Abstract:
A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.
Abstract:
A method for producing a light emitting diode arrangement. A plurality of LED modules (110, 120, 130) are provided, which in each case comprise at least one radiation emitting semiconductor component (1000) on a carrier body (1300). At least one separately fabricated connection carrier (200) is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.
Abstract:
An electronic device may have electrical components such as input-output devices. An electrical component may be mounted on a flexible printed circuit. The flexible printed circuit may have a bend that forms a flexible printed circuit spring to bias the electrical component in a desired direction. The electronic device may have a display with a display cover layer. In an inactive display area, opaque masking material may be formed on the display cover layer. A light window may be formed in the opaque masking layer. The flexible printed circuit spring may bias the electrical component against the display cover layer in alignment with the light window. An air gap under the electrical component may separate the component from a planar portion of the flexible printed circuit that is overlapped by the electrical component. The electrical component may be a camera, a light sensor, or other device.
Abstract:
A method for producing a light emitting diode arrangement. A plurality of LED modules (110, 120, 130) are provided, which in each case comprise at least one radiation emitting semiconductor component (1000) on a carrier body (1300). At least one separately fabricated connection carrier (200) is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.
Abstract:
An assembly of a plurality of tiles (1) with a carrier (40), wherein the tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier, and the tiles overlay according to a fish scale pattern.
Abstract:
An imager assembly for a remote inspection device includes an imager body. A circuit board retainer is slidably received through an end of the imager body. The circuit board retainer has deflectable legs separated by a slot. A circuit board assembly has an imager device connected to a first circuit board. A second circuit board is electrically connected to the first circuit board. The second circuit board is received in the slot of the circuit board retainer and frictionally engaged by the deflectable legs. A flexible tube has a first end connected to an end of the imager body using a first ferrule. A male connector is connected to a second end of the flexible tube using a second ferrule. A wiring harness is disposed through a bore of the flexible tube.
Abstract:
The present invention provides a liquid crystal display module including housing, a flexible printed circuit board and a plurality of electric devices. The housing has at least a receiving notch. The flexible printed circuit board has a flexible substrate and at least an extension substrate projected from the flexible substrate to mount electric devices thereon. The extension substrate may be bent and received in the receiving notch of the housing to achieve the purpose of mounting more electric device on the flexible printed circuit board without having to increase the size of module.
Abstract:
An imager assembly for a remote inspection device includes an imager body. A circuit board retainer is slidably received through an end of the imager body. The circuit board retainer has deflectable legs separated by a slot. A circuit board assembly has an imager device connected to a first circuit board. A second circuit board is electrically connected to the first circuit board. The second circuit board is received in the slot of the circuit board retainer and frictionally engaged by the deflectable legs. A flexible tube has a first end connected to an end of the imager body using a first ferrule. A male connector is connected to a second end of the flexible tube using a second ferrule. A wiring harness is disposed through a bore of the flexible tube.
Abstract:
The present invention provides a liquid crystal display module including housing, a flexible printed circuit board and a plurality of electric devices. The housing has at least a receiving notch. The flexible printed circuit board has a flexible substrate and at least an extension substrate projected from the flexible substrate to mount electric devices thereon. The extension substrate may be bent and received in the receiving notch of the housing to achieve the purpose of mounting more electric device on the flexible printed circuit board without having to increase the size of module.
Abstract:
A flexible substrate (100) carries circuitry (102) in one area of the substrate and other portions of the substrate are at least partially covered with conductive material (206) to provide a ground plane. The substrate is folded about the circuitry to form an enclosure shielding the circuit.