公开(公告)号：KR1020120019075A

公开(公告)日：2012-03-06

申请号：KR1020100082194

申请日：2010-08-24

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소 ,  정홍진 ,  이병식 ,  김범중 ,  장현삼 ,  김학용 ,  곽종호 ,  김영용 ,  홍선영

IPC: B23K26/38 ,  B23K26/60 ,  B23K26/08 ,  G01B11/00

Abstract: PURPOSE: A cutting device is provided to cut a substrate without damaging a film and reduce the time to cut the substrate. CONSTITUTION: A cutting device comprises an image capturing unit(2), a control unit(3), and a cutting unit(4). The image capturing unit takes images of the given area of substrate-based composite including a film and a substrate attached to the film. The control unit analyzes the images and detects the position of the substrate in the substrate-based composite. The cutting unit cuts only the substrate under control by the control unit. The image capture unit comprises an aligning unit(21) and a vision unit(22). The aligning unit aligns the substrate-based composite. The vision unit takes the images of the substrate-based composite aligned.

Abstract translation: 目的：提供切割装置以切割基材而不损坏胶片并减少切割基材的时间。 构成：切割装置包括图像捕获单元（2），控制单元（3）和切割单元（4）。 图像拍摄单元拍摄包含胶片和附着在胶片上的基板的基板复合体的给定区域的图像。 控制单元分析图像并检测基板复合体中基板的位置。 切割单元仅在控制单元的控制下切割基板。 图像捕获单元包括对准单元（21）和视觉单元（22）。 对齐单元对准基板基复合材料。 视觉单元拍摄基于基底的复合材料的图像。

公开(公告)号：KR1020120016931A

公开(公告)日：2012-02-27

申请号：KR1020100079469

申请日：2010-08-17

Applicant: (주)큐엠씨

Inventor： 유병소 ,  정홍진 ,  이병식 ,  김범중 ,  장현삼 ,  김학용 ,  곽종호 ,  김영용 ,  홍선영

IPC: H01L21/68

Abstract: PURPOSE: An apparatus and a method for processing a substrate are provided to improve a processing efficiency by reducing a time requiring for processing a substrate by processing a target area in a detected substrate. CONSTITUTION: An align unit(20) aligns a substrate to determine the position thereof. The align unit comprises a plurality of support members supporting the both sides of the substrate and also includes a transport unit. The transport unit transfers the support members to be close to each other or separated from each other. A support member(211) pressing the both sides of the substrate is formed in the support member. A detecting unit(30) detects the location of a target region of the substrate. A processing unit processes the target region which is detected by the detection unit.

Abstract translation: 目的：提供一种用于处理衬底的装置和方法，以通过减少通过处理检测到的衬底中的目标区域来处理衬底的时间来提高处理效率。 构成：对准单元（20）对准衬底以确定其位置。 对准单元包括支撑基板的两侧的多个支撑构件，并且还包括输送单元。 传送单元将支撑构件彼此靠近或相互分离。 在支撑构件上形成有压靠基板两侧的支撑构件（211）。 检测单元（30）检测基板的目标区域的位置。 处理单元处理由检测单元检测到的目标区域。