Abstract:
The disclosure discloses a wireless terminal with a reduced Specific Absorption Rate (SAR) peak. The wireless terminal comprises a Printed Circuit Board (PCB), wherein a fractal gap is formed at an edge of a metal ground on the PCB to disturb distribution of induced current at the edge of the metal ground. The disclosure also discloses a method for reducing an SAR peak. On the premise of the non-influence on the communication quality of the wireless terminal, the SAR and the production cost can be reduced and the structure space of wireless terminal can be saved by using the wireless terminal and the method.
Abstract:
A flow controller including a unitary controller body with a chemically inert fluid conduit having an insertable constriction or orifice disposed within the conduit having a reduced cross-sectional area to thereby restrict the flow of fluid within the conduit allowing for reliable flow measurement. An integrated circuit or controller may becoupled to the control valve and also coupled to the pressure sensors by a lead structure including signal conductors surrounded by a Faraday cage, and a chemically inert housing coupled to the unitary controller body enclosing the control valve and the pressure sensors.
Abstract:
A flow controller including a unitary controller body with a chemically inert fluid conduit having an insertable constriction or orifice disposed within the conduit having a reduced cross-sectional area to thereby restrict the flow of fluid within the conduit allowing for reliable flow measurement. An integrated circuit or controller may becoupled to the control valve and also coupled to the pressure sensors by a lead structure including signal conductors surrounded by a Faraday cage, and a chemically inert housing coupled to the unitary controller body enclosing the control valve and the pressure sensors.
Abstract:
Es wird eine Vorrichtung zum Befestigen eines Substrats (2) einer Dünnschicht- oder Dickschichtschaltung an einem einen Schlitz (10,10a,10b) aufweisenden Gehäuseteil (12,12a,12b) und zur Herstellung eines elektrischen Kontakts zwischen einer auf dem Substrat (2) vorgesehenen elektrischen Leitung (4) und dem Gehäuse (12,12a,12b) angegeben. Dabei ist das Substrat (2) zur Ausbildung einer formschlüssigen Verbindung in den Schlitz (10, 10a, 10b) einführbar und in diesem reversibel befestigbar derart, dass ein auf dem Substrat (2) ausgebildeter und mit der Leitung (4) elektrisch leitend verbundener Kontakthöcker (6) mit einer Seitenwand (22a,22b) des Schlitzes (10, 10a, 10b) zur Ausbildung eines Gehemmes und des elektrischen Kontakts zusammenwirkt.
Abstract:
Double adherent, electrically conductive tape comprising an elastic and flexible tape (1) being adherent on both sides, and an electrically conductive material applied along at least one edge of the tape. The electrically conductive material is in the shape of at least one continuous strip (2) folded in the longitudinal direction of the tape about an edge of the tape.
Abstract:
A ground plane interconnection is provided on first and second substrates (100, 112), the first and second substrates (100, 112) having respective first and second ground layers (110, 118) disposed on a first surface of each of the first and second substrates (100, 112). A ground conductor strip (120) is disposed on a second surface of the second substrate (112), wherein the ground conductor strip (120) includes a plurality of electrically conductive members (124) which pass through the second substrate (112) to electrically couple the ground conductor strip (120) and the second ground layer (118). The first substrate (100) is positioned with respect to the second substrate (112) such that when the first substrate (100) is placed proximate the second substrate (112), the ground conductor strip (120) electrically couples the first and second ground layers (110, 118) to form a continuous ground plane. A method of forming a reduced-inductance continuous ground plane is also provided.
Abstract:
Cette invention propose un boîtier (1, 2) composé de plusieurs parties, pour appareils de commande, dans lequel l'étanchéité contre les rayonnements perturbateurs et une bonne évacuation de la chaleur sont obtenues au moyen d'une plaquette (6) portant des composants de puissance (3) et des composants de commande (4), dotée d'un placage périphérique réalisé en matériau électroconducteur et thermoconducteur. Cette plaquette est serrée entre les deux demi-boîtiers (1, 2) dans la zone de ces placages (10) qui sont électriquement reliés, un contact thermoconducteur étant établi entre les composants de puissance et ce placage (10), tandis que des éléments de commande à rayonnements perturbateurs intensifs ou sensibles aux rayonnements perturbateurs sont enfermés à l'intérieur d'éléments de raccordement (19) faisant saillie dans la paroi des deux parties de boîtier.