公开(公告)号：WO2015160426A1

公开(公告)日：2015-10-22

申请号：PCT/US2015/016391

申请日：2015-02-18

Applicant: RAYTHEON COMPANY

Inventor： KYHL, Cary C. ,  HESTON, Scott M.

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K7/2039 ,  H01L2224/73253 ,  H01L2924/16195 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/1056 ,  H05K2201/10628 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装器件可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。

公开(公告)号：WO2011107348A1

公开(公告)日：2011-09-09

申请号：PCT/EP2011/052371

申请日：2011-02-17

Applicant: CONTINENTAL AUTOMOTIVE GMBH ,  KOVATCHEV, Emil ,  MARYSCHKA, Michael

Inventor： KOVATCHEV, Emil ,  MARYSCHKA, Michael

IPC: H05K1/02 ,  H05K9/00 ,  H05K7/20

CPC classification number: H05K1/0218 ,  H05K1/0203 ,  H05K2201/1056

Abstract: Die Erfindung betrifft eine Vorrichtung zur Abschirmung eines Elektronikmoduls, welches an einer Leiterplatter (2) befestigte elektronische Bauteile (8) aufweist und welches mit einem Kühkörper (1) verbunden ist. Der Kühlkörper (1) besteht aus einem elektrisch leitfähigen Material. Die Leiterplatte (2) weist mindestens eine Schicht aus elektrisch leitfähigem Material (9,10) auf. Der Kühlkörper (1) und die Leiterplatte (2) dienen als Abschirmelemente.

Abstract translation: 本发明涉及一种装置，用于屏蔽电子模块，其被安装在印刷电路母板（2）的电子部件（8）和其与Kühkörper（1）连接。 散热器（1）由导电材料制成。 在印刷电路板（2）具有导电材料（9,10）中的至少一个层。 的散热装置（1）和电路板（2）用作屏蔽。

公开(公告)号：WO2009021633A1

公开(公告)日：2009-02-19

申请号：PCT/EP2008/006300

申请日：2008-07-31

Applicant: SEW-EURODRIVE GMBH & CO. KG ,  POLJAK, Anton

Inventor： POLJAK, Anton

IPC: H01L25/11 ,  H01L25/16 ,  H01L23/40

CPC classification number: H01L25/162 ,  H01L23/40 ,  H01L25/115 ,  H01L2023/4081 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4691 ,  H05K7/20463 ,  H05K7/2049 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00

Abstract: Elektrogerät und Antrieb, umfassend eine elektronische Schaltung mit Leistungshalbleitern (21), wobei die Leistungshalbleiter mittels mindestens eines Federelements (22) an einen Kühlkörper (20) angedrückt sind zur Wärmeabfuhr der von den Leistungshalbleitern erzeugten Wärme an den Kühlkörper, wobei die Leistungshalbleiter auf einem Leiterplattenstück (5) angeordnet, insbesondere lötverbunden sind, wobei das Leiterplattenstück mittels eines flexiblen Bereiches (6) mit einer ersten Leiterplatte (1) der elektronischen Schaltung verbunden ist, wobei der flexible Bereich elektrische Leiterbahnen umfasst.

Abstract translation: 电气装置和驱动器，包括用功率半导体的电子电路（21），所述功率半导体通过至少一个弹簧元件（22）（20）的散热片被压到由所述功率半导体的冷却体产生的热的散热性，在电路板上一块功率半导体 （5）布置，特别地，焊料键合的，其特征在于，具有电子电路的第一电路板（1）的布线层基板片经由柔性区域（6），其中，所述柔性部分包括电导体轨迹连接。

公开(公告)号：WO2007044368A2

公开(公告)日：2007-04-19

申请号：PCT/US2006/038720

申请日：2006-10-03

Applicant: STAKTEK GROUP L.P. ,  CADY, James, W. ,  WEHRLY, James, Douglas ,  GOODWIN, Paul

Inventor： CADY, James, W. ,  WEHRLY, James, Douglas ,  GOODWIN, Paul

IPC: H01R43/02

CPC classification number: G11C5/143 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  Y10T29/4913 ,  Y10T29/49179 ,  H01L2924/00

Abstract: Flexible circuitry is populated on one or both sides with integrated circuits (ICs) each of which ICs has an IC profile (height). A substantially flat, windowed fixture with a fixture profile less than the IC profiles of the ICs is applied over an IC-populated side of the flexible circuitry causing at least a part of the ICs to emerge from respective fixture windows. Material is removed simultaneously from that portion of the ICs that emerge from the windows to result in lower-profile ICs which, in a preferred embodiment exhibit profiles substantially coincident with the fixture profile established by the upper surface of the fixture. The method is used to advantage in devising circuit modules by disposing the flexible circuitry about a rigid substrate to form the circuit module with a low profile. Some embodiments use substrates that are windowed or have inset areas into which the lower profile CSPs may be set to reach profile requirements.

Abstract translation: 灵活的电路在一侧或两侧安装集成电路（IC），每个IC都具有IC配置文件（高度）。 具有小于IC的IC配置文件的夹具型材的基本平坦的窗口固定件被施加在柔性电路的IC填充侧上，导致至少一部分IC从相应的固定窗口露出。 与从窗户出现的IC的那部分同时移除材料以产生下轮廓的IC，其在优选实施例中表现出与由固定装置的上表面确定的夹具轮廓基本一致的轮廓。 该方法用于通过将柔性电路围绕刚性基板布置以形成具有低轮廓的电路模块来设计电路模块。 一些实施例使用被窗口化或具有插入区域的衬底，下部轮廓CSP可被设置到其中以达到轮廓要求。

公开(公告)号：WO2005119633A1

公开(公告)日：2005-12-15

申请号：PCT/US2005/009302

申请日：2005-03-17

Applicant: ONSCREE TECHNOLOGIES, INC. ,  RAOS, Robert, Bogdan ,  DESAI, Nilesh, Thakor ,  FLANK, Steven

Inventor： RAOS, Robert, Bogdan ,  DESAI, Nilesh, Thakor ,  FLANK, Steven

IPC: G09F9/33

CPC classification number: G09F9/33 ,  G09F13/20 ,  H05K1/0209 ,  H05K3/28 ,  H05K2201/064 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/1056 ,  H05K2203/081 ,  H05K2203/1178

Abstract: A light emitting diode (LED) assembly with a vented (22) printed circuit board (2) is disclosed. A printed circuit board assembly may include a plurality of LED modules (4) disposed in an array with a multilayered substrate and a plurality of vents (22). The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules (4) for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules (4) for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract translation: 公开了具有通气（22）印刷电路板（2）的发光二极管（LED）组件。 印刷电路板组件可以包括多个设置在具有多层衬底和多个通风口（22）的阵列中的LED模块（4）。 多层基板可以包括与用于散热的LED模块（4）热连通的热冷却层。 多层基板可以包括与LED模块（4）电连通以用于激励LED的一个或多个电功率层。 多层衬底可以具有外部绝缘层，该外部绝缘层包括被配置为与热冷却层流体连通的多个流体孔。

公开(公告)号：WO2004079823A3

公开(公告)日：2004-12-29

申请号：PCT/US2004003817

申请日：2004-02-09

Applicant: INTEL CORP

Inventor： MALLIK DEBENDRA ,  SANKMAN BOB

IPC: H01L23/13 ,  H01L23/36 ,  H01L23/40 ,  H01L23/498 ,  H01L25/065 ,  H01L23/14 ,  H01L23/34

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/49816 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H05K1/182 ,  H05K2201/09054 ,  H05K2201/1056 ,  H05K2201/10734 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method and apparatus for making a package having improved heat conduction characteristics and high frequency response. A relatively thick package substrate, such as copper, has a wiring layer bonded to one face, leaving the opposite face exposed, for example, to be a surface for connection to a heat sink. One ore more chips are bonded to the wiring layer, and an array of connectors, such as solder balls are provided around the periphery of the chip(s) for connection to a printed circuit board. In some embodiments, the printed circuit board has a hole that the chip(s) extend into to allow smaller external-connection solder balls. In some embodiments, a second heat sink is connected to the back of the chip through the PCB hole.

公开(公告)号：WO99014806A1

公开(公告)日：1999-03-25

申请号：PCT/DE1998/002678

申请日：1998-09-10

IPC: H01L23/14 ,  H01L23/15 ,  H01L23/373 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05

CPC classification number: H05K1/0203 ,  H01L23/15 ,  H01L23/3733 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/053 ,  H05K2201/0116 ,  H05K2201/09745 ,  H05K2201/1056 ,  Y10T428/24479 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a carrier plate (2) for micro-hybrid circuits (7) with a ceramic body (3). According to the invention, the ceramic body (3) is porous and the cavities of said body are filled in with aluminum. A very good thermal binding of the micro hybrid circuits (7) onto the carrier plate (2) is possible due to the relatively small variances in the thermal recess coefficients of the carrier plate (2) and micro-hybrid circuit (7).

Abstract translation: 本发明涉及一种承载板（2）（7）具有一个陶瓷体微混合电路（3）。 根据本发明，提供的是在陶瓷体（3）是多孔质体，其空腔中填充有铝。 由于在载体板（2）和微混合电路（7）微混合电路（7）的所述支撑板（2）是可能的非常良好的热连接的热膨胀系数的相对小的差异。

公开(公告)号：EP3329750A1

公开(公告)日：2018-06-06

申请号：EP16831404.5

申请日：2016-07-29

Applicant: Laird Technologies, Inc.

Inventor： SONG, John ,  DIXON, Paul Francis

IPC: H05K1/02

CPC classification number: H05K1/0236 ,  H01Q15/0026 ,  H01Q17/007 ,  H05K1/0203 ,  H05K1/0272 ,  H05K3/284 ,  H05K2201/09681 ,  H05K2201/1056

Abstract: According to various aspects, exemplary embodiments include one or more frequency selective structures (e.g., two-dimensional or three-dimensional frequency selective structure or surface, etc.), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.

公开(公告)号：EP2782133A3

公开(公告)日：2014-11-26

申请号：EP13195878.7

申请日：2013-12-05

Applicant: FUJITSU LIMITED

Inventor： Masuda, Satoshi

IPC: H01L23/66 ,  H01L25/16 ,  H01L23/047 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K7/026 ,  H01L23/045 ,  H01L23/047 ,  H01L23/3677 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/06181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19107 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K3/4697 ,  H05K7/20509 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2224/45099

Abstract: A high-frequency module includes a lower base member having a recess part formed in an upper face thereof, and having a base metal part formed on a lower face thereof that is to be grounded, an upper substrate disposed inside the recess part of the lower base member, a semiconductor device mounted on an upper face of the upper substrate, a first ground line connected to the semiconductor device and formed on the upper substrate, and a ground metal part connected to the base metal part and disposed in the lower base member, wherein the ground metal part is connected to the first ground line on the upper substrate.

公开(公告)号：EP2043416B1

公开(公告)日：2013-10-16

申请号：EP08014302.7

申请日：2008-08-11

Applicant: Hitachi, Ltd.

Inventor： Tsuyuno, Nobutake ,  Yoshinari, Hideto ,  Hozoji, Hiroshi ,  Asano, Masahiko ,  Harada, Masahide ,  Kawakita, Shinya

IPC: H05K7/20

CPC classification number: H05K7/20454 ,  H05K1/0203 ,  H05K1/141 ,  H05K7/20854 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/1056 ,  Y10T29/49147