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1.发明申请CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VERTICAL STIFFNESS CONTROL METHOD 审中-公开电子基板可靠堆叠构造 - 纵向硬度控制方法
公开(公告)号：WO2009092677A2
公开(公告)日：2009-07-30
申请号：PCT/EP2009050524
申请日：2009-01-19
Applicant: IBM , IBM UK , KACKER KARAN , POWELL DOUGLAS OLIVER , QUESTAD DAVID , RUSSELL DAVID JOHN , SRI-JAYANTHA SRI
Inventor： KACKER KARAN , POWELL DOUGLAS OLIVER , QUESTAD DAVID , RUSSELL DAVID JOHN , SRI-JAYANTHA SRI
IPC: H01L23/498
CPC classification number: H01L23/49827 , H01L23/49838 , H01L2224/05001 , H01L2224/05548 , H01L2224/05572 , H01L2224/16 , H01L2924/00014 , H01L2924/15311 , H05K1/0271 , H05K1/116 , H05K3/4602 , H05K2201/0347 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/0969 , Y10T29/49155 , H01L2224/05599 , H01L2224/05099
Abstract: A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a plated through hole landing supporting the plurality of stacked vias. The plated through hole landing includes a compliant center zone; and spring-like stiffness-reducing connectors for connecting the compliant center zone of the plated through hole landing.
Abstract translation: 用于减小垂直刚度的堆叠通孔结构包括：多个堆叠的通孔，每个通孔设置在盘状结构上。 盘状结构包括支撑多个堆叠通孔的电镀通孔着落。 电镀通孔着色包括顺应中心区; 以及用于连接电镀通孔底板的顺应中心区域的弹簧状刚度减小连接器。
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2.发明申请EMBEDDED CONSTRAINER DISCS FOR RELIABLE STACKED VIAS IN ELECTRONIC SUBSTRATES 审中-公开用于电子基板中的可靠堆叠VIAS的嵌入式限制器盘
公开(公告)号：WO2009124785A1
公开(公告)日：2009-10-15
申请号：PCT/EP2009/050585
申请日：2009-01-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , SRI-JAYANTHA, Sri , RUSSELL, David, John , KACKER, Karan , QUESTAD, David , POWELL, Douglas, Oliver
Inventor： SRI-JAYANTHA, Sri , RUSSELL, David, John , KACKER, Karan , QUESTAD, David , POWELL, Douglas, Oliver
IPC: H01L23/498
CPC classification number: H01L23/49827 , H01L23/49822 , H01L2224/05001 , H01L2224/05008 , H01L2224/05572 , H01L2224/16 , H01L2224/16235 , H01L2924/10253 , H01L2924/15311
Abstract: A substrate via structure for stacked vias includes: a plurality of stacked vias, wherein each via is disposed on a landing; and at least one constrainer disc surrounding at least one via, for constraining in-plane deformation of the substrate via structure. The constrainer disc is embedded such that the constrainer disc is disposed between two layers of resin. The constrainer discs may be made of copper. The constrainer disc may be circular or square-shaped. Preferably there is a dielectric gap between the constrainer disc and the via.
Abstract translation: 用于堆叠通孔的衬底通孔结构包括：多个堆叠的通孔，其中每个通孔设置在层站上; 以及围绕至少一个通孔的至少一个约束盘，用于限制基板经由结构的平面内变形。 约束盘被嵌入，使得约束盘设置在两层树脂之间。 约束盘可以由铜制成。 约束盘可以是圆形或正方形。 优选地，在约束盘和通孔之间存在电介质间隙。
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Patent Agency Ranking3.发明申请
公开(公告)号：WO2009092677A3
公开(公告)日：2009-07-30
申请号：PCT/EP2009/050524
申请日：2009-01-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , KACKER, Karan , POWELL, Douglas, Oliver , QUESTAD, David , RUSSELL, David, John , SRI-JAYANTHA, Sri
Inventor： KACKER, Karan , POWELL, Douglas, Oliver , QUESTAD, David , RUSSELL, David, John , SRI-JAYANTHA, Sri
IPC: H01L23/498
Abstract: A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a plated through hole landing supporting the plurality of stacked vias. The plated through hole landing includes a compliant center zone; and spring-like stiffness-reducing connectors for connecting the compliant center zone of the plated through hole landing.
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4.发明申请METHOD OF OPTIMIZING SERVO CONTROLLER POWER IN TWO-DIMENSIONAL FLEXURE MEMS STORAGE DEVICES 审中-公开二维柔性MEMS储存装置优化伺服控制器功率的方法
公开(公告)号：WO2007092327A3
公开(公告)日：2008-04-24
申请号：PCT/US2007002928
申请日：2007-02-01
Applicant: IBM , DANG HIEN P , SRI-JAYANTHA SRI M
Inventor： DANG HIEN P , SRI-JAYANTHA SRI M
IPC: G05B19/33
CPC classification number: G02B26/085 , B82Y10/00 , G02B26/101 , G11B9/1454 , G11B9/1481
Abstract: A method of optimizing a servo controller power required in the operation of twodimensional flexure (Microelectronic Memory Storage) MEMS devices. Furthermore, provided is an arrangement for optimizing servo controller power in a two-dimensional flexure MEMS storage device through a utilization of the inventive method.
Abstract translation: 一种优化二维弯曲（微电子存储器）MEMS器件操作所需的伺服控制器功率的方法。 此外，提供了一种通过利用本发明的方法来优化二维挠曲MEMS存储装置中的伺服控制器功率的装置。
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5.发明申请METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT 审中-公开用于实时估算和预测微处理器单元热状态的方法和系统
公开(公告)号：WO2006008215A2
公开(公告)日：2006-01-26
申请号：PCT/EP2005/052768
申请日：2005-06-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION , COMPAGNIE IBM France , SRI-JAYANTHA, Sri M. , DANG, Hien P. , SHARMA, Arun
Inventor： SRI-JAYANTHA, Sri M. , DANG, Hien P. , SHARMA, Arun
IPC: G06F1/20
CPC classification number: G06F1/206
Abstract: A method (and system) of predicting a thermal state of a transient thermal system, includes combining sensor outputs and thermal parameters to construct a consistent set of estimates of internal temperature of a transient thermal system.
Abstract translation: 预测瞬态热系统的热状态的方法（和系统）包括组合传感器输出和热参数以构成瞬态热系统内部温度的一致性估计集合。
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6.发明申请METHOD OF OPTIMIZING SERVO CONTROLLER POWER IN TWO-DIMENSIONAL FLEXURE MEMS STORAGE DEVICES 审中-公开二维柔性MEMS储存装置优化伺服控制器功率的方法
公开(公告)号：WO2007092327A2
公开(公告)日：2007-08-16
申请号：PCT/US2007/002928
申请日：2007-02-01
Inventor： DANG, Hien, P. , SRI-JAYANTHA, Sri, M.
CPC classification number: G02B26/085 , B82Y10/00 , G02B26/101 , G11B9/1454 , G11B9/1481
Abstract: A method of optimizing a servo controller power required in the operation of twodimensional flexure (Microelectronic Memory Storage) MEMS devices. Furthermore, provided is an arrangement for optimizing servo controller power in a two-dimensional flexure MEMS storage device through a utilization of the inventive method.
Abstract translation: 一种优化二维弯曲（微电子存储器）MEMS器件操作所需的伺服控制器功率的方法。 此外，提供了一种通过利用本发明的方法来优化二维挠曲MEMS存储装置中的伺服控制器功率的装置。
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7.发明申请METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT 审中-公开用于微处理器单元的热状态的实时估计和预测的方法和系统
公开(公告)号：WO2006008215A3
公开(公告)日：2006-06-08
申请号：PCT/EP2005052768
申请日：2005-06-15
Applicant: IBM , IBM FRANCE , SRI-JAYANTHA SRI M , DANG HIEN P , SHARMA ARUN
Inventor： SRI-JAYANTHA SRI M , DANG HIEN P , SHARMA ARUN
IPC: G06F1/20
CPC classification number: G06F1/206
Abstract: A method (and system) of predicting a thermal state of a transient thermal system, includes combining sensor outputs and thermal parameters to construct a consistent set of estimates of internal temperature of a transient thermal system.
Abstract translation: 预测瞬态热系统的热状态的方法（和系统）包括组合传感器输出和热参数以构建瞬态热系统的内部温度的一致估计集合。
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