Abstract:
A block copolymer is provided. According to an embodiment of the present invention, the block copolymer comprises a first block represented by the following formula 1 and a second block represented by the following formula 2. COM1 and COM2 are independently selected from a group including polystyrene, polymethylmethacrylate, polyethylene oxide, polyvinyl pyridine, polydimethylsiloxane, polyferrocenyldimethylsilane and polyisoprene, R1 is hydrogen or an alkyl group having 1 to 10 carbon atoms, x is 10 to 500, a is 1 to 50, R2 is hydrogen or an alkyl group having 1 to 10 carbon atoms, y is 10 to 500, and b is 1 to 50.
Abstract:
Provided is a method for manufacturing a nanostructure. The method for manufacturing a nanostructure according to an embodiment of the present invention comprises the steps of forming a first thin film comprising a first block copolymer on a substrate; forming guide patterns on the first thin film; forming a second thin film including a second block copolymer between the guide patterns; and curing the second thin film, wherein the first block copolymer has a cylindrical shape, and the second block copolymer has a lamellar shape.
Abstract:
PURPOSE: Block copolymer and a pattern forming method using the same are provided to implement the vertical orientation of the block copolymer and pattern small sized areas based on chemical bonds to the surface of a substrate. CONSTITUTION: A pattern forming method is based on ketene-based random copolymer and block copolymer. The method includes the following: the ketene-based random copolymer is applied on a substrate; the ultraviolet ray treatment or thermal treatment is applied to the ketene-based random copolymer; block copolymer is applied on the ketene-based random copolymer; the ultraviolet ray treatment or thermal treatment is applied to the block copolymer; a part of the block copolymer is etched. The ketene-based random copolymer is represented by chemical formula 2.
Abstract:
PURPOSE: A negative-tone electron beam lithography resist composition is provided to be economically manufactured, to easily control a crosslinked part by controlling a synthesis ratio, to easily control the thickness of the electron beam resist, and to be applied to a lithography process. CONSTITUTION: A negative-tone electron beam lithography resist composition includes a polystyrene random copolymer including an azide functional group. The dose of the electron beam resist is 40 μC/cm^2 - 116 μC/cm^2. The polystyrene random copolymer is synthesized by polymerizing a styrene monomer and 1-(chloromethyl)-4-vinylbenzene through a RAFT(reversible addition-fragmentation chain transfer) method.
Abstract translation:目的:为了经济地制造负色电子束光刻抗蚀剂组合物,通过控制合成比容易控制交联部分,容易控制电子束抗蚀剂的厚度,并适用于光刻工艺。 构成:负电子束光刻抗蚀剂组合物包括包含叠氮官能团的聚苯乙烯无规共聚物。 电子束抗蚀剂的剂量为40μC/ cm 2〜116μC/ cm ^ 2。 聚苯乙烯无规共聚物是通过RAFT(可逆加成 - 断裂链转移)法聚合苯乙烯单体和1-(氯甲基)-4-乙烯基苯来合成的。
Abstract:
발광다이오드 제조방법 및 이에 의해 제조되는 발광다이오드가 개시된다. 본 발명에 따른 발광다이오드 제조방법의 일 실시예는 기판의 상면에 고분자층을 형성하고, 고분자층의 상면에 복수의 비드를 도포한다. 그리고 고분자층을 유리전이온도 이상으로 가열하여, 비드의 일부분을 고분자층에 침전시킨다. 본 발명에 따른 발광다이오드 제조방법의 다른 실시예는 기판의 상면에 고분자층을 형성하고, 고분자층의 상면에 복수의 비드를 도포한다. 그리고 비드가 식각되는 속도보다 고분자층이 식각되는 속도가 큰 식각가스를 이용하여, 비드, 고분자층 및 기판의 상면을 건식식각한다. 본 발명에 따르면, 식각 공정이 없이 또는 식각 공정이 있더라도 사진식각 공정이 없이 굴곡 있는 패턴을 가진 발광다이오드를 제조할 수 있어 시간과 비용을 크게 절감할 수 있다. LED, 외부광추출효율, 내부 전반사, 유리전이온도, 고분자