公开(公告)号：KR1020110053174A

公开(公告)日：2011-05-19

申请号：KR1020100102222

申请日：2010-10-20

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 야마다요시아키 ,  야마모토유이치 ,  고스기히토시 ,  후지모토세이지

IPC: H01L21/027 ,  H01L21/68

CPC classification number: H01L21/67109 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/0274 ,  G03F7/202 ,  G03F7/70891 ,  H01L21/681

Abstract: PURPOSE: A photoresist coating and developing device, a substrate transferring method, and an interface device are provided to implement high throughput and high pattern accuracy by raising the temperature of a wafer before the wafer is inputted into a loadlock chamber. CONSTITUTION: A photoresist layer forming unit forms a photoresist layer on a substrate. A heating processing unit heats the substrate with the photoresist layer. A cooling unit cools the substrate which is heated by the heating processing unit and has the photoresist layer to room temperature. A heating unit(61) heats the cooled substrate with a preset temperature. A loadlock chamber(L1) discharges a substrate for exposing the photoresist layer under the pressure reduction. A transfer unit(62) transfers the substrate from the heating unit to the loadlock chamber.

Abstract translation: 目的：提供光致抗蚀剂涂层显影装置，基板转印方法和界面装置，以在将晶片输入到装载锁定室之前提高晶片的温度来实现高通量和高图案精度。 构成：光致抗蚀剂层形成单元在基板上形成光致抗蚀剂层。 加热处理单元用光致抗蚀剂层加热基板。 冷却单元冷却由加热处理单元加热的基板，并使光致抗蚀剂层达到室温。 加热单元（61）以预设温度加热冷却的基板。 负载锁定室（L1）在减压下放电用于暴露光致抗蚀剂层的基板。 传送单元（62）将基板从加热单元传送到负载锁定室。

公开(公告)号：KR101578412B1

公开(公告)日：2015-12-17

申请号：KR1020100102222

申请日：2010-10-20

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 야마다요시아키 ,  야마모토유이치 ,  고스기히토시 ,  후지모토세이지

IPC: H01L21/027 ,  H01L21/68

CPC classification number: H01L21/67109 ,  H01L21/67196 ,  H01L21/67201

Abstract: 포토레지스트도포현상장치로부터노광장치로로드록장치를개재하여반송할때에, 웨이퍼온도의변화를저감시킬수 있는포토레지스트도포현상장치를제공한다. 개시되는포토레지스트도포현상장치(1)는기판에포토레지스트막을형성하는포토레지스트막형성부와, 포토레지스트막형성부에서포토레지스트막이형성된기판을가열하는가열처리부와, 가열처리부에서가열되고포토레지스트막이형성된기판을상온으로냉각하는냉각부와, 냉각부에서상온으로냉각된기판을소정의온도로가열하는가열부(61)와, 포토레지스트막의노광을위하여기판을감압하에서반출하는로드록실(L1)과, 가열부(61)로부터로드록실(L1)로기판을반송하는반송부(62)를구비한다.