Abstract:
The objective of the present invention is to provide a method for adjusting the position of substrate transfer which can adjust a transfer position without using a control jig. The present invention provides a method for adjusting the position of substrate transfer which includes a first detection step of holding a substrate by a substrate transfer part which transfers the substrate and detecting the position of the substrate, a step of transferring the substrate held by the substrate transfer part to a substrate rotation part which holds the substrate to rotate, a step of allowing the substrate rotation part to rotate the substrate held by the substrate rotation part with a preset angle, a step of receiving the substrate rotated by the substrate rotation part from the substrate rotation part, a second detection step of detecting the position of the substrate received by the substrate transfer part, a step of finding the rotation center position of the substrate rotation part based on the position of the substrate obtained by the first detection step and the position of the substrate obtained by the second detection step, and a step of adjusting the position of the substrate transfer part based on the rotation center position found.
Abstract:
PURPOSE: A substrate processing system, a substrate transferring method, and a computer storage medium are provided to reduce a footprint by decreasing the number of wafer transferring processes. CONSTITUTION: A wafer cleaning unit(141) cleans the rear of a wafer before the wafer is inputted. A wafer inspecting unit(142) inspects whether to expose the wafer before the wafer is inputted to an exposing device. A transferring device(143) transfers the wafer. The wafer cleaning unit and the wafer inspecting unit are formed on the front of an interface station.
Abstract:
PURPOSE: A substrate processing system, a substrate processing method for the same and a computer storage medium thereof are provided to easily change a configuration by installing a transport block closely to a wafer transferring apparatus. CONSTITUTION: A process station(3) installs processing units in the upper and the lower direction. A cassette mounting table(12) loads a cassette for accommodating wafers. A wafer transfer device(21) is arranged between the process station and the cassette mounting table. A transport block(22) installs transfer units in multi-stages. The wafer transfer device includes a first transfer arm and a second transfer arm.
Abstract:
본 발명의 과제는 기판 처리 시스템의 풋프린트를 작게 하는 것이다. 복수의 처리 유닛이 상하 방향으로 다단으로 설치된 처리 스테이션(3)과, 복수매의 웨이퍼(W)를 수용하는 카세트를 적재하는 카세트 적재대(12)와, 처리 스테이션(3)과 카세트 적재대(12) 사이에 배치된 웨이퍼 반송 기구(21)를 구비한 기판 처리 시스템(1)에 있어서, 처리 스테이션(3)과 웨이퍼 반송 기구(21) 사이에는 카세트 적재대(12)와 처리 스테이션(3) 사이에서 반송되는 웨이퍼 및 각 처리 유닛의 각 단 사이에서 반송되는 기판을 일시적으로 수용하는 복수의 전달 유닛이 다단으로 설치된 전달 블록(22)이 배치되어 있다. 웨이퍼 반송 기구(21)는 카세트 적재대(12)와 전달 블록(22) 사이에서 웨이퍼를 반송하는 제1 반송 아암과, 전달 유닛의 각 단 사이에서 웨이퍼를 반송하는 제2 반송 아암을 구비하고 있다.