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公开(公告)号：KR1020150025149A
公开(公告)日：2015-03-10
申请号：KR1020130102409
申请日：2013-08-28
Applicant: 삼성전기주식회사
Abstract: 본 발명은 시편 고정 장치에 관한 것으로, 본 발명의 실시예에 따른 시편 고정 장치는 제1홀더 및 상기 제1홀더에 탈착가능하게 결합되며, 그리드가 고정되는 제2홀더를 포함한다.
Abstract translation: 本发明涉及一种样品定影装置，其可以通过使用具有一个定影装置的聚焦离子束（FIB）对样品进行处理来固定样品，以及通过使用透射电子显微镜（TEM）分析处理的样品的工艺， 。 根据本发明实施例的样品定影装置包括：第一保持器; 以及第二保持器，其可拆卸地联接到所述第一保持器，并且其中网格被固定。
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公开(公告)号：KR1020150017189A
公开(公告)日：2015-02-16
申请号：KR1020130093172
申请日：2013-08-06
Applicant: 삼성전기주식회사
CPC classification number: G01N15/0826 , G01N1/28 , G01N33/442 , G01N2015/086
Abstract: 본 발명의 일실시예에 따른 점탄성 소재 수분 투과성 평가단위체는 투과성 평가 대상 시료, 상기 시료의 일면에 형성된 제1 기준필름, 상기 시료의 타면에 형성된 제2 기준필름을 포함하고, 상기 제1 기준필름과 상기 제2 기준필름은 동일한 투과율을 갖도록 형성될 수 있다. 본 발명에 따르면, 광학용 투명 접착제와 같은 다공성 점탄성 소재의 높은 투과성의 소재에 대한 수분 투과성 평가를 더욱 효과적으로 측정할 수 있는 효과가 있다.
Abstract translation: 根据本发明的实施方式的粘弹性渗透性评价单元，其特征在于，包括：评价渗透性的目标样品; 在样品的一个表面上形成的第一标准膜; 以及形成在样品的另一个表面上的第二标准膜。 形成第一和第二标准膜以具有相同的渗透速率。 本发明可以更有效地评估具有高透过性的多孔粘弹性材料如光学透明粘合剂的渗透性。
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公开(公告)号：KR1020150010234A
公开(公告)日：2015-01-28
申请号：KR1020130084939
申请日：2013-07-18
Applicant: 삼성전기주식회사
IPC: G01B11/16
CPC classification number: G01B11/16
Abstract: 본 발명은 미소 변형 측정 장치 및 그 방법에 관한 것이다.
또한, 본 발명은 광을 생성하여 라인빔으로 변형하여 출사하는 라인빔 형성부; 샘플의 양단을 한쌍의 샘플 고정 지그로 상기 라인빔에 수직이 되도록 고정하고 있으며, 상기 샘플은 환경변화에 따라 길이가 변형되며, 상기 한쌍의 샘플 고정지그는 샘플의 길이 변형에 따라 간격이 변화되는 샘플 인장부; 상기 라인빔 형성부에서 출사하는 라인빔이 샘플 인장부를 통과한 상태를 촬영하는 촬영부; 및 상기 촬영부에서 측정한 라인빔의 영상을 사용하여 샘플의 변형을 측정하는 제어부를 포함하는 미소 변형 측정 장치 및 그 방법을 제공한다.Abstract translation: 本发明涉及一种能够对样品进行全场测量并且以简单的系统配置和低设备成本减少测量和分析时间的小应变测量装置及其方法。 小应变测量装置包括：线束形成单元，其产生光，将光转换成线束，并输出; 样品拉伸单元，其用一对样品固定夹具将样品两端垂直于线束固定，其中样品的长度随着环境变化而变化，并且一对样品固定夹具之间的距离变化 根据样品长度的变化; 拍摄单元，其拍摄从已经通过样本拉伸单元的线束形成单元输出的线束的状态的图像; 以及控制单元，其使用由拍摄单元拍摄的线束的图像来测量样本的应变水平。
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公开(公告)号：KR1020140082095A
公开(公告)日：2014-07-02
申请号：KR1020120151451
申请日：2012-12-21
Applicant: 삼성전기주식회사
Abstract: Disclosed is an apparatus for detecting a fault which includes a device frame which includes a stage which is movably installed, a holder to which a molding element molded with a specimen is fixed and which is installed on the stage to be lifted, a cutter member which is installed on the device frame to cut the specimen by the lifting of the holder, a cut side image checking unit which is installed on the device frame to face the holder and checks the cut side of the specimen, and an electric property measuring unit which is installed on the device frame to be electrically connected to the specimen.
Abstract translation: 公开了一种用于检测故障的装置，其包括：装置框架，其包括可移动安装的台架，固定有模制件的模制件并且安装在待提升的台架上的支架;切割构件， 安装在设备框架上以通过提升保持器来切割样本;切割侧图像检查单元，安装在设备框架上以面对保持器并检查样本的切割面;以及电性能测量单元， 安装在设备框架上以电连接到样品。
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公开(公告)号：KR1020140080962A
公开(公告)日：2014-07-01
申请号：KR1020120150198
申请日：2012-12-21
Applicant: 삼성전기주식회사
CPC classification number: G01N25/18 , G01N33/442 , G01N33/445
Abstract: The present invention relates to a thermal conductivity measuring device and, more specifically, to a thermal conductivity measuring device which can measure thermal conductivity characteristics of a complex polymer material in a nondestructive way. The present invention can include a heating member which heats a point of a sample to measure the thermal conductivity of molecule of the sample; a light source which emits light in order to measure a molecular structure that is activated on the heated point; a confocal aperture which controls the volume of the light emitted from the light source; a beam splitter which reflects and passes the light that passed the confocal aperture; a condensing lens which concentrates light reflected through the beam splitter into the heated point; and a photo detector which detects the light reflected back from the heated point of the sample.
Abstract translation: 本发明涉及一种热导率测量装置，更具体地说，涉及一种以非破坏性方式测量复合聚合物材料的导热特性的热导率测量装置。 本发明可以包括加热部件，其加热样品的点以测量样品的分子的热导率; 发光的光源，以测量在加热点上活化的分子结构; 共焦孔，其控制从光源发射的光的体积; 分束器，其反射并通过通过共焦孔的光; 聚光透镜，其将通过分束器反射的光集中到加热点中; 以及光检测器，其检测从样品的加热点反射回的光。
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Patent Agency Ranking
公开(公告)号：KR1020140079036A
公开(公告)日：2014-06-26
申请号：KR1020120148507
申请日：2012-12-18
Applicant: 삼성전기주식회사
CPC classification number: C09D11/324 , C09D11/38 , H05K1/0373 , H05K3/28 , H05K2201/0141 , H05K2201/0257 , H05K2201/0293 , H05K2203/013 , Y10T428/26 , H01B3/18 , B05D7/24 , C01B32/23 , C09D7/63 , H01B17/62 , H05K3/0011
Abstract: The present invention relates to oxide graphene, an insulating material including the same, an insulating layer composition including a polar solvent with a solvent polarity index of 5.5 or more, a substrate including the insulating layer using the same, and a method for manufacturing the substrate. According to the present invention, provided is the insulating layer composition which includes oxide graphene with improved insulating and mechanical properties as an insulating material and includes a specific solvent capable of securing the dispersion of the oxide graphene. Moreover, the present invention can provide a substrate including a bulk insulating layer and a fine patterned insulating layer and a manufacturing method thereof by solving the aggregation problem of an existing ink-jet printing method using the insulating layer composition.
Abstract translation: 本发明涉及氧化石墨烯，包含该氧化石墨烯的绝缘材料，包含溶剂极性指数为5.5以上的极性溶剂的绝缘层组合物，包括使用其的绝缘层的基板以及该基板的制造方法 。 根据本发明，提供了绝缘层组合物，其包括具有改进的绝缘和机械性能的氧化石墨烯作为绝缘材料，并且包括能够确保氧化石墨烯的分散体的特定溶剂。 此外，本发明可以通过解决使用绝缘层组合物的现有喷墨打印方法的聚集问题来提供包括体绝缘层和精细图案化绝缘层的基板及其制造方法。
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公开(公告)号：KR1020140060116A
公开(公告)日：2014-05-19
申请号：KR1020120126812
申请日：2012-11-09
Applicant: 삼성전기주식회사
CPC classification number: H05K3/284 , H01L21/563 , H01L2224/16225 , H05K3/3436 , H05K2201/0129 , H05K2201/0145 , H05K2201/09909 , H05K2201/10977 , H05K2203/013 , H05K2203/0514 , H05K2203/0545
Abstract: The present invention relates to a printed circuit board and a method of manufacturing the same. The printed circuit board and the method of manufacturing the same according to one embodiment of the present invention include a base substrate in which a connection pad is formed; a dam which is separated from one side of the connection pad; and a protective layer which surrounds the dam. According to one embodiment of the present invention, the protective layer is made of liquefied polyethylene terephthalate (PET).
Abstract translation: 印刷电路板及其制造方法技术领域本发明涉及印刷电路板及其制造方法。 根据本发明的一个实施例的印刷电路板及其制造方法包括其中形成连接垫的基底; 从连接垫的一侧分离的坝; 以及围绕大坝的保护层。 根据本发明的一个实施例，保护层由液化的聚对苯二甲酸乙二醇酯（PET）制成。
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公开(公告)号：KR1020140050366A
公开(公告)日：2014-04-29
申请号：KR1020120116699
申请日：2012-10-19
Applicant: 삼성전기주식회사
IPC: G01N1/28
CPC classification number: G01N1/38 , G01N2001/383
Abstract: The present invention provides an unknown sample pretreatment method which comprises a step for preparing different types of plurality of first solutions; a step for selecting one solution which the unknown sample is dissolved among the first solutions; a step for preparing a plurality of second solutions by changing the concentration of the selected solution; a step for adding the unknown sample in the second solution and checking if the unknown sample is dissolved; a step of selecting a solution with the lowest concentration which the unknown sample is dissolved among the second solutions; and a step of dissolving the unknown sample using the solution with the lowest concentration. [Reference numerals] (S1) Step for preparing different types of plurality of the pretreatment solutions; (S2) Step of adding an unknown sample to the different types of the pretreatment solution; (S3) Step of checking if the unknown sample is dissolved; (S4) Step of selecting the kind of pretreatment solution which dissolves the unknown sample; (S5) Step of preparing different concentrations of the pretreatment solution by differing the concentration of the selected pretreatment solution; (S6) Step of adding the unknown sample to the pretreatment solutions of different concentrations; (S7) Step of checking if the unknown sample is dissolved; (S8) Step of selecting the pretreatment solution with the lowest concentration dissolving the unknown sample; (S9) Step of dissolving the unknown sample using the pretreatment solution of the selected kinds and the selected concentration
Abstract translation: 本发明提供一种未知的样品预处理方法，其包括制备不同类型的多种第一溶液的步骤; 在第一溶液中选择未知样品溶解的一种溶液的步骤; 通过改变所选溶液的浓度来制备多个第二溶液的步骤; 将未知样品添加到第二溶液中并检查未知样品是否溶解的步骤; 在第二溶液中选择未知样品溶解的最低浓度的溶液的步骤; 以及使用最低浓度的溶液来溶解未知样品的步骤。 （附图标记）（S1）用于制备不同种类的多种预处理溶液的步骤; （S2）将未知样品添加到不同类型的预处理溶液中的步骤; （S3）检查未知样品是否溶解的步骤; （S4）选择溶解未知样品的预处理溶液的种类的步骤; （S5）通过使所选择的预处理溶液的浓度不同，制备不同浓度的预处理溶液的步骤; （S6）将未知样品添加到不同浓度的预处理溶液中的步骤; （S7）检查未知样品是否溶解的步骤; （S8）选择溶解未知样品的最低浓度的预处理溶液的步骤; （S9）使用所选种类的预处理溶液和所选浓度溶解未知样品的步骤
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公开(公告)号：KR1020140031632A
公开(公告)日：2014-03-13
申请号：KR1020120098174
申请日：2012-09-05
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/73204 , H01L2224/92125 , H01L21/563 , H01L23/29 , H01L24/15 , H01L24/81 , H01L2924/15151
Abstract: The present invention relates to a semiconductor chip package and a method of manufacturing the same. The method of manufacturing a semiconductor chip package according to the present invention includes simultaneously coating a solder having a predetermined pattern and an underfill material on a PCB to fill a space between solders having the predetermined pattern; and simultaneously performing soldering between the PCB and the semiconductor chip by the solder and curing the underfill material by heating the semiconductor chip on the layer after the semiconductor chip is put on a layer formed by the coated solder and underfill material. According to the present invention, when filling the underfill material in a space between the PCB and the semiconductor chip, the semiconductor chip is put on the PCB after simultaneously coating the PCB with the solder and the underfill material, so that the soldering and the curing of the underfill material can be simultaneously performed. Thus, generation of a void in the underfill material and an incomplete filling problem of the underfill material occuring in a conventional injecting scheme by an injector can be completely solved.
Abstract translation: 半导体芯片封装及其制造方法技术领域本发明涉及半导体芯片封装及其制造方法。 根据本发明的制造半导体芯片封装的方法包括同时将具有预定图案的焊料和底部填充材料涂覆在PCB上以填充具有预定图案的焊料之间的空间; 同时通过焊料在PCB和半导体芯片之间进行焊接，并且在将半导体芯片放置在由涂覆焊料和底部填充材料形成的层上之后，通过加热该层上的半导体芯片来固化底部填充材料。 根据本发明，当在PCB和半导体芯片之间的空间中填充底部填充材料时，半导体芯片在用焊料和底部填充材料同时涂覆PCB之后被放置在PCB上，使得焊接和固化 的底部填充材料可以同时进行。 因此，可以完全解决在底部填充材料中产生的空隙和由注射器在常规注射方案中发生的底部填充材料的不完全填充问题。
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公开(公告)号：KR101320166B1
公开(公告)日：2013-10-23
申请号：KR1020110037261
申请日：2011-04-21
Applicant: 삼성전기주식회사
CPC classification number: C04B37/026 , B32B15/02 , B32B15/04 , B32B2457/00 , C04B2235/945 , C04B2237/12 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/348 , C04B2237/40 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/597 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C23C18/1657 , C25D1/006 , H01G4/12 , H01G4/1227 , H01G4/30
Abstract: 본 발명은 세라믹 전자부품용 세라믹 시트 제품, 이를 이용한 적층 세라믹 전자 부품 및 이의 제조방법에 관한 것으로, 본 발명에 따른 세라믹 전자부품용 세라믹 시트 제품은 세라믹층; 상기 세라믹층 상에 형성된 금속층; 및 상기 금속층과 접하며, 상기 금속층으로부터 상기 세라믹층 내부로 돌출된 금속 나노 구조물;을 포함한다. 본 발명에 따른 세라믹 전자부품용 세라믹 시트 제품을 이용한 적층 세라믹 전자 부품은 전극 간 거리가 줄어들어 전기용량이 증가하므로, 고용량 적층 세라믹 전자 부품을 제공할 수 있다.
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