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公开(公告)号：KR1020150042734A
公开(公告)日：2015-04-21
申请号：KR1020140136659
申请日：2014-10-10
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/677 , H01L21/78
CPC classification number: B32B38/18 , B32B38/10 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , Y10T156/1132 , Y10T156/1168 , Y10T156/1944 , Y10T156/1967 , Y10T156/1994 , H01L21/67712
Abstract: [과제] 피처리기판과지지기판의박리처리를효율적으로행한다. [해결수단] 박리장치는, 중첩기판중 지지기판을유지하는제1 유지부와, 중첩기판중 피처리기판을유지하는제2 유지부와, 제1 유지부의외주부의일부를제2 유지부로부터분리하는방향으로이동시키는이동부를갖는다. 제1 유지부는, 이동부에접속되는판형의탄성부재와, 탄성부재에설치되고, 지지기판을흡착하는복수의흡착부를갖는다. 복수의흡착부중, 박리의기점이되는지지기판(S)의외주부를흡착하는외주흡착부(53)는, 지지기판(S)의흡착면(521a)이개구되어중공부(521b)가형성된패드부재(521)와, 패드부재(521)의중공부(521b)에감입하여설치되고, 패드부재(521)보다높은경도를갖는서포트부재(522)를갖는다.
Abstract translation: [主题]对被处理基板和支撑基板进行有效的剥离处理。 [解决方案]剥离装置包括：第一维护部件，用于将支撑基板保持在叠置的基板之间; 第二维护部件，用于将处理过的基板保持在叠加的基板之间; 以及移动部件，用于使第一维护部件的外周的一部分沿与第二维修部分分离的方向移动。 第一维护部件包括：连接到移动部件的平面弹性部件; 以及多个吸附部，安装在弹性部件上以吸附支撑基板。 在多个吸附部之间吸附作为剥离开始点的支承基板（S）的圆周部的圆周吸附部（53）通过嵌入形成中空部（521b）的垫部（521a）而被安装 ），其中所述支撑基板（S）的吸附表面（521a）打开并且在衬垫构件（521）的中空部分（521b）中，并且具有硬度高于所述衬垫构件的支撑构件（522） 521）。
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公开(公告)号：KR102225474B1
公开(公告)日：2021-03-08
申请号：KR1020140136659
申请日：2014-10-10
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/677 , H01L21/78
Abstract: [과제] 피처리기판과지지기판의박리처리를효율적으로행한다. [해결수단] 박리장치는, 중첩기판중 지지기판을유지하는제1 유지부와, 중첩기판중 피처리기판을유지하는제2 유지부와, 제1 유지부의외주부의일부를제2 유지부로부터분리하는방향으로이동시키는이동부를갖는다. 제1 유지부는, 이동부에접속되는판형의탄성부재와, 탄성부재에설치되고, 지지기판을흡착하는복수의흡착부를갖는다. 복수의흡착부중, 박리의기점이되는지지기판(S)의외주부를흡착하는외주흡착부(53)는, 지지기판(S)의흡착면(521a)이개구되어중공부(521b)가형성된패드부재(521)와, 패드부재(521)의중공부(521b)에감입하여설치되고, 패드부재(521)보다높은경도를갖는서포트부재(522)를갖는다.
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公开(公告)号：KR102007041B1
公开(公告)日：2019-08-02
申请号：KR1020130107163
申请日：2013-09-06
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/20
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公开(公告)号：KR1020140071900A
公开(公告)日：2014-06-12
申请号：KR1020130142084
申请日：2013-11-21
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/20
CPC classification number: B32B43/006 , B32B38/1858 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/6838 , Y10T156/1168 , Y10T156/19
Abstract: An object of the present invention is to promote efficiency of a peeling process. A peeling apparatus according to an embodiment of the present invention includes a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The second holding unit includes a first suction moving unit and a second suction moving unit. The first suction moving unit absorbs and moves a circumferential edge portion of the second substrate corresponding to the area formed by the peeling inducing unit, and moves in a direction of separating the circumferential edge portion from the surface of the first substrate. The second suction moving unit absorbs and moves a region which is closer to a central portion of the second substrate than to the circumferential edge portion of the second substrate, and moves in a direction of separating the region from the surface of the first substrate.
Abstract translation: 本发明的目的是提高剥离过程的效率。 根据本发明的实施例的剥离装置包括第一保持单元，第二保持单元和剥离诱导单元。 第一保持单元保持第一基板和第二基板接合的叠加基板的第一基板。 第二保持单元保持重叠基板的第二基板，并且使第二基板沿着从第一基板的表面分离第二基板的方向移动。 剥离诱导单元形成第二基板在叠加基板的侧表面上开始从第一基板剥离的区域。 第二保持单元包括第一抽吸移动单元和第二抽吸移动单元。 第一抽吸移动单元吸收并移动与由剥离诱导单元形成的区域相对应的第二基板的周边边缘部分，并沿着从第一基板的表面分离圆周边缘部分的方向移动。 第二抽吸移动单元吸收并移动比第二基板的周缘部靠近第二基板的中央部的区域，并且沿着与第一基板的表面分离该区域的方向移动。
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公开(公告)号：KR101900113B1
公开(公告)日：2018-09-18
申请号：KR1020130142044
申请日：2013-11-21
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/20 , H01L21/304
CPC classification number: B32B43/006 , B32B38/1858 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/6715 , Y10T156/1168 , Y10T156/1961
Abstract: 본발명은박리처리의효율화를도모하는것을목적으로한다. 실시형태에따른박리장치는, 제1 유지부와, 제2 유지부와, 박리유인부를구비한다. 제1 유지부는, 제1 기판과제2 기판이접합된중합기판중 제1 기판을유지한다. 제2 유지부는, 중합기판중 제2 기판을유지하고, 제2 기판을제1 기판의판면으로부터분리하는방향으로이동시킨다. 박리유인부는, 제2 기판이제1 기판으로부터박리되는시초가되는부위를중합기판의측면에형성한다. 또, 박리유인부는, 예리부재와, 중합기판의측면중, 제2 기판에서의제1 기판과제2 기판의접합부분근처의측면을향해서예리부재를이동시키는이동기구를구비한다.
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Patent Agency Ranking
公开(公告)号：KR1020140071898A
公开(公告)日：2014-06-12
申请号：KR1020130142044
申请日：2013-11-21
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/20 , H01L21/304
CPC classification number: B32B43/006 , B32B38/1858 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/6715 , Y10T156/1168 , Y10T156/1961
Abstract: The present invention is to promote efficiency of a peeling apparatus. The peeling apparatus according to an embodiment comprises a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a polymerized substrate in which the first substrate and the second substrate are bonded. The second holding unit holds the second substrate of the polymerized substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the polymerized substrate. The peeling inducing unit also comprises a sharpening member and a moving member for moving the sharpening member toward the side surface close to a joining portion of the second substrate and the first substrate on the second substrate of the polymerized substrate.
Abstract translation: 本发明是为了提高剥离装置的效率。 根据实施例的剥离装置包括第一保持单元，第二保持单元和剥离诱导单元。 第一保持单元保持第一基板和第二基板接合的聚合基板的第一基板。 第二保持单元保持聚合基板的第二基板，并使第二基板沿着从第一基板的表面分离第二基板的方向移动。 剥离诱导单元在聚合基板的侧面形成第二基板开始从第一基板剥离的区域。 剥离诱导单元还包括磨削构件和移动构件，用于使磨碎构件朝向接近第二基板的接合部分的侧表面移动，并且使聚合基板的第二基板上的第一基板移动。
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公开(公告)号：KR1020090013732A
公开(公告)日：2009-02-05
申请号：KR1020080075660
申请日：2008-08-01
Applicant: 도쿄엘렉트론가부시키가이샤
Inventor： 혼다마사루
IPC: H01L21/677 , C23C14/56 , B65G49/06 , G02F1/13
CPC classification number: H01L21/67706 , B65G49/063 , C23C14/564 , G02F1/1303 , H01L21/68714 , H01L21/68742
Abstract: A substrate support mechanism is provided to maintain constant temperature of the substrate to be processed while reducing interference form temperature around a support pin. A substrate support mechanism mounts the substrate to be processed and support it by the end of the support pin. The electricity support pin(128) is comprised of the whole of a hollow and the end of it is blocked. A ventilation opening(128c) is installed in the side wall of the electricity support pin. The inner temperature of the partition member is controlled by flowing a predetermined gas through a ventilation opening. For this, the gas supply part or the vacuum source is connected to the base end of the partition member.
Abstract translation: 提供了一种基板支撑机构，用于保持要处理的基板的恒定温度，同时减少支撑销周围的干涉形式温度。 基板支撑机构安装待加工的基板并将其支撑在支撑销的端部。 电支撑销（128）由整个中空部分组成，其端部被阻塞。 通风口（128c）安装在电力支撑销的侧壁上。 分隔构件的内部温度通过使预定气体流过通风口来控制。 为此，气体供给部或真空源与分隔部件的基端连接。
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公开(公告)号：KR101922262B1
公开(公告)日：2018-11-26
申请号：KR1020130142084
申请日：2013-11-21
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/20
CPC classification number: B32B43/006 , B32B38/1858 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/6838 , Y10T156/1168 , Y10T156/19
Abstract: 본발명은박리처리의효율화를도모하는것을목적으로한다. 실시형태에따른박리장치는, 제1 유지부와, 제2 유지부와, 박리유인부를구비한다. 제1 유지부는, 제1 기판과제2 기판이접합된중합기판중 제1 기판을유지한다. 제2 유지부는, 중합기판중 제2 기판을유지하고, 제2 기판을제1 기판의판면으로부터분리하는방향으로이동시킨다. 박리유인부는, 제2 기판이제1 기판으로부터박리되는시초가되는부위를중합기판의측면에형성한다. 또, 제2 유지부는, 제1 흡착이동부와, 제2 흡착이동부를구비한다. 제1 흡착이동부는, 박리유인부에의해형성되는부위에대응하는제2 기판의둘레가장자리부를흡착하고, 그둘레가장자리부를제1 기판의판변으로부터분리하는방향으로이동시킨다. 제2 흡착이동부는, 제2 기판의둘레가장자리부보다제2 기판의중앙부근처의영역을흡착하고, 그영역을제1 기판의판면으로부터분리하는방향으로이동시킨다.
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公开(公告)号：KR1020170088764A
公开(公告)日：2017-08-02
申请号：KR1020170009877
申请日：2017-01-20
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/683 , H01L21/02 , H01L21/677 , H01L21/66 , H01L21/67 , H01L33/00
Abstract: 접착테이프또는접착제를개재하여피처리기판과지지기판을접합한후, 접합된중합기판에대해행하는자외선처리를효율적으로행한다. 자외선처리장치(42)는, 중합기판(T) 중피처리기판을보유지지하는기판보유지지부와, 자외선을조사하는복수의 LED를구비한자외선조사부(150)와, 자외선조사부(150)의하방에설치되고, 당해자외선조사부(150)를촬상하여복수의 LED의점등을검사하는점등검사부(160)와, 자외선조사부(150)의하방과, 당해자외선조사부(150)의외측사이에서, 기판보유지지부를이동시키는제1 구동부(130) 및제1 아암(131)을갖는다. 자외선조사부(150)는기판보유지지부에보유지지된중합기판(T)에대해, 지지기판측으로부터접착테이프또는접착제를향해자외선을조사한다.
Abstract translation: 经由粘合带或粘合到衬底和支撑衬底之后执行通过聚合有效地进行键合衬底上的UV处理的。 UV处理装置42，聚合物基材（T）和用于保持所述间皮基板，具有多个LED照射的紫外线照射部150的紫外线的基片保持部上，UV照射150乌伊哈岛室 被提供，本领域技术用UV光检测单元160，用于通过成像的照射部150中，UV照射150乌伊哈岛室，在本领域紫外线照射单元150向意想不到侧之间，基片保持部中检查等多个LED uijeom的 以及用于移动第一驱动单元130和第一驱动单元130的第一臂131。 紫外线照射单元150将紫外线朝向粘合带或粘合剂从支撑衬底侧照射到由衬底保持单元保持的聚合衬底T.
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公开(公告)号：KR1020140037756A
公开(公告)日：2014-03-27
申请号：KR1020130107163
申请日：2013-09-06
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/20
CPC classification number: B32B43/006 , B32B38/1858 , B32B2309/10 , B32B2457/14 , H01L21/304 , H01L21/67092 , H01L21/76254 , Y10T156/11 , Y10T156/1967
Abstract: The present invention aims the efficiency of peeling processing as its purpose. A peeing device according to an embodiment includes a first maintaining part, a cutting part, a measurement part, and a position adjusting part. The first maintaining part maintains a first substrate among polymerizing substrates attached to the first substrate and a second substrate. The cutting part cuts an attachment part of the first and second substrates. The measurement part measures a distance from a set measurement reference position to a maintenance surface of the first maintaining part or a distance to an object placed between the reference position and the maintenance surface. The position adjusting part adjusts a cut part of the cutting part based on the measurement result and information about the thickness of the attachment substrate.
Abstract translation: 本发明的目的在于提供剥离处理的效率。 根据实施例的排尿装置包括第一保持部，切割部，测量部和位置调整部。 第一维持部件在连接到第一基板的聚合基板和第二基板之间保持第一基板。 切割部分切割第一和第二基底的附接部分。 测量部件测量从设定的测量参考位置到第一维护部件的维护表面的距离或者到放置在参考位置和维护表面之间的物体的距离。 位置调整部基于测定结果和关于安装基板的厚度的信息来调整切断部的切断部。
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