract: The invention relates to a panel (2) of rectangular shape comprising a plurality of electric devices (4) spread over the panel, a control unit (8) including a microprocessor and a power supply, drivers (9) for driving the electric devices based on control information received from the control unit and electric wiring connecting the control unit, the drivers and the electric devices, the shape of the panel being adaptable by removing one or more parts of the panel by cutting, sawing, milling, drilling or other suitable methods, wherein the control unit (8) and the drivers (9) are positioned closer to a first side of the panel (11) than to a second side (12) opposite the first side. The drivers and electric devices are partitioned into groups that each comprise one driver that exclusively drives the electric devices in that group.