Abstract:
An apparatus for forming a semiconductor structure is provided. The apparatus includes a chamber (102) and a plurality of first material sources (106-110) positioned at least partially within the chamber. The plurality of first material sources are configured to provide materials for the formation of a monocrystalline accommodating buffer layer (204) on a substrate (202). The plurality of first material sources includes an oxygen source (116). At least one second material source (112-114) is also positioned at least partially within the chamber and is configured to provide material for the formation of a monocrystalline oxygen-doped material layer (206) overlying the monocrystalline accommodating buffer layer. The apparatus also includes an oxygen-adjustment mechanism (132) configured to adjust the partial pressure of oxygen in the chamber.
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. One way to achieve the formation of a complaint substrate includes first growing a monocrystalline binary metal oxide material layer (14) on a substrate (12). The binary metal oxide material layer (14) is lattice matched to both the underlying substrate (12) and the overlying monocrystalline material layer (16).
Abstract:
High quality epitaxial layers of stable oxides can be grown overlying compound semiconductor material substrates. The compound semiconductor substrate (101) may be terminated with an atomic layer of gallium, for example (for a gallium arsenide substrate), forming a terminating layer (102). The oxide layer (105) is a layer of monocrystalline alkali earth oxide spaced apart from the compound semiconductor wafer by an oxide template layer (103) overlying the compound semiconductor substrate via the terminating layer. The oxide template layer (103) dissipates strain and permits the growth of a high quality monocrystalline oxide layer. Any lattice mismatch between the monocrystalline oxide layer and the underlying compound semiconductor substrate is decreased by the oxide template layer. The monocrystalline oxide layers can be used as gate dielectric in insulated gate field effect transistors.
Abstract:
High quality epitaxial layers of compound semiconductor materials (26) can be grown overlying large silicon wafers (22) by first growing an accommodating buffer layer (24) on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer (28) dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
Abstract:
High quality epitaxial layers of metallic oxide materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
Abstract:
High quality epitaxial layers of compound semiconductor materials can be grown overlying lattice mismatched substrates, preferably silicon wafers, by first growing an accommodating buffer layer (24). The accommodating buffer layer is a layer of monocrystalline insulator (24) spaced apart from the substrate (22) by an amorphous oxide interface layer (28) of preferably silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline insulator accommodating buffer layer (24), preferably of perovskite oxide material such as alkaline earth titenates, zirconates or the like.