公开(公告)号：KR1020140056420A

公开(公告)日：2014-05-12

申请号：KR1020120118857

申请日：2012-10-25

Applicant: (주)큐엠씨

Inventor： 김정식 ,  송성호 ,  오효영 ,  정유석 ,  유병소 ,  장현삼 ,  이형권

IPC: H01L21/78 ,  H01L21/301 ,  H01L21/02 ,  H01L33/00

Abstract: Disclosed is a chip fixing apparatus for preventing the deviation of a chip divided by a chip package process. The chip fixing apparatus includes a cover part which has a cover which covers the upper part of the chip package and at least one column member which protrudes from the cover to the lower part and touches the chip package; and a pusher which applies a push pressure to the cover.

Abstract translation: 公开了一种芯片定影装置，用于防止由芯片封装处理所划分的芯片偏离。 芯片固定装置包括盖部，盖部覆盖芯片封装体的上部，至少一个列部件从盖部向下部突出并与芯片封装接触; 以及对盖施加推压的推动器。

公开(公告)号：KR102169923B1

公开(公告)日：2020-10-26

申请号：KR1020140011200

申请日：2014-01-29

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소 ,  장현삼 ,  이병식 ,  정홍진 ,  이형권 ,  김종수 ,  김정식 ,  정유석

IPC: H01L33/48 ,  H01L21/52 ,  H01L25/075

公开(公告)号：KR1020140031516A

公开(公告)日：2014-03-13

申请号：KR1020120097263

申请日：2012-09-03

Applicant: (주)큐엠씨

Inventor： 김정식 ,  송성호 ,  오효영 ,  정유석 ,  유병소 ,  장현삼 ,  이형권

IPC: H01L21/78 ,  H01L21/301 ,  H01L33/48

CPC classification number: H01L33/58 ,  H01L21/78 ,  H01L2933/0058

Abstract: A method for processing a chip package is disclosed. The method for processing a chip package comprises the steps of: (a) forming a release material layer on the bottom surface of a substrate part having a plurality of chips to be installed on a substrate; (b) processing a lens part on the top surface of the substrate part ; and (c) fully cutting the substrate using a laser beam. [Reference numerals] (AA) Start; (BB) End; (S100) Step of forming a release material layer on the bottom surface of a substrate part; (S200) Step of processing a lens part on the top surface of the substrate part; (S300) Step of processing the substrate part

Abstract translation: 公开了一种处理芯片封装的方法。 处理芯片封装的方法包括以下步骤：（a）在具有要安装在基板上的多个芯片的基板部分的底表面上形成剥离材料层; （b）在所述基板部的上表面上加工透镜部; 和（c）使用激光束完全切割衬底。 （附图标记）（AA）开始; （BB）结束; （S100）在基板部的底面上形成剥离材料层的工序; （S200）在基板部的上表面上加工透镜部的工序; （S300）处理基板部的工序

公开(公告)号：KR1020150090494A

公开(公告)日：2015-08-06

申请号：KR1020140011200

申请日：2014-01-29

Applicant: (주)큐엠씨 ,  유병소

Inventor： 유병소 ,  장현삼 ,  이병식 ,  정홍진 ,  이형권 ,  김종수 ,  김정식 ,  정유석

IPC: H01L21/50 ,  H01L33/48

CPC classification number: H01L33/486 ,  H01L21/52 ,  H01L25/0753

Abstract: 대상물용융결합장치가개시되며, 상기대상물용융결합장치는, 대상물용융결합장치는, 대상물에서기판과상기기판상의칩을용융결합시키는대상물용융결합장치에있어서, 복수개의온도영역을형성하는히팅유닛; 상기대상물이상기복수개의온도영역을순차적으로통과하도록상기대상물을이송시키는이송유닛; 및상기복수개의온도영역중 하나이상의온도영역에서상기칩을하측방향으로가압할수 있도록구비되는누름지지유닛을포함한다.

Abstract translation: 公开了一种物体共晶接合装置。 用于将基板和基板的芯片组合在一个物体中的物体共晶接合装置包括：形成温度区域的加热单元; 允许对象连续通过温度区域的传送单元; 以及压力支撑单元，其在至少一个温度区域中向下加压所述芯片。