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公开(公告)号：WO2011099708A2
公开(公告)日：2011-08-18
申请号：PCT/KR2011/000559
申请日：2011-01-27
CPC classification number: G01R31/2887
Abstract: 본 발명은 회전 및 승강 모션의 동시 조절을 위한 단일 구동부를 구비한 회전장치에 관한 것으로, 회전 중심으로부터 외측으로 연장된 지지 프레임과, 지지프레임의 끝단에서 피검사체를 안착시키는 안착부재를 포함하는 검사테이블과, 전기적 신호를 인가 받아 회전력을 생성하는 구동부와, 검사테이블의 회전 중심 하부에 연결되어, 구동부로부터 회전력을 도입 받아 검사테이블의 단속적인 회전 및 승강 모션으로 변환하는 전동부재를 포함한다.
Abstract translation: 旋转装置技术领域本发明涉及具有用于同时调节旋转和升降运动的单个驱动部件的旋转装置，该旋转装置包括从旋转中心向外延伸的支撑框架， 控制单元连接到检查台的旋转中心的下部并且适于接收来自驱动单元的旋转力以将检查台转换成检查台的间歇旋转和升降运动， 。
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公开(公告)号：KR1020140059874A
公开(公告)日：2014-05-19
申请号：KR1020120125411
申请日：2012-11-07
Applicant: (주)큐엠씨
Abstract: The present invention relates to an electronic component inspection and classification device for classifying electronic components by characteristic after inspecting the electronic components. The electronic component classification device according to an embodiment quickly and accurately performs a task of classifying the electronic components by classifying the electronic components into groups in a lump.
Abstract translation: 本发明涉及一种电子部件检查和分类装置，用于在检查电子部件之后通过特性对电子部件进行分类。 根据实施例的电子部件分类装置通过将电子部件分组成一组而快速且准确地执行对电子部件进行分类的任务。
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公开(公告)号：KR1020120019075A
公开(公告)日：2012-03-06
申请号：KR1020100082194
申请日：2010-08-24
Abstract: PURPOSE: A cutting device is provided to cut a substrate without damaging a film and reduce the time to cut the substrate. CONSTITUTION: A cutting device comprises an image capturing unit(2), a control unit(3), and a cutting unit(4). The image capturing unit takes images of the given area of substrate-based composite including a film and a substrate attached to the film. The control unit analyzes the images and detects the position of the substrate in the substrate-based composite. The cutting unit cuts only the substrate under control by the control unit. The image capture unit comprises an aligning unit(21) and a vision unit(22). The aligning unit aligns the substrate-based composite. The vision unit takes the images of the substrate-based composite aligned.
Abstract translation: 目的：提供切割装置以切割基材而不损坏胶片并减少切割基材的时间。 构成：切割装置包括图像捕获单元（2），控制单元（3）和切割单元（4）。 图像拍摄单元拍摄包含胶片和附着在胶片上的基板的基板复合体的给定区域的图像。 控制单元分析图像并检测基板复合体中基板的位置。 切割单元仅在控制单元的控制下切割基板。 图像捕获单元包括对准单元（21）和视觉单元（22）。 对齐单元对准基板基复合材料。 视觉单元拍摄基于基底的复合材料的图像。
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公开(公告)号：KR101011797B1
公开(公告)日：2011-02-07
申请号：KR1020100059449
申请日：2010-06-23
Applicant: (주)큐엠씨
Abstract: PURPOSE: An electronic device classifying apparatus is provided to prevent the mixture during the process of classifying the electronic component. CONSTITUTION: A loading module(100) receives the electric component from the outside. A container module(200) is opened on a surface which crosses the horizontal surface. The container module comprises an inflow hole of the electronic component, a discharging hole, and a connecting path connecting the inflow hole and the discharging hole.
Abstract translation: 目的：提供一种电子设备分类装置，用于在电子部件分类过程中防止混合物。 构成：装载模块（100）从外部接收电气部件。 容器模块（200）在与水平面交叉的表面上开口。 容器模块包括电子部件的流入孔，排出孔和连接流入孔和排出孔的连接路径。
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公开(公告)号：KR100984727B1
公开(公告)日：2010-10-01
申请号：KR1020100041077
申请日：2010-04-30
IPC: B23K26/382 , B23K26/08
CPC classification number: C03B33/091 , B23K26/0006 , B23K26/0057 , B23K26/0624 , B23K26/0648 , B23K26/0736 , B23K26/0853 , B23K26/0869 , B23K2201/40 , B23K2203/56 , C03B33/0222
Abstract: PURPOSE: An object processing method and an object processing device, which prevents the production of an amorphous region on a surface of a substrate, are provided to control the energy density of optical density profile of a laser beam which is formed inside a substrate by correcting the divergence angle of the laser intrinsic. CONSTITUTION: An object processing method comprises next steps. Laser beam is produced from a laser light source(300). A divergence angle of laser beam is corrected. The corrected laser beam is focused on objects(200) to form a spot. The shape or size of the spot is controlled with the divergence angle correction of the laser beam. A phase transformation domain is formed inside an object by the spot.
Abstract translation: 目的：提供一种防止在基板表面上产生非晶区域的物体处理方法和物体处理装置，以通过校正来控制形成在基板内的激光束的光密度分布的能量密度 激光固有的发散角。 构成：对象处理方法包括后续步骤。 激光束由激光光源（300）产生。 校正激光束的发散角。 校正的激光束聚焦在物体（200）上以形成点。 通过激光束的发散角校正来控制斑点的形状或尺寸。 在物体内由点形成相变域。
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Patent Agency Ranking
公开(公告)号：KR100979763B1
公开(公告)日：2010-09-02
申请号：KR1020100026608
申请日：2010-03-25
Abstract: PURPOSE: An object classifying unit according the characteristics of a semiconductor chip and an LED chip is provided to rapidly and accurately measure the property of an object. CONSTITUTION: A supply unit(110) provides a target member in which an object is integrated. A test unit(130) measure the property of the object while the object is rested on the target member. A sorting unit(150) classifies the object according to the measurement result of the objects. The test unit is vertical to the sorting unit while the supply unit moves up and down between the test unit and sorting unit.
Abstract translation: 目的：提供根据半导体芯片和LED芯片的特性的物体分类单元，以快速且准确地测量物体的性质。 构成：供应单元（110）提供其中对象被集成在其中的目标构件。 测试单元（130）在物体搁置在目标构件上时测量对象的属性。 分类单元（150）根据对象的测量结果对对象进行分类。 测试单元垂直于分拣单元，供电单元在测试单元和分拣单元之间上下移动。
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公开(公告)号：KR1020160033439A
公开(公告)日：2016-03-28
申请号：KR1020140124321
申请日：2014-09-18
Applicant: (주)큐엠씨
CPC classification number: B08B5/04 , B05B12/122 , B05C5/02 , B05D1/02 , B08B5/02
Abstract: 도우징장치가개시되며, 본도우징장치는공정용액을분사하는도우징부및 노즐부에맺히는공정용액을제거하는용액클리닝부를포함하되, 상기도우징부는공정용액이저장되는공정용액저장부; 상기공정용액저장부에연결되어, 상기공정용액을노즐부로공급하는용액공급부; 상기용액공급부로부터공급받은공정용액을분사구를통해외부로분사하는노즐부; 및상기분사구를개폐하기위해상하방향으로승강하는태핏을포함하고, 상기용액클리닝부는상기분사구를향하여공기를분사하는공기분사부; 및상기공기분사부에의해상기분사구에서분리되는공정용액을흡입하는용액흡입부를포함한다.
Abstract translation: 公开了一种计量装置。 配量装置包括：喷射处理溶液的定量给料单元和消除在喷嘴单元中形成的处理液的溶液清洗单元。 所述计量单元包括：存储所述处理溶液的处理溶液存储单元; 连接到处理溶液存储单元以将处理溶液供应到喷嘴单元的溶液供应单元; 所述喷嘴单元通过喷孔将从所述溶液供给单元供给的处理液喷射到外部; 并且竖直地升高以打开或关闭喷孔的挺杆。 所述溶液清洗单元包括：空气喷射单元，其向所述喷射孔喷射空气; 以及通过空气喷射单元吸附与喷射孔分离的处理溶液的溶液吸取单元。
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公开(公告)号：KR1020150007469A
公开(公告)日：2015-01-21
申请号：KR1020130081423
申请日：2013-07-11
Applicant: (주)큐엠씨
CPC classification number: H01L2224/48091 , H01L2924/181 , H01L33/502 , H01L33/56 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
Abstract: 실시예에 따른 발광소자 제조방법 및 장비는, 패키지에 추가할 합성수지(발광물질이 포함된 합성수지)의 양을 산출하고, 산출된 양의 합성수지를 추가 주입하여 색좌표를 보정한 후, 합성수지의 발광물질을 침전시키므로 목표하는 색좌표를 만족하는 발광소자를 고수율로 제조할 수 있다.
Abstract translation: 根据本发明的实施方式的发光装置的制造方法和设备，由于计算添加到包装中的合成树脂的量，并且将合成树脂的计算量另外注入 正确的颜色坐标，并且合成树脂的发光材料沉淀。 因此，可以高产率地制造满足目标色坐标的发光装置。
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公开(公告)号：KR1020140056420A
公开(公告)日：2014-05-12
申请号：KR1020120118857
申请日：2012-10-25
Applicant: (주)큐엠씨
IPC: H01L21/78 , H01L21/301 , H01L21/02 , H01L33/00
Abstract: Disclosed is a chip fixing apparatus for preventing the deviation of a chip divided by a chip package process. The chip fixing apparatus includes a cover part which has a cover which covers the upper part of the chip package and at least one column member which protrudes from the cover to the lower part and touches the chip package; and a pusher which applies a push pressure to the cover.
Abstract translation: 公开了一种芯片定影装置，用于防止由芯片封装处理所划分的芯片偏离。 芯片固定装置包括盖部，盖部覆盖芯片封装体的上部，至少一个列部件从盖部向下部突出并与芯片封装接触; 以及对盖施加推压的推动器。
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公开(公告)号：KR101261266B1
公开(公告)日：2013-05-09
申请号：KR1020100108527
申请日：2010-11-03
IPC: B23K26/38 , B23K26/70 , H01L21/301
Abstract: 레이저를사용하여소재를가공하는레이저가공장치및 이를이용한레이저가공방법에관한것으로, 보다상세하게는공정시간을단축시켜생산성을향상시킬수 있는레이저가공장치및 이를이용한레이저가공방법에관하여개시한다. 본발명은상술한바와같은레이저가공장치를이용한레이저가공방법에있어서, 피더가카세트리프터에장착된웨이퍼카세트에서웨이퍼를인출하여웨이퍼얼라이너로이송하는웨이퍼인출단계; 웨이퍼얼라이너가웨이퍼의양측면을가압하여웨이퍼를정렬시키고, 에지디텍터가작동하여웨이퍼에고정된웨이퍼의외곽형상이미지를검출하는웨이퍼정렬및 에지디텍팅단계; 트랜스퍼암이작동하여에지디텍팅이완료된웨이퍼를워크스테이지로이송하는웨이퍼로딩단계; 및워크스테이지와레이저가공부가동작하여웨이퍼를가공하는웨이퍼가공단계;를포함하는레이저가공방법을제공한다.
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