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公开(公告)号：KR1020020081118A
公开(公告)日：2002-10-26
申请号：KR1020020020704
申请日：2002-04-16
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/00
CPC classification number: H01L21/67178 , G03F7/162 , G03F7/3021 , H01L21/67069
Abstract: PURPOSE: To form a uniform air flow within the surface of a wafer in a chamber at the time of evacuating the chamber by exhausting the chamber. CONSTITUTION: The chamber 60 which can house and tightly seal the wafer W is made of a disk-shaped placing base 61 and a vertically movable cap 62. On the top of the cap 62, an exhaust pipe 67 is provided to evacuate the chamber 60. On the inside of the cap 62, is addition, a disk-shaped flow straightening plate 72 is provided. The lower surface of the plate 72 is flattened and supporting members 73 are attached to the lower surface so that the plate 72 may be placed on the placing base 61 in parallel with the upper surface of the base 61 through the members 73. The outside diameter of the flow straightening plate 72 is made a little larger than the inside diameter of the lid 62 and a plurality of vents 74 is provided in the peripheral section of the plate 72. When the chamber 60 is evacuated, the air flow flows uniformly to the peripheral section of the wafer W from the center of the surface of the wafer W.
Abstract translation: 目的：在通过排出腔室排空室时，在室内的晶片表面内形成均匀的气流。 构成：可以容纳并密封晶片W的室60由盘形放置基座61和可垂直移动的盖62制成。在盖62的顶部设置排气管67以将腔室60 另外，在盖62的内侧设有盘状的流动矫正板72。 板72的下表面变平，并且支撑构件73附接到下表面，使得板72可以通过构件73与基座61的上表面平行地放置在放置基座61上。外径 流动矫直板72的尺寸略大于盖62的内径，并且在板72的周边部分设置有多个通风口74.当室60抽空时，空气流均匀流动到 从晶片W的表面的中心的晶片W的周边部分。
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公开(公告)号：KR101605923B1
公开(公告)日：2016-03-23
申请号：KR1020110036902
申请日：2011-04-20
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
CPC classification number: H01L21/67253 , H01L21/6715
Abstract: 본발명은처리액노즐로부터의처리액의토출의유무및 처리액노즐로부터토출되는처리액의토출상태의변화의유무를정확하게판정할수 있는액 처리장치를제공하는것을과제로한다. 기판(W)의표면에, 처리액공급부(7)로부터도포액(R)을공급하여기판의표면을향해토출시켜액 처리를하는액 처리장치에있어서, 처리액의유로(10e)를형성한노즐(10)과, 노즐의선단부(10d)로부터기판표면(W1) 사이의영역에광(L)을조사하는광원(110)과, 노즐과기판표면사이의영역을촬상하는촬상부(17)와, 노즐로부터기판을향해처리액을토출하기위한토출신호를출력하고촬상부에의해촬상을개시시키는제어부(9a)와, 기판을향해토출되는처리액내에광이입사되어처리액에반사되었을때의광의명암을촬상하는촬상결과에기초하여식별함으로써, 노즐로부터의처리액의토출의유무및 노즐로부터토출되는처리액의토출상태의변화의유무를판정하는판정부(9b)를구비한다.
Abstract translation: 本发明将是零，并且，提供一种能够准确地确定存在或不存在于从处理液喷嘴喷出的处理液的排出状态变化，和处理液喷嘴robuteoui处理液的喷出的存在或不存在液体处理装置。 一种液体处理装置，用于从处理液供给单元（7）向基板（W）的表面供给涂敷液（R），并且将液体喷射到基板的表面上以执行液体处理， 用于将光L照射到喷嘴的顶端10d和基板表面W1之间的区域的光源110和用于对喷嘴和基板表面之间的区域进行成像的成像单元17， 并且，当放电信号的输出用于排出朝向从喷嘴向基板的处理液，和所述光进入处理液向基板和所述控制部（9A）喷出，用于启动由所述图像拾取部分的图像拾取反映在处理溶液 并且确定是否有从喷嘴排出的处理液以及从喷嘴排出的处理液的排出条件是否改变。
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Patent Agency Ranking
公开(公告)号：KR100798659B1
公开(公告)日：2008-01-29
申请号：KR1020020020704
申请日：2002-04-16
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/00
CPC classification number: H01L21/67178 , G03F7/162 , G03F7/3021 , H01L21/67069
Abstract: 본 발명은 기판을 처리하는 처리장치에 관한 것으로서, 기판을 수용하고 기체가 통하지 않도록 폐쇄가능한 처리실을 형성하는 챔버와, 처리실의 분위기를 상기 챔버의 상부로부터 배기하여 처리실을 감압시키기 위한 배기부를 갖고 있다. 본 발명은 감압할 때에 처리실 내에 형성되는 기류를 제어하는 정류판을 갖고 챔버는 기판을 재치하는 재치대와, 재치대상의 기판을 상방에서 덮고 상기 재치대와 일체가 되게 처리실을 형성하는 하면이 개구된 대략 원통형상의 개체와, 정류판을 재치대에 대해 평행하게 되도록 지지하는 지지부재를 갖는다. 본 발명에 따르면 정류판과 기판간에 흐르는 기류의 속도가 기판면내에서 균일해지므로 기판상의 도포막을 건조시킬 때에 막두께가 균일하게 평탄해지는 기술이제시된다.
Abstract translation: 本发明具有涉及一种处理设备，用于处理衬底，其包括：容纳所述衬底和所述腔室，并从形成的可封闭的处理室中，使得所述气体通过所述腔室的部分排气进行减压处理室的上部排出处理室的气氛 。 开口时，本发明是当减压具有用于控制在工艺腔室所形成的腔室，以覆盖上述载置台的气流的整流板，和用于在上述的形成所述安装台与积分的安装衬底的安装目标基板是成为处理室 以及用于支撑整流板以与安装台平行的支撑构件。 在根据本发明通过当前板呈现，因此在基片平面均匀的涂膜厚度在基片之间流动的流量变得均匀时在衬底上的平面状的干燥技术膜。
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公开(公告)号：KR1020020081117A
公开(公告)日：2002-10-26
申请号：KR1020020020703
申请日：2002-04-16
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
CPC classification number: H01L21/6715 , B05D3/0466 , B05D3/0486 , G03F7/162
Abstract: PURPOSE: A method and system for processing substrate are provided to secure interface uniformity in the film thickness of an application film, even if the application processing of a wafer is performed by using the application liquid of high viscosity by the point which is the so-called 'one- stroke' writing. CONSTITUTION: A method and system for processing substrate comprises coating a coating solution on a surface of the substrate(w) while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution onto the substrate from the coating solution discharge nozzle, exposing the substrate to a solvent atmosphere of the coating solution after the step of coating, and reducing pressure inside a container in which the substrate is housed after the step of exposing.
Abstract translation: 目的：提供用于处理基板的方法和系统，以确保涂膜的膜厚度的界面均匀性，即使通过使用高粘度的涂布液进行晶片的涂布处理， 称为“中风”写作。 构成：用于处理基材的方法和系统包括在使涂布液排出喷嘴和基材相对移动并将涂布溶液从涂布液排出喷嘴排出到基板上的同时，在基材表面上涂布涂布液（w） 在涂布步骤之后，将基底涂布到涂布溶液的溶剂气氛中，并且在曝光步骤之后降低其中容纳基材的容器内的压力。
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公开(公告)号：KR1020130064691A
公开(公告)日：2013-06-18
申请号：KR1020120131164
申请日：2012-11-19
Applicant: 인텔 코포레이션 , 도쿄엘렉트론가부시키가이샤
IPC: H01L21/02 , H01L21/301
CPC classification number: B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/67051 , H01L21/67092 , H01L21/67288 , Y10T156/11 , Y10T156/1189 , Y10T156/19 , Y10T156/1972
Abstract: PURPOSE: A separation apparatus, a separation system, a separation method, and a computer storage medium are provided to easily delaminate an object substrate and a support substrate by using a transport device for moving a first and a second holding part in a horizontal direction. CONSTITUTION: A first holding part(110) maintains an object substrate(W). A second holding part(111) maintains a support substrate(S). A transport device(150) moves the second holding part and the support substrate in vertical and horizontal directions. The transport device includes a vertical transport part(151) and the horizontal transport part(152). A load measurement part(180) measures the load of the object substrate and the support substrate. A control part(350) controls the transport device based on the load measured by the load measurement part.
Abstract translation: 目的：提供分离装置，分离系统，分离方法和计算机存储介质，以通过使用用于沿水平方向移动第一和第二保持部分的传送装置来容易地分层对象基板和支撑基板。 构成：第一保持部（110）维持物体基板（W）。 第二保持部（111）保持支撑基板（S）。 运送装置（150）使第二保持部和支撑基板沿垂直方向和水平方向移动。 输送装置包括垂直输送部（151）和水平输送部（152）。 负载测量部分（180）测量对象基板和支撑基板的负载。 控制部（350）基于由负载测量部测量的负载来控制输送装置。
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公开(公告)号：KR1020110128231A
公开(公告)日：2011-11-29
申请号：KR1020110036902
申请日：2011-04-20
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
CPC classification number: H01L21/67253 , H01L21/6715 , H01L21/0274 , G03F7/16
Abstract: PURPOSE: A liquid processing apparatus is provided to improve the accuracy of image pickup by irradiating laser to an area between the end of a nozzle and a wafer surface. CONSTITUTION: A processing solution nozzle forms a flow path of process solutions. A light source irradiates light to an area between the leading tip(10d) of the nozzle and the substrate surface. An image pickup unit(17) picks up an area between the nozzle and the substrate surface. A control unit outputs a discharge signal for discharging the process solutions from the nozzle to the substrate and controls the image pickup unit. A determining unit determines the discharge variation of coating solutions from the nozzle based on the image process or process result of a camera.
Abstract translation: 目的：提供一种液体处理装置，通过对喷嘴的端部和晶片表面之间的区域照射激光来提高图像拾取的精度。 构成：处理溶液喷嘴形成工艺解决方案的流路。 光源将光照射到喷嘴的前端（10d）和基板表面之间的区域。 图像拾取单元（17）拾取喷嘴和基板表面之间的区域。 控制单元输出用于将处理液从喷嘴排出到基板的放电信号，并控制图像拾取单元。 确定单元基于相机的图像处理或处理结果确定来自喷嘴的涂布溶液的排出变化。
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公开(公告)号：KR100855364B1
公开(公告)日：2008-09-04
申请号：KR1020020020703
申请日：2002-04-16
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/027
CPC classification number: H01L21/6715 , B05D3/0466 , B05D3/0486 , G03F7/162
Abstract: 본 발명은 기판을 처리하는 처리방법에 관한 것으로, 도포액 토출노즐과 기판을 상대적으로 이동시키면서 노즐을 통해 기판상에 도포액을 토출하고 기판표면에 도포액을 도포하는 공정을 갖는다. 그 후 기판을 도포액의 용제분위기에 쬐거나 또는 용기내에서 일단 가압하고나서 기판이 수용된 용기내를 감압하여 기판상의 도포액을 건조시킨다. 본 발명에 따르면 제품화되지 않은 기판 주연부의 소위 엣지컷폭의 협소화를 도모하면서 도포막의 면내 균일성을 유지할 수 있는 처리방법이 제시된다.
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