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公开(公告)号:KR1020140065343A
公开(公告)日:2014-05-29
申请号:KR1020130140482
申请日:2013-11-19
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
CPC classification number: H01L21/67051 , H01L21/68735
Abstract: A substrate processing device prevents mist of a processing solution scattered from a wafer from returning to the wafer. The substrate processing device includes a rotary cup (20) surrounding a substrate (W) held in a substrate holding part (10), rotating with the substrate holding part, and guiding the processing solution scattered from the rotating substrate and a spinless outer cup (31) installed having a gap around the rotary cup and an inner space receiving the processing solution guided by the rotary cup. The height of the top of the rotary cup is higher than the height of the top of the outer cup. An outer protrusion (20c), extended in a circumferential direction and protruding toward an outer side of a radius direction of the rotary cup, is installed on an upper part of an outer surface of the rotary cup. The outer protrusion blocks the mist of the processing solution spattered from the gap of the outer cup to an upper part of the substrate.
Abstract translation: 基板处理装置防止从晶片散射的处理溶液的雾返回到晶片。 基板处理装置包括旋转杯(20),其包围保持在基板保持部(10)中的基板(W),与基板保持部旋转,并且引导从旋转基板散射的处理液和无旋转外杯 31),其具有围绕旋转杯的间隙和容纳由旋转杯引导的处理溶液的内部空间。 旋转杯顶部的高度高于外杯顶部的高度。 在旋转杯的外表面的上部安装有沿圆周方向延伸并朝向旋转杯的半径方向的外侧突出的外突出部(20c)。 外部突起阻挡从外杯的间隙溅射到基底的上部的处理溶液的雾。
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公开(公告)号:KR101934924B1
公开(公告)日:2019-01-03
申请号:KR1020130140482
申请日:2013-11-19
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
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