Abstract:
A microstrip line is provided which keeps the shape of ground interconnections constant with respect to signal interconnections even if there is a curved geometry and can prevent a change in area of the ground interconnections opposite to the signal interconnections due to misregistration of exposed patterns or misalignment of stacked layers in a printed wiring board including a mediated thin insulation layer such as a flexible printed wiring board wherein a solid ground cannot be used. The printed wiring board having a microstrip line structure wherein the signal interconnections have a curved geometry is characterized in that it includes linear ground interconnections (5, 9, 12, 15, 19, 26) disposed opposite to the signal interconnections (4, 6, 8, 11, 14, 18, 25) via an insulation layer (3, 10, 13) and a wiring pitch of the ground interconnections is 1/n (here, n is a natural number of 1 or 2) of the line width of the signal interconnections.
Abstract:
In high-speed semiconductor packaging, differential pair transmission lines 605 are used to receive incoming signals carried using differential signaling. Common mode noise can decrease the frequency at which these signals are clocked. The use of slots 620 formed in the ground (or power plane) 609 of the substrate and lying perpendicularly (and equally spaced) underneath the differential pair 605 improves the common mode rejection of the differential pair 605 by increasing the common mode impedance without affecting the differential mode impedance. The use of slots 620 does not require modifications to the packaging, and only minor modifications to the substrate.
Abstract:
Disclosed is a method of manufacturing a slip ring printed circuit board which includes forming a plurality of concentric spaced electrical contacts on one side of a non-conductive base and forming interconnecting electrical paths on an opposite side of the non-conductive base. The method of manufacturing a slip ring printed circuit board also includes electrically connecting the electrical contacts and the interconnecting electrical paths, depositing copper on the electrical contacts to form electrical rings and etching a groove into each of the electrical rings.
Abstract:
An integrated transducer-electronics interconnection suspension (12) for a disk drive having a high data transfer rate generally above (15) Mbytes/sec between the transducer (9) and the read/write electronics. A suspension (12) supports a slider (10) to which a transducer (9) is mounted and maintains the slider (10) in close proximity to the disk surface. An integrated transducer-electronics interconnection suspension is a laminate structure having electrically conductive traces as part of the structure and connecting the transducer (9) with the read/write electronics. It can support high data transfer rates between the transducer (9) and the read/write electronics by providing means for avoiding sudden changes in the characteristic impedance of the traces to minimize signal reflection on them. The width of the traces are shaped accordingly to prevent abrupt changes in the trace impedance caused by trace bonding areas, apertures and other mechanical obstructions in the suspension. Changes in the traces' direction are gradual to avoid signal reflection. Also, a patterned electrically conductive back plane may be provided in the laminate to better control the trace characteristic impedance. Where a trace crosses above a back plane opening, lateral extensions from the trace's side edges are formed to compensate for the resulting impedance change. In addition, the traces and bonding areas are grouped by signal type, with sufficient spacing between the groups, to minimize cross-coupling of the signals.
Abstract:
Embodiments are disclosed for a printed circuit board 700. An example printed circuit board includes a ground plane 702 comprising a pattern of an electrically conductive material. The example printed circuit board further includes a circuit trace 704 disposed adjacent to the ground plane, where one or more characteristics of one of more of the pattern of the electrically conductive material in the ground plane and the circuit trace vary based upon a directional change of the circuit trace. A curved region 706 of the circuit trace is formed by a conductive material different from a conductive material included in uncurved regions of the circuit trace.
Abstract:
According to the embodiment, there is a provided a touch window which includes a substrate (100); and an electrode on the substrate (100), wherein the electrode includes a first mesh line (201) extending in a first direction and having a first width (W1); a second mesh line (202) extending in a direction different from the first direction and having a second width (W2); and a crossing area (CA) in which the first and second mesh lines (201 ; 202) cross each other, the crossing area (CA) having a third width (W3), wherein the third width (W3) is larger than the first width (W1), and the third width (W3) is equal to or less than 10 times of the first width (W1).
Abstract:
Disclosed are a touch window with an improved visibility and a touch device with the same. The touch window includes a substrate; a first sensing electrode (210) aligned on the substrate as a first conductive pattern (1P); and a second sensing electrode (220) aligned on the substrate as a second conductive pattern (2P), wherein the first conductive pattern (1P) and the second conductive pattern (2P) have mutually different directionalities.
Abstract:
An electronic circuit (100), having multiple transmission lines (152, 102). A first and second transmission line (152,102) have a bend (156) where the transmission lines make an angle. The angles have the same magnitude and the same orientation. The first and second transmission line (152, 102) cross (102), and their electrical lengths are equal. Relative phase between multiple interrelated signals transmitted across the multiple transmission lines is preserved as they traverse the bends.