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公开(公告)号:KR101751551B1
公开(公告)日:2017-06-27
申请号:KR1020120123696
申请日:2012-11-02
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/02
CPC classification number: H01L21/67046 , H01L21/67173 , H01L21/67178 , H01L21/6719 , H01L21/67213 , H01L21/67253 , H01L21/67748 , H01L21/6875
Abstract: 노광전에기판의이면세정을행하는기능을구비한기판처리시스템에있어서, 기판반송의부하를저감시키고처리유닛의구성을변경하는일 없이풋 프린트를작게한다. 도포현상처리시스템의인터페이스스테이션(5)은웨이퍼를노광장치에반입하기전에적어도웨이퍼의이면을세정하는웨이퍼세정부(141)와, 세정후의웨이퍼의이면에대해서, 당해웨이퍼의노광이가능한지여부를노광장치에반입전에검사하는웨이퍼검사부(142)와, 웨이퍼세정부(141)와웨이퍼검사부(142) 사이에서웨이퍼(W)를반송하는반송수단(143)을갖고있다. 웨이퍼세정부(141), 웨이퍼검사부(142) 및반송수단(143)은, 하우징(140)의내부에설치되어있고세정유닛(100)과검사유닛(101)은인터페이스스테이션(5)의정면측에, 상하방향으로다단으로설치되고, 웨이퍼반송기구(120)는세정유닛(100) 및검사유닛(101)에인접한영역에형성되어있다.
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公开(公告)号:KR1020130049747A
公开(公告)日:2013-05-14
申请号:KR1020120123696
申请日:2012-11-02
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/02
CPC classification number: H01L21/67046 , H01L21/67173 , H01L21/67178 , H01L21/6719 , H01L21/67213 , H01L21/67253 , H01L21/67748 , H01L21/6875
Abstract: PURPOSE: A substrate processing system, a substrate transferring method, and a computer storage medium are provided to reduce a footprint by decreasing the number of wafer transferring processes. CONSTITUTION: A wafer cleaning unit(141) cleans the rear of a wafer before the wafer is inputted. A wafer inspecting unit(142) inspects whether to expose the wafer before the wafer is inputted to an exposing device. A transferring device(143) transfers the wafer. The wafer cleaning unit and the wafer inspecting unit are formed on the front of an interface station.
Abstract translation: 目的:提供基板处理系统,基板转印方法和计算机存储介质,通过减少晶片转印工艺的数量来减少占用面积。 构成:在晶片输入之前,晶片清洁单元(141)清洁晶片的后部。 晶片检查单元(142)在将晶片输入到曝光装置之前检查是否暴露晶片。 传送装置(143)传送晶片。 晶片清洁单元和晶片检查单元形成在界面站的前面。
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