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公开(公告)号：KR1020120019075A
公开(公告)日：2012-03-06
申请号：KR1020100082194
申请日：2010-08-24
Abstract: PURPOSE: A cutting device is provided to cut a substrate without damaging a film and reduce the time to cut the substrate. CONSTITUTION: A cutting device comprises an image capturing unit(2), a control unit(3), and a cutting unit(4). The image capturing unit takes images of the given area of substrate-based composite including a film and a substrate attached to the film. The control unit analyzes the images and detects the position of the substrate in the substrate-based composite. The cutting unit cuts only the substrate under control by the control unit. The image capture unit comprises an aligning unit(21) and a vision unit(22). The aligning unit aligns the substrate-based composite. The vision unit takes the images of the substrate-based composite aligned.
Abstract translation: 目的：提供切割装置以切割基材而不损坏胶片并减少切割基材的时间。 构成：切割装置包括图像捕获单元（2），控制单元（3）和切割单元（4）。 图像拍摄单元拍摄包含胶片和附着在胶片上的基板的基板复合体的给定区域的图像。 控制单元分析图像并检测基板复合体中基板的位置。 切割单元仅在控制单元的控制下切割基板。 图像捕获单元包括对准单元（21）和视觉单元（22）。 对齐单元对准基板基复合材料。 视觉单元拍摄基于基底的复合材料的图像。
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公开(公告)号：KR1020120013016A
公开(公告)日：2012-02-14
申请号：KR1020100075133
申请日：2010-08-04
Applicant: (주)큐엠씨
Abstract: PURPOSE: An operation panel assembly is provided to freely change a direction of an operation panel by checking the inside of a device through simple manipulation without opening a door. CONSTITUTION: A door(20) opens and closes the inside of a device(10). An opening(21) is formed in a center of the door. A terminal device for operating the device is formed in the front side of an operation panel(30). One end of the door is connected to the device and a hinge(11) to be rotated. A door handle(22) is formed in the other end of the door. The operation panel is connected to the door with an upper rotation axis and a lower rotation axis at a top and lower part of the opening. A tubular shaped first rotary shaft is fixed to the door on the top of the opening. A tubular shaped second rotary shaft is fixed to an upper center of the operation panel.
Abstract translation: 目的：提供操作面板组件，以通过简单的操作检查设备的内部而无需打开门来自由地改变操作面板的方向。 构成：门（20）打开和关闭设备（10）的内部。 在门的中心形成开口（21）。 用于操作装置的终端装置形成在操作面板（30）的前侧。 门的一端连接到设备和铰链（11）以旋转。 在门的另一端形成门把手（22）。 操作面板在开口的顶部和下部具有上旋转轴和下旋转轴连接到门。 管状第一旋转轴固定在开口顶部的门上。 管状的第二旋转轴固定在操作面板的上部中心。
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公开(公告)号：KR1020120017527A
公开(公告)日：2012-02-29
申请号：KR1020100080154
申请日：2010-08-19
IPC: B23K26/70 , B23K26/04 , B23K26/042
Abstract: PURPOSE: A laser processing apparatus and a control method thereof which can minimize errors due to the unnecessary use of equipment are provided to minimize the energy intensity loss of a laser beam by selectively using an inspection member according to needs. CONSTITUTION: A laser processing apparatus comprises a laser beam source(10), an optical unit(30), a stage(60), and a detecting unit. The optical unit processes the laser beam emitted from the laser beam source . The stage supports a workpiece(65) on which the laser beam penetrating through the optical unit is irradiated The detecting unit is arranged between the optical unit and the stage. The detecting unit selectively detects the laser beam passing through the optical unit according to needs.
Abstract translation: 目的：提供一种激光加工装置及其控制方法，其能够最小化由于不必要的设备使用造成的误差，以通过根据需要选择性地使用检查部件来最小化激光束的能量强度损失。 构成：激光加工装置包括激光束源（10），光学单元（30），平台（60）和检测单元。 光学单元处理从激光束源发射的激光束。 舞台支撑着穿过光学单元的激光束照射的工件（65）。检测单元布置在光学单元和舞台之间。 检测单元根据需要选择性地检测通过光学单元的激光束。
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公开(公告)号：KR101262859B1
公开(公告)日：2013-05-09
申请号：KR1020100074628
申请日：2010-08-02
IPC: B23K26/073 , G02B26/00 , G02B27/09
Abstract: 본발명은레이저빔을생성하는레이저광원; 상기레이저빔의발산각을교정하는빔 정형모듈(beam shaping module); 교정된상기레이저빔을대상물의내부에집광하여스폿을형성하는집광렌즈(focusing Lens); 및상기레이저광원, 상기빔 정형모듈및 상기집광렌즈와연결되어이들을제어하는제어부를포함하며, 상기빔 정형모듈은복수의전환식렌즈군(群)을포함하는것을특징으로하는레이저를이용한대상물가공장치를제공한다.
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Patent Agency Ranking
公开(公告)号：KR1020120016931A
公开(公告)日：2012-02-27
申请号：KR1020100079469
申请日：2010-08-17
Applicant: (주)큐엠씨
IPC: H01L21/68
Abstract: PURPOSE: An apparatus and a method for processing a substrate are provided to improve a processing efficiency by reducing a time requiring for processing a substrate by processing a target area in a detected substrate. CONSTITUTION: An align unit(20) aligns a substrate to determine the position thereof. The align unit comprises a plurality of support members supporting the both sides of the substrate and also includes a transport unit. The transport unit transfers the support members to be close to each other or separated from each other. A support member(211) pressing the both sides of the substrate is formed in the support member. A detecting unit(30) detects the location of a target region of the substrate. A processing unit processes the target region which is detected by the detection unit.
Abstract translation: 目的：提供一种用于处理衬底的装置和方法，以通过减少通过处理检测到的衬底中的目标区域来处理衬底的时间来提高处理效率。 构成：对准单元（20）对准衬底以确定其位置。 对准单元包括支撑基板的两侧的多个支撑构件，并且还包括输送单元。 传送单元将支撑构件彼此靠近或相互分离。 在支撑构件上形成有压靠基板两侧的支撑构件（211）。 检测单元（30）检测基板的目标区域的位置。 处理单元处理由检测单元检测到的目标区域。
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公开(公告)号：KR101261266B1
公开(公告)日：2013-05-09
申请号：KR1020100108527
申请日：2010-11-03
IPC: B23K26/38 , B23K26/70 , H01L21/301
Abstract: 레이저를사용하여소재를가공하는레이저가공장치및 이를이용한레이저가공방법에관한것으로, 보다상세하게는공정시간을단축시켜생산성을향상시킬수 있는레이저가공장치및 이를이용한레이저가공방법에관하여개시한다. 본발명은상술한바와같은레이저가공장치를이용한레이저가공방법에있어서, 피더가카세트리프터에장착된웨이퍼카세트에서웨이퍼를인출하여웨이퍼얼라이너로이송하는웨이퍼인출단계; 웨이퍼얼라이너가웨이퍼의양측면을가압하여웨이퍼를정렬시키고, 에지디텍터가작동하여웨이퍼에고정된웨이퍼의외곽형상이미지를검출하는웨이퍼정렬및 에지디텍팅단계; 트랜스퍼암이작동하여에지디텍팅이완료된웨이퍼를워크스테이지로이송하는웨이퍼로딩단계; 및워크스테이지와레이저가공부가동작하여웨이퍼를가공하는웨이퍼가공단계;를포함하는레이저가공방법을제공한다.
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公开(公告)号：KR101200708B1
公开(公告)日：2012-11-20
申请号：KR1020100080154
申请日：2010-08-19
IPC: B23K26/70 , B23K26/04 , B23K26/042
Abstract: 본 발명은 레이저빔 광원; 상기 레이저빔 광원으로부터 방출된 레이저빔을 가공하기 위한 광학유닛; 상기 광학유닛을 통과한 레이저빔이 조사되는 가공대상물을 지지하는 스테이지; 및 상기 광학유닛과 상기 스테이지 사이에 배치되어 상기 광학유닛을 통과한 레이저빔의 일부를 필요에 따라 선택적으로 검출하는 검출유닛을 포함하는 것을 특징으로 하는 레이저 가공장치를 포함한 것을 특징으로 한다. 이에,
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公开(公告)号：KR1020120046957A
公开(公告)日：2012-05-11
申请号：KR1020100108527
申请日：2010-11-03
IPC: B23K26/38 , B23K26/70 , H01L21/301
Abstract: PURPOSE: A laser processing apparatus and method are provided to discharge a completed wafer and lead in the next wafer to be processed while processing a wafer. CONSTITUTION: A laser processing apparatus comprises a cassette lifter, a wafer aligner, an edge detector, a feeder, a work stage(140), a transfer arm, and a laser processing unit. The wafer aligner is formed on the exit side of the cassette lifter. The edge detector detects the outline of a wafer located in the wafer aligner. The feeder lifts a wafer by reciprocating between the cassette lifter and the wafer aligner. The work stage implements three-axis transfer and a z-axis rotation. The transfer arm exchanges wafers placed on the wafer aligner and the work stage. The laser processing unit provides processing laser beams to the work stage.
Abstract translation: 目的：提供一种激光加工设备和方法，以便在处理晶片时，将完成的晶片放电并在待处理的下一晶片中引出。 构成：激光加工装置包括盒式升降机，晶片对准器，边缘检测器，进料器，工作台（140），传送臂和激光处理单元。 晶片对准器形成在盒式升降机的出口侧。 边缘检测器检测位于晶片对准器中的晶片的轮廓。 进料器通过在盒式升降器和晶片对准器之间往复运动来提升晶片。 工作台实现三轴转动和z轴旋转。 转移臂交换放置在晶片对准器和工作台上的晶片。 激光处理单元向工作台提供加工激光束。
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公开(公告)号：KR1020120012590A
公开(公告)日：2012-02-10
申请号：KR1020100074628
申请日：2010-08-02
IPC: B23K26/073 , G02B26/00 , G02B27/09
Abstract: PURPOSE: A processing device using laser is provided to precisely control the position and shape of spot in a substrate by selecting and switching a right group of lens depending on a processing condition. CONSTITUTION: A processing device(1) using laser comprises a laser source(10), a beam shaping module(20), focusing lens(30), and a control unit(50). The laser source generates laser beams. The beam shaping module corrects the divergent angle of the laser beam. The focusing lens collect the laser beam corrected in a target to form spot. The control unit controls the laser source, the beam shaping module, and the focusing lens. The beam shaping module comprises a plurality of switchable groups of lens.
Abstract translation: 目的：提供使用激光的处理装置，通过根据处理条件选择和切换右组透镜来精确地控制基板中的光斑的位置和形状。 构成：使用激光的处理装置（1）包括激光源（10），光束整形模块（20），聚焦透镜（30）和控制单元（50）。 激光源产生激光束。 光束整形模块校正激光束的发散角。 聚焦透镜收集在目标物体中校正的激光束以形成光点。 控制单元控制激光源，光束整形模块和聚焦透镜。 光束整形模块包括多个可切换的透镜组。
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