公开(公告)号：US09414499B2

公开(公告)日：2016-08-09

申请号：US13695870

申请日：2011-03-23

Applicant: Jan van Aalst ,  Drago Kovacic ,  Bostjan Podobnik

Inventor： Jan van Aalst ,  Drago Kovacic ,  Bostjan Podobnik

IPC: H05K3/02 ,  B23K26/36

CPC classification number: H05K3/027 ,  B23K26/36 ,  B23K2101/38 ,  H05K2201/062 ,  H05K2201/09363

Abstract: A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.

Abstract translation: 使用激光束对导电层的限定区域进行部分分离的方法包括从基板上的导电层形成具有限定路径的导体轨迹，该路径限定主轴。 该区域被分割成区域。 沿着每个区域的相应周边设置有线性凹槽。 每个区域具有带状，使得凹部沿着不平行于任一主轴线的基本直线的路径延伸。 使用激光辐射来加热待除去的区域之一，直到导电层与基底的粘合性大大降低，并且在外部影响下将被去除的区域以表面宽度的方式与基底分离。 激光束参数被设置为使得仅去除导电层而不影响下面的衬底。

公开(公告)号：US09054333B2

公开(公告)日：2015-06-09

申请号：US13067343

申请日：2011-05-25

Applicant: Jan Hesse ,  Christian Kirchhof ,  Udo Bechtloff ,  Kai Schmieder

Inventor： Jan Hesse ,  Christian Kirchhof ,  Udo Bechtloff ,  Kai Schmieder

IPC: H01J1/62 ,  H01L51/52 ,  H05K3/32 ,  H05K1/11

CPC classification number: H01L51/5203 ,  H01L51/5243 ,  H01L2251/5361 ,  H05K1/112 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/09072 ,  H05K2201/09363 ,  H05K2201/10106

Abstract: The invention relates to a lighting element, wherein at least one organic light-emitting diode is formed at an optically transparent substrate as a layer structure. In the lighting element in accordance with the invention, at least one organic light-emitting diode is formed at an optically transparent substrate as a layer structure. The at least one organic light-emitting diode and the substrate are connected to a circuit board and electric contact elements for the connection of the electrodes of the organic light-emitting diode(s) are present at the surface of the circuit board. The surface of the circuit board facing in the direction of the organic light-emitting diode(s) is provided over its full area with a metallic coating as a permeation barrier. The metallic coating is only breached by electric insulators formed about the contact elements.

Abstract translation: 本发明涉及一种照明元件，其中至少一个有机发光二极管形成在光学透明基板上作为层结构。 在根据本发明的照明元件中，至少一个有机发光二极管形成在光学透明基板上作为层结构。 至少一个有机发光二极管和基板连接到电路板，并且用于连接有机发光二极管的电极的电接触元件存在于电路板的表面。 电路板的面向有机发光二极管的方向的表面在其全部区域上设置有作为渗透屏障的金属涂层。 金属涂层仅由围绕接触元件形成的电绝缘体破坏。

公开(公告)号：US20150137161A1

公开(公告)日：2015-05-21

申请号：US14406331

申请日：2013-04-26

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Toshio Hata ,  Yuhsuke Fujita ,  Kenichi Akamatsu

IPC: H01L33/48 ,  H01L27/15 ,  H01L33/36 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L27/15 ,  H01L33/36 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/167 ,  H05K2201/09363 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A surface mounted light emitting device having superior reliability with a focus on low cost producibility, in which a protective element can be formed without lowering the efficiency of light emission from a light emitting element, is provided.Since, for example, a printed resistance 16, as a protective element, is formed on at least the top surface side, the back surface side, or the inside of an insulating film 2 and, for example, the printed resistance 16, as a protective element, is formed on the rear surface side of the installation surface of a light emitting element 11, light emitted from the light emitting element 11 is not obstructed due to light blocking, light absorption or the like by, for example, the printed resistance 16, as a protective element.

Abstract translation: 提供一种表面安装的发光器件，其具有优异的可靠性，重点是低成本可生产性，其中可以形成保护元件而不降低发光元件的发光效率。 由于例如作为保护元件的印刷电阻16至少形成在绝缘膜2的上表面侧，背面侧或内部，例如印刷电阻16上，作为 保护元件形成在发光元件11的安装表面的后表面侧上，从发光元件11发射的光不被遮光，光吸收等阻挡，例如通过印刷电阻 16，作为保护元件。

公开(公告)号：US20140048313A1

公开(公告)日：2014-02-20

申请号：US13962248

申请日：2013-08-08

Applicant: Bridge Semiconductor Corporation

Inventor： Wei-Kuang PAN ,  Charles W.C. LIN ,  Chia-Chung WANG

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H01L23/3677 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/0052 ,  H05K3/4652 ,  H05K2201/09181 ,  H05K2201/09363 ,  H05K2201/09509 ,  H05K2201/09781 ,  H05K2201/10416 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A thermally enhanced wiring board with thermal pad and electrical post includes a metal slug, a metal pillar, a patterned interconnect substrate, an adhesive, a build-up circuitry and optionally a plated through hole. The metal slug and the metal pillar extend into apertures of the patterned interconnect substrate and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slug, the metal pillar and the patterned interconnect substrate and can provide signal routing. The metal slug can provide thermal contact surface, and the metal pillar can serve as power/ground plane or signal vertical transduction pathway.

Abstract translation: 具有热垫和电焊柱的热增强布线板包括金属块，金属柱，图案化互连衬底，粘合剂，积聚电路和任选的电镀通孔。 金属块和金属柱延伸到图案化的互连衬底的孔中并且电连接到积聚电路。 积聚电路覆盖金属块，金属柱和图案化的互连衬底，并且可以提供信号路由。 金属块可以提供热接触表面，金属柱可以用作电源/接地平面或信号垂直传导通路。

公开(公告)号：US20130314849A1

公开(公告)日：2013-11-28

申请号：US13902311

申请日：2013-05-24

Applicant: Power Logic South Africa (Pty) Ltd

Inventor： Raymond Mazzullo ,  Adrian Mazzullo ,  Brian Van Zyl ,  Bastian Strauf ,  Nicholas Brear

IPC: H02B1/04 ,  H02B1/015

CPC classification number: H02B1/04 ,  H02B1/015 ,  H05K1/0225 ,  H05K1/0265 ,  H05K2201/09309 ,  H05K2201/09363 ,  H05K2201/1028

Abstract: A power supply system is disclosed which comprises a printed circuit board (10) having on one side of the substrate thereof a live track (58), a neutral track (54) and a switched live track (52). A switch (30) when closed connects the live track to the switched-live track (52). The tracks (52, 58) connect live input terminal (12) to a live output terminal (20) and a neutral input terminal (16) to a neutral output terminal (18). A second switched-live track connected to the track (58) is provided on the opposite side of the substrate.

Abstract translation: 公开了一种电源系统，其包括印刷电路板（10），该印刷电路板在其基板的一侧具有实时轨道（58），中性轨道（54）和切换实况轨道（52）。 闭合时的开关（30）将实况轨道连接到开关式实时轨道（52）。 轨道（52,58）将有源输入端子（12）连接到有源输出端子（20）和中性输入端子（16）到中性输出端子（18）。 连接到轨道（58）的第二转换轨迹设置在基板的相对侧上。

公开(公告)号：US20100307799A1

公开(公告)日：2010-12-09

申请号：US12479791

申请日：2009-06-06

Applicant: Cheng-Feng CHIANG

Inventor： Cheng-Feng CHIANG

IPC: H05K1/03 ,  H05K3/10 ,  H01K3/22

CPC classification number: H05K3/242 ,  H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0284 ,  H05K1/183 ,  H05K3/027 ,  H05K3/108 ,  H05K3/181 ,  H05K3/244 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2201/09127 ,  H05K2201/09363 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49158 ,  H01L2924/00

Abstract: A carrier structure for electronic components includes a carrier, an interface layer, insulation paths and a metal layer. The carrier is made of a molded plastic. A reflection cup is formed on the carrier. The carrier is etched, catalyzed and activated, then deposited Ni or Cu by chemical deposition to form an interface layer on it. Afterwards insulation paths are formed on the interface layer by ablating part of the insulation layer employing laser beam radiation, in the followed step, electroplating process is carried out using Cu, Ni, Ag or Au to form a metal layer on the interface layer thereby completing the carrier structure for electronic components.

Abstract translation: 用于电子部件的载体结构包括载体，界面层，绝缘路径和金属层。 载体由模制塑料制成。 在载体上形成反射杯。 载体被蚀刻，催化和活化，然后通过化学沉积沉积Ni或Cu以在其上形成界面层。 之后，通过使用激光束辐射烧蚀绝缘层的一部分，在界面层上形成绝缘路径，在随后的步骤中，使用Cu，Ni，Ag或Au进行电镀工艺，以在界面层上形成金属层，从而完成 电子元件的载体结构。

公开(公告)号：US20100263921A1

公开(公告)日：2010-10-21

申请号：US12741105

申请日：2008-11-04

Applicant: Youichiro Nakahara ,  Naoto Ikegawa ,  Kyohei Uemura ,  Yoshiyuki Uchinono

Inventor： Youichiro Nakahara ,  Naoto Ikegawa ,  Kyohei Uemura ,  Yoshiyuki Uchinono

IPC: H05K1/09 ,  H05K3/46

CPC classification number: H05K3/027 ,  H05K3/108 ,  H05K3/244 ,  H05K2201/09363 ,  H05K2203/0723 ,  H05K2203/107

Abstract: A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along an outer shape of the circuit so as to partly remove the metal thin film along the outer shape of the circuit; a Cu plating layer, a Ni plating layer and a Au plating layer formed by metal plating and sequentially provided on a surface of the undercoat layer. A first middle plating layer and a second middle plating layer are provided between the Ni plating layer and the Au plating layer. The first middle plating layer includes metal with a less noble standard electrode potential with respect to Au and is in contact with the Au plating layer. The second middle plating layer includes metal with a noble standard electrode potential with respect to the metal in the first middle plating layer and is in contact with the first middle plating layer.

Abstract translation: 电路板包括：绝缘基板; 以及形成在绝缘基板上的电路。 该电路包括：具有电路图案的底涂层，其通过沿电路的外形以激光照射覆盖绝缘基板的表面的金属薄膜而形成，以沿着外部形状部分去除金属薄膜 电路 Cu镀层，Ni镀层和通过金属电镀形成的Au镀层，并依次设置在底涂层的表面上。 在Ni镀层和Au镀层之间设置第一中间镀层和第二中间镀层。 第一中间镀层包括相对于Au具有较低贵族标准电极电位的金属，并与Au镀层接触。 第二中间镀层包括相对于第一中间镀层中的金属具有贵族标准电极电位并与第一中间镀层接触的金属。

公开(公告)号：US07755911B2

公开(公告)日：2010-07-13

申请号：US12081503

申请日：2008-04-16

Applicant: Masaoki Yoshida ,  Takuya Nakayama ,  Koji Ueyama

Inventor： Masaoki Yoshida ,  Takuya Nakayama ,  Koji Ueyama

IPC: H01R9/00

CPC classification number: H05K1/116 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/09363 ,  H05K2201/09463 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/10651 ,  H05K2203/1446

Abstract: A printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Because the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.

Abstract translation: 可以防止端子引起的导电图案的损坏的印刷电路板。 印刷电路板具有基板，导电图案，通孔和非导电区域。 安装在印刷线路板上的电阻引线插入到通孔4中。引线从板的表面突出并且靠近表面弯曲。 非导电区域形成为从通孔的中心向引线的尖端扩大的扇形形状。 由于弯曲的引线布置在非导电区域上，所以非导电区域可以防止由引线接触导电图案而导致的导电图案的损坏。

公开(公告)号：US20100027291A1

公开(公告)日：2010-02-04

申请号：US12527336

申请日：2007-10-10

Applicant: Tetsuya Hamada

Inventor： Tetsuya Hamada

IPC: F21V7/22

CPC classification number: G02B6/0073 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  G02F1/133615 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/28 ,  H05K3/321 ,  H05K2201/09363 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2201/2054

Abstract: Electrode terminals (33a, 33b) of an LED (3) and a mounting wiring (42) of an FPC (4) are bonded by using a conductive adhesive, and a metal slug (31) of the LED (3) and a heat dissipation wiring (43) of the FPC (4) are bonded by using the conductive adhesive. The heat dissipation wiring (43) corresponds to each of the LEDs (3) and isolates the LEDs one from the other, not to permitting electricity to be carried between them.

Abstract translation: LED（3）的电极端子（33a，33b）和FPC（4）的安装布线（42）通过使用导电粘合剂和LED（3）的金属块（31）和热 通过使用导电粘合剂将FPC（4）的耗散布线（43）接合。 散热布线（43）对应于每个LED（3），并且将LED彼此隔离，而不允许在它们之间承载电力。

公开(公告)号：US20090273925A1

公开(公告)日：2009-11-05

申请号：US12499171

申请日：2009-07-08

Applicant: John C. Schultz ,  Andrew J. Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

Inventor： John C. Schultz ,  Andrew J. Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

IPC: F21S4/00 ,  H01L33/00

CPC classification number: H05K1/0203 ,  F21K9/00 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09363 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.

Abstract translation: 照明组件包括柔性衬底，其包括由电绝缘层分隔开的第一和第二导电箔。 绝缘层包括装载有增强绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。