Abstract:
PURPOSE: An image generating method, a substrate inspecting method, and a recording media and a substrate inspecting device for performing the image generating method and the substrate inspecting method are provided to reduce the number of intention failure wrongly detected and to detect actual failure. CONSTITUTION: An image generating method having a filter image generating process is as follows. A pixel value of a pixel positioned on the circumference of a circle having a central position of recorded images as a center is converted into a maximum value among the pixel values of a plurality of pixels selected from the pixels positioned on the circumference so that filter images are generated(S14). Position coordinates of the pixel of the recorded images are converted into polar coordinates so that converted images are generated. Maximum data indicating a relation of the maximum value among the pixel values and the diameter of the circle is generated based on the converted images. [Reference numerals] (AA) Start; (BB) Decision process; (CC,DD) Decided that defects are existed on a substrate; (EE) Finish; (S11) Synthetic image process; (S12) Converted image process; (S13) Data process; (S14) Filter image process; (S15) Object image process; (S16) Elimination image process; (S17) Whether or not a pixel value of one pixel is larger than a criterion?
Abstract:
When defects of a substrate are inspected, the setting of an optimal photographing condition is performed without preparing a recipe in advance. A method for inspecting the defects of a substrate based on a substrate image photographed by a photographing device photographs a wafer which is an object to be photographed in constant photographing conditions, extracts the mode of a pixel value of the substrate image photographed, and calculates a correction value of the photographing conditions based on the extracted pixel value and predetermined photographing condition correction data. The method for inspecting the defects of a substrate photographs the substrate of the object to be photographed again in photographing conditions after changing the object by changing the photographing conditions and inspects the defects of the substrate based on a substrate image photographed in the photographing conditions after changing the object.