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    하드 마스크 트리밍에 의한 기판 프로세싱 방법 및 기판 처리 프로세싱 시스템
    1.
    发明公开
    하드 마스크 트리밍에 의한 기판 프로세싱 방법 및 기판 처리 프로세싱 시스템 有权
    操作化学氧化物去除系统的方法

    公开(公告)号：KR1020060113688A

    公开(公告)日：2006-11-02

    申请号：KR1020067008420

    申请日：2004-11-03

    Applicant: 도쿄엘렉트론가부시키가이샤

    Inventor： 토모야스마사유키 ,  펑크메리트레인 ,  핀토케빈오거스틴 ,  오다기리마사야 ,  천레무엘 ,  야마시타아사오 ,  이와미아키라 ,  타카하시히로유키

    IPC: H01L21/02

    CPC classification number: H01L21/67253 ,  C23C16/4405 ,  C25D11/02 ,  H01L21/0337 ,  H01L21/31116 ,  H01L21/67069 ,  H01L21/67155 ,  H01L21/67207 ,  H01L21/67248 ,  H01L22/20

    Abstract: A processing system and method for chemical oxide removal (COR) is presented, wherein the processing system comprises a first treatment chamber and a second treatment chamber, wherein the first and second treatment chambers are coupled to one another. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate is exposed to a gaseous chemistry, such as HF/NH3, under controlled conditions including surface temperature and gas pressure. The second treatment chamber comprises a heat treatment chamber that provides a temperature controlled chamber, thermally insulated from the chemical treatment chamber. The heat treatment chamber provides a substrate holder for controlling the temperature of the substrate to thermally process the chemically treated surfaces on the substrate.

    Abstract translation: 提出了一种用于化学氧化物去除（COR）的处理系统和方法，其中处理系统包括第一处理室和第二处理室，其中第一和第二处理室彼此耦合。 第一处理室包括提供温度控制室的化学处理室和用于支撑用于化学处理的基板的独立温度控制的基板保持器。 在包括表面温度和气体压力的受控条件下，将基底暴露于气态化学物质，例如HF / NH 3。 第二处理室包括热处理室，其提供与化学处理室热绝缘的温度控制室。 热处理室提供用于控制基板的温度以热处理基板上化学处理的表面的基板保持器。

    기판 처리 방법
    2.
    发明公开
    기판 처리 방법 有权
    기판처리방법

    公开(公告)号：KR1020070032690A

    公开(公告)日：2007-03-22

    申请号：KR1020067026275

    申请日：2005-05-17

    Applicant: 도쿄엘렉트론가부시키가이샤 ,  인터내셔널 비지네스 머신즈 코포레이션

    Inventor： 펑크메리트 ,  핀토케빈오거스틴 ,  야마시타아사오 ,  네슬레웨슬리

    IPC: G05B19/418

    CPC classification number: H01L22/20 ,  H01L21/67248 ,  H01L21/67253 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A processing method of processing a substrate is presented that includes: receiving pre-process data, wherein the pre-process data comprises a desired process result and actual measured data for the substrate; determining a required process result, wherein the required process result comprises the difference between the desired process result and the actual measured data; creating a new process recipe by modifying a nominal recipe obtained from a processing tool using at least one of a static recipe and a formula model, wherein the new process recipe provides a new process result that is approximately equal to the required process result; and sending the new process recipe to the processing tool and the substrate.

    Abstract translation: 提出了一种处理基板的处理方法，其包括：接收预处理数据，其中预处理数据包括期望的处理结果和用于基板的实际测量数据; 确定需要的处理结果，其中所需的处理结果包括期望处理结果与实际测量数据之间的差异; 通过使用静态配方和公式模型中的至少一个修改从处理工具获得的名义配方来创建新工艺配方，其中新工艺配方提供近似等于所需处理结果的新处理结果; 并将新的工艺配方发送到处理工具和基板。

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